Abstract:
The present invention achieves higher precision and lower power consumption by reducing semiconductor chip occupation area. A semiconductor integrated circuit which can be mounted on an optical disk device has: a wobble signal generating circuit capable of receiving first, second, third, and fourth light reception output signals A, B, C, and D of a light receiving element in an optical pickup and detecting a wobble in a recordable disk; a differential phase detection signal (DPD) generating circuit for tracking an unrecordable disk; and two A/D converters and an arithmetic circuit. The first, second, third, and fourth light reception output signals are selectively supplied to the two A/D converters, the arithmetic circuit in a first operation mode generates a first addition output signal of A and C and a second addition output signal of B and D, the DPD generating circuit generates a digital phase comparison signal, the arithmetic circuit in a second operation mode generates a third addition output signal of A and D and a fourth addition output signal of B and C, and the wobble signal generating circuit generates a digital wobble signal.
Abstract:
A semiconductor apparatus includes a substrate made of a diboride single crystal expressed by a chemical formula XB2, in which X includes at least one of Ti, Zr, Nb and Hf, a semiconductor buffer layer formed on a principal surface of the substrate and made of AlyGa1−yN (0
Abstract translation:半导体装置包括由化学式XB 2 X表示的二硼化物单晶制成的基板,其中X包括Ti,Zr,Nb和Hf中的至少一种,形成在半导体缓冲层上的半导体缓冲层 该衬底的主表面由Al y Ga 1-y N(0
Abstract:
A semiconductor apparatus includes a substrate made of a diboride single crystal expressed by a chemical formula XB2, in which X includes at least one of Ti, Zr, Nb and Hf, a semiconductor buffer layer formed on a principal surface of the substrate and made of AlyGa1-yN (0
Abstract translation:半导体装置包括由化学式XB 2 X表示的二硼化物单晶制成的基板,其中X包括Ti,Zr,Nb和Hf中的至少一种,形成在半导体缓冲层上的半导体缓冲层 该衬底的主表面由Al y Ga 1-y N(0
Abstract:
A member of a substrate processing apparatus, which can prevent minute particles from becoming attached to a wafer. The substrate processing apparatus has a chamber in which the wafer is accommodated, and the wafer is subjected to plasma processing in the chamber. The member is disposed in the chamber and comprised of a base material and an yttria coating that coats the base material. The yttria coating is comprised of an yttria base layer coated on the base material, and an yttria upper layer laminated on at least a part of the yttria base layer, and the structure of the yttria upper layer is looser than that of the yttria base layer.
Abstract:
A container cleanliness measurement apparatus capable of preventing particles from being adhered to substrates, while improving the operation efficiency of a container for housing substrates. An FOUP inspection apparatus includes a particle-separation promoting nozzle for promoting separation of particles adhered to an inner wall of an FOUP and to carries for holding peripheral portions of wafers inside the FOUP, a particle collecting nozzle for collecting particles separated from the inner wall of the FOUP, etc., and a particle counter for measuring an amount of collected particles. The particle-separation promoting nozzle and the particle collecting nozzle constitute a probe nozzle which is adapted to enter inside the FOUP.
Abstract:
A container cleanliness measurement apparatus capable of preventing particles from being adhered to substrates, while improving the operation efficiency of a container for housing substrates. An FOUP inspection apparatus includes a particle-separation promoting nozzle for promoting separation of particles adhered to an inner wall of an FOUP and to carries for holding peripheral portions of wafers inside the FOUP, a particle collecting nozzle for collecting particles separated from the inner wall of the FOUP, etc., and a particle counter for measuring an amount of collected particles. The particle-separation promoting nozzle and the particle collecting nozzle constitute a probe nozzle which is adapted to enter inside the FOUP.
Abstract:
The present invention is a light-emitting element provided with semiconductor layers of gallium nitride compounds 4 having a multilayer structure including an emitting layer 3 formed by subjecting gallium nitride compounds to epitaxial growth on a surface 2 of a substrate 1, wherein a back surface 7 of the semiconductor layers 4 exposed by removal of the substrate 1 or an outermost layer 5 of the semiconductor layers 4 is provided as a radiating surface 8 for radiating light emitted from the emitting layer 3 to the outside, and able to provide a higher emission intensity from smaller electrical power because the absence of a substrate greatly improves the radiation efficiency of light.
Abstract:
A semiconductor apparatus includes a substrate made of a diboride single crystal expressed by a chemical formula XB2, in which X includes at least one of Tl, Zr, Nb and Hf, a semiconductor buffer layer formed on a principal surface of the substrate and made of AlyGa1-yN (0