摘要:
A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
摘要:
A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
摘要:
A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
摘要:
A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.
摘要:
A shield wire has a wire main body that has a conductor and an insulation covering the conductor. The conductor has a single wire or a stranded wire. A shield member is disposed on an outer circumference of the wire main body. The shield member has a tubular body having an inner sleeve, a braided shield and an outer sleeve, and a metal pipe is disposed on the outer circumference of the wire main body. The tubular body is electrically connected to the metal pipe at an end thereof. The shield wire further has a first connector member with a flange, wherein the first connector member is electrically connected to the tubular body at an other end of the tubular body where the tubular body is not connected to the metal pipe.
摘要:
A shield wire has: a wire main body that has a conductor and an insulation covering the conductor, the conductor having a single wire or a stranded wire; and a shield member that is disposed on an outer circumference of the wire main body. The shield member has a tubular body having an inner sleeve, an braided shield and an outer sleeve, and a metal pipe is disposed on the outer circumference of the wire main body. The tubular body is electrically connected to the metal pipe at an end thereof. The shield wire further has a first connector member with a flange, wherein the first connector member is electrically connected to the tubular body at an other end of the tubular body where the tubular body is not connected to the metal pipe.
摘要:
An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.
摘要:
A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of a surface the wiring conductor, and the Sn-based material part includes a base metal doped with a transformation retardant element and an oxidation control element. The transformation retardant element is at least one element selected from a group consisted of Sb, Bi, Cd, In, Ag, Au, Ni, Ti, Zr, and Hf. The oxidation control element is at least one element selected from a group consisted of Ge, P, Zn, Kr, Cr, Mn, Na, V, Si, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn, the transformation retardant element and the oxidation control element is diffused to form an alloy.
摘要:
An extra-fine copper alloy wire has: a wire diameter of 0.010 to 0.025 mm; 1 to 3 weight % of silver (Ag), and a balance consisting copper (Co) and an inevitable impurity; a tensile strength of not less than 850 MPa; an electrical conductivity of not less than 85% IACS; an elongation of 0.5 to 3.0%; and a lowering rate in tensile strength of not more than 2%. The lowering rate is represented by [(1−σh1/σh0)×100%] where σh1 is a tensile strength of the wire measured after a heat treatment under conditions of a heating temperature of not more than 350° C. and a heating time of not more than 5 seconds, and σh0 is a tensile strength of the wire measured before the heat treatment.
摘要:
A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.