摘要:
A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要:
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要:
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要:
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要:
A parallel computation apparatus as a multiprocessor includes functional modules as a plurality of processors having an optical communication function and capable of mutually cooperating, and an optical transmission line interconnecting the plurality of processors. Among the plurality of functional modules, the first functional module having a first information processing capacity has a function of determining whether information processing of a first information processing amount can be completed based on the first information processing capacity, and outputting a second information processing amount obtained by subtracting an information processing amount based on the first information processing capacity from the first information processing amount to at least one of the other functional modules.
摘要:
A parallel computation apparatus as a multiprocessor includes functional modules as a plurality of processors having an optical communication function and capable of mutually cooperating, and an optical transmission line interconnecting the plurality of processors. Among the plurality of functional modules, the first functional module having a first information processing capacity has a function of determining whether information processing of a first information processing amount can be completed based on the first information processing capacity, and outputting a second information processing amount obtained by subtracting an information processing amount based on the first information processing capacity from the first information processing amount to at least one of the other functional modules.
摘要:
The present invention provides a tamper resistant circuit board, an apparatus and method for aiding the design of the circuit board, a computer readable storage medium having stored therein a program for performing the method, and a mobile terminal containing the circuit board. The tamper resistant circuit board has a multilayer structure, including outermost substrates and an internal layer between the outermost substrates, and a signal line through which a confidential signal flows. The signal line is wired such as the confidential signal does not appear on the outer surfaces of the outermost substrates of the multilayer structure of the circuit board.
摘要:
A circuit board is provided in which tamper resistance is improved by making probing by third parties difficult, while solving problems associated with the current techniques and manufacturing costs. A signal line through which a confidential signal requiring tamper resistance flows and components 32 and 33 connected to the signal line 21 by the terminals thereof, are laid out in a component-containing layer 13 of a circuit board 10. Only a confidential signal having been encrypted through a predetermined component 31 is outputted to an observation point 34 provided on a surface of the circuit board 10. External observation and control of the confidential signal is performed by decoding a cipher provided by the component 31 to the signal which appears at the observation point 34.
摘要:
A flexible printed board that is adapted to high-speed transmission and can mount a plurality of connectors at low cost is provided. The board comprises a flexible printed board body 100 that has a first side 100a and a second side 100b opposed to each other, and an overlap portion 105 formed by bending its one end; a plurality of wiring lines 101 that are arranged on the first side 100a of the body substantially in parallel to each other; first pads 103 that are connected to respective ends of wiring lines, wider than the wiring lines and formed on the first-side surface 105a of the overlap potion; and second pads 104 that are located at respective ends of wiring lines, wider than the wiring lines and formed on the second-side surface 105b of the overlap potion. The wiring lines 101a with the first pads connected thereto and the wiring lines 101b with the second pads 104 connected thereto are alternatively arranged on the first side.
摘要:
A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.