摘要:
A method according to the invention comprises: starting plasma discharge for forming the gas barrier layer in a film deposition chamber; and producing the gas barrier layer by using a plasma after a first predetermined period of time has elapsed from a start of the plasma discharge.
摘要:
The film deposition device includes a CVD film forming room disposed on a travel path of a substrate and having a function of performing the film deposition on a substrate by CVD, a treatment room disposed upstream or downstream of the CVD film forming room on the travel path and having a function of performing a predetermined treatment on the substrate, and a differential room disposed between and communicating with the CVD film forming room and the treatment room. The differential room includes a evacuation unit, a gas introducing unit for introducing at least one of a gas to be supplied to both of the CVD film forming room and the treatment room, and an inert gas, and a controller which controls the evacuation unit and the gas introducing unit to keep the differential room at a higher pressure than the CVD film forming room and the treatment room.
摘要:
A film deposition method deposits a film on a surface of a substrate in strip form traveling on a peripheral surface of a cylindrical drum in at least one film deposition compartment around the peripheral surface of the drum. The method disposes previously a differential compartment between one film deposition compartment and a compartment including a wrapping space containing at least one of a first position at which the substrate starts to travel on the drum and a second position at which the substrate separates from the drum, the differential compartments communicating with the compartment including the wrapping space and the film deposition compartment, sets a first pressure of the wrapping space lower than a second pressure of the at least one film deposition compartment and performs film deposition in the film deposition compartment with electric power supplied to the drum.
摘要:
Gas barrier coatings and gas barrier films are used in displays and so forth. Described gas barrier coatings are excellent not only in gas barrier properties but oxidation resistance, transparency and flexibility. A gas barrier coating is based on silicon nitride, and includes: a N/Si compositional ratio of 1 to 1.4; and a hydrogen content of 10 to 30 atomic percent. A peak of an absorption caused by Si—H stretching vibration occurs at a wavenumber ranging from 2170 to 2200 cm−1 in a Fourier transform infrared absorption spectrum of the coating, with a ratio [I(Si—H)/I(Si—N)] between a peak intensity I(Si—H) of the absorption caused by Si—H stretching vibration and a peak intensity I(Si—H) of an absorption caused by Si—N stretching vibration in the vicinity of 840 cm−1 being 0.03 to 0.15.
摘要:
A film deposition device includes a conveyor of a strip of substrate in a conveying direction, a film deposition electrode disposed so as to face the substrate, a counter electrode disposed at an opposite side of the film deposition electrode, gas supplier of film deposition gases and a grounded shield disposed in a planar direction of the substrate so as to surround the film deposition electrode. An upstream end portion of the film deposition electrode in the conveying direction is closer to the substrate than an upstream end portion of the grounded shield in the conveying direction corresponding to the upstream end portion of the film deposition electrode.
摘要:
An antireflection film forming composition, includes: a polymerized product of Compound (I) having m number of RSi(O0.5)3 units, in which m stands for an integer of from 8 to 16, and Rs each independently represents a non-hydrolyzable group, with the proviso that at least two of Rs each represents a vinyl- or ethynyl-containing group, wherein each of the RSi(O0.5)3 units is linked to another RSi(O0.5)3 unit while having an oxygen atom in common and constitutes a cage structure, and wherein, of solids contained in the composition, the polymerized product obtained by a polymerization reaction of Compound (I) amounts to 60 mass % or greater and Compound (I) amounts to 15 mass % or less.