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33 条记录 (耗时 0.049 秒)

    Electronic apparatus
    2.
    发明申请
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US20080150811A1

    公开(公告)日：2008-06-26

    申请号：US11902448

    申请日：2007-09-21

    申请人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    发明人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    IPC分类号： H01Q1/22

    CPC分类号： H01Q9/40 ,  H01Q9/42 ,  H01Q21/28 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/325 ,  H05K2201/048 ,  H05K2201/0999 ,  H05K2203/167

    摘要： An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.

    摘要翻译： 电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。

    Electronic apparatus
    4.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US08054240B2

    公开(公告)日：2011-11-08

    申请号：US11902448

    申请日：2007-09-21

    申请人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    发明人： Tomoko Honda ,  Nobuyoshi Kuroiwa ,  Masaomi Nakahata ,  Jun Morimoto ,  Satoru Honda ,  Yoshikazu Hata ,  Koichi Sato ,  Akihiro Tsujimura ,  Makoto Tabata ,  Minoru Sakurai ,  Shoji Kato

    IPC分类号： H01Q1/24 ,  H01Q1/40

    CPC分类号： H01Q9/40 ,  H01Q9/42 ,  H01Q21/28 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/325 ,  H05K2201/048 ,  H05K2201/0999 ,  H05K2203/167

    摘要： An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.

    摘要翻译： 电子设备包括：具有第一导电图案的壳体; 基板，其在其表面上设置有第一布线层并固定到所述壳体; 以及连接第一导电图案和第一布线层的第一导电构件。 第一导电图案延伸到壳体的外表面和内表面上。 第一导电构件与延伸到第一布线层的内表面和端部的第一导电图案的至少一部分中的每一个接触。 或者，电子设备包括：壳体，设置有导电图案，并且在其框架部分中具有通孔部分; 以及在其表面上设置有布线层并且具有突出部并固定到壳体的基板。 突出部分和贯穿部分是合适的。 导电图案延伸到壳体的外表面上并延伸到通孔的内表面上。 延伸到内表面上的至少一些导电图案与布线层的端部接触。

    MOBILE COMMUNICATION APPARATUS AND ANTENNA STRUCTURE
    10.
    发明申请
    MOBILE COMMUNICATION APPARATUS AND ANTENNA STRUCTURE 审中-公开
    移动通信装置和天线结构

    公开(公告)号：US20100255893A1

    公开(公告)日：2010-10-07

    申请号：US12693616

    申请日：2010-01-26

    申请人： Akio Ihara ,  Minoru Sakurai ,  Makoto Tabata

    发明人： Akio Ihara ,  Minoru Sakurai ,  Makoto Tabata

    IPC分类号： H04W88/02 ,  H01Q1/24

    CPC分类号： H01Q1/243 ,  H01Q21/28 ,  H04W88/02

    摘要： A mobile communication apparatus configured to be provided with an extra antenna has a printed board provided with an antenna feed point, an antenna having a spring-like contact and provided on the printed board, and a housing constituted by a first case and a second case fixed into each other. The printed board and the antenna are arranged between and pressed by the first case and the second case. The antenna feed point and the spring-like contact are in contact with and electrically connected to each other by means of elastic force of the spring-like contact caused upon the first case and the second case being fixed into each other. The housing has a space for containing the extra antenna such that the extra antenna is electrically connected to the antenna feed point by means of the elastic force.

    摘要翻译： 配置成设置有额外天线的移动通信装置具有设置有天线馈电点的印刷电路板，具有弹簧状接触并设置在印刷电路板上的天线以及由第一壳体和第二壳体构成的壳体 相互固定 印刷电路板和天线布置在第一壳体和第二壳体之间并被第一壳体和第二壳体按压之间。 天线馈电点和弹簧状触点通过在第一壳体上引起的弹簧状接触的弹力彼此接触并彼此电连接，并且第二壳体彼此固定。 壳体具有用于容纳额外天线的空间，使得额外的天线通过弹性力电连接到天线馈电点。