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1.发明授权公开(公告)号：US08064213B2
公开(公告)日：2011-11-22
申请号：US11043123
申请日：2005-01-27
IPC分类号： H05K1/18
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/49805 , H01L23/5389 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/165 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06524 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12042 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0284 , H05K1/183 , H05K1/187 , H05K3/20 , H05K3/403 , H05K2203/302 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces. At least one wiring 20 extends from the upper surface to the lower surface through the side surface, and an electronic component 32 is disposed within the sheet substrate.
摘要翻译： 提供具有内置部件的模块，其可以在没有通孔形成步骤的情况下制造。 具有内置部件100的模块包括绝缘片基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c。 至少一个布线20通过侧面从上表面延伸到下表面，并且电子部件32设置在片状基板内。
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公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 提供了可以在没有通孔形成步骤的情况下制造的连接构件。 连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。
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公开(公告)号：US20080047137A1
公开(公告)日：2008-02-28
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。
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公开(公告)号：US07258549B2
公开(公告)日：2007-08-21
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R12/00
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。
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公开(公告)号：US07748110B2
公开(公告)日：2010-07-06
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H05K3/36
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。
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6.发明申请公开(公告)号：US20050168960A1
公开(公告)日：2005-08-04
申请号：US11043123
申请日：2005-01-27
IPC分类号： H01L21/68 , H01L21/98 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/10 , H01L25/16 , H05K1/00 , H05K1/18 , H05K3/20 , H05K3/40
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/49805 , H01L23/5389 , H01L24/48 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/165 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06524 , H01L2225/06555 , H01L2225/06582 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12042 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0284 , H05K1/183 , H05K1/187 , H05K3/20 , H05K3/403 , H05K2203/302 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in component 100 includes an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and an electronic component 32 which is disposed within the sheet substrate.
摘要翻译： 提供具有内置部件的模块，其可以在没有通孔形成步骤的情况下制造。 具有内置部件100的模块包括绝缘片基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面; 以及设置在片状基板内的电子部件32。
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7.发明申请公开(公告)号：US20050196095A1
公开(公告)日：2005-09-08
申请号：US11041101
申请日：2005-01-21
CPC分类号： G02B6/4249 , G02B6/3608 , G02B6/3636 , G02B6/3668 , G02B6/3676 , G02B6/3692 , G02B6/4214 , H05K1/0274 , H05K2203/167
摘要： A fabrication method for an optical transmission channel board includes a first step of forming on a substrate a layer containing an electrically conductive material, and a second step of patterning said layer containing an electrically conductive material formed on said substrate, and thereby forming circuit patterns at least a part of which is used as an electric circuit and at least a part of which positionally regulates an optical transmission channel.
摘要翻译： 用于光传输通道板的制造方法包括在衬底上形成含有导电材料的层的第一步骤，以及第二步骤，使包含形成在所述衬底上的导电材料的层的图案化，从而形成电路图案 其中至少一部分用作电路，其中至少一部分位置地调节光传输通道。
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8.发明申请OPTICAL TRANSMISSION CHANNEL BOARD, BOARD WITH BUILT-IN OPTICAL TRANSMISSION CHANNEL, AND DATA PROCESSING APPARATUS 审中-公开光传输通道板，内置光传输通道板和数据处理设备公开(公告)号：US20070224735A1
公开(公告)日：2007-09-27
申请号：US11750617
申请日：2007-05-18
IPC分类号： H01L21/82
CPC分类号： G02B6/4249 , G02B6/3608 , G02B6/3636 , G02B6/3668 , G02B6/3676 , G02B6/3692 , G02B6/4214 , H05K1/0274 , H05K2203/167
摘要： A fabrication method for an optical transmission channel board includes a first step of forming on a substrate a layer containing an electrically conductive material, and a second step of patterning said layer containing an electrically conductive material formed on said substrate, and thereby forming circuit patterns at least a part of which is used as an electric circuit and at least a part of which positionally regulates an optical transmission channel.
摘要翻译： 用于光传输通道板的制造方法包括在衬底上形成含有导电材料的层的第一步骤，以及第二步骤，使包含形成在所述衬底上的导电材料的层的图案化，从而形成电路图案 其中至少一部分用作电路，其中至少一部分位置地调节光传输通道。
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9.发明授权公开(公告)号：US07242823B2
公开(公告)日：2007-07-10
申请号：US11041101
申请日：2005-01-21
CPC分类号： G02B6/4249 , G02B6/3608 , G02B6/3636 , G02B6/3668 , G02B6/3676 , G02B6/3692 , G02B6/4214 , H05K1/0274 , H05K2203/167
摘要： An optical transmission board is provided. The optical transmission board includes an optical transmission channel, a retention board for retaining the optical transmission channel and circuit patterns. The circuit patterns are formed on the retention board and a part of the circuit patterns is used as an electric circuit. The optical transmission channel is positionally regulated by the part of the circuit patterns.
摘要翻译： 提供一种光传输板。 光传输板包括光传输通道，用于保持光传输通道和电路图案的保持板。 电路图案形成在保持板上，一部分电路图形用作电路。 光传输通道由电路图案的一部分位置调节。
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10.发明授权公开(公告)号：US07136543B2
公开(公告)日：2006-11-14
申请号：US10879067
申请日：2004-06-30
CPC分类号： H01L31/035281 , G02B6/43 , H01L33/20 , H01L33/24 , H01L2224/16225 , H01L2924/1017 , Y02E10/50
摘要： A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).
摘要翻译： 一种安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且不需要在光传输线和安装组件之间的连接部分处的高度精确的垂直度。 通过电连接部分（100a）连接光电转换装置（10a），球形半导体装置（12a）和（12b）和电转换装置（10b） 14），使得由光电转换装置（10a）接收的光被球形半导体器件（12a）和（12b）放大，然后从电光转换装置（10b）发射。
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