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30 条记录 (耗时 0.017 秒)

    Optical waveguide and method for manufacturing the same
    3.
    发明授权
    Optical waveguide and method for manufacturing the same 有权
    光波导及其制造方法

    公开(公告)号：US06847773B2

    公开(公告)日：2005-01-25

    申请号：US10608342

    申请日：2003-06-27

    申请人： Tsuguhiro Korenaga ,  Kunio Hibino

    发明人： Tsuguhiro Korenaga ,  Kunio Hibino

    IPC分类号： G02B6/138 ,  G02B6/10

    CPC分类号： G02B6/138

    摘要： An optical waveguide includes a first cladding, a second cladding, and a core. The core is embedded in the first cladding so as to be exposed on one principal surface of the first cladding that is opposed to the second cladding. The first cladding and the second cladding are arranged so as to sandwich the core. The core is a product formed by a reaction in which a polymeric material that includes branched polysilane and polysiloxane is subjected to at least one process selected from heating and ultraviolet irradiation. The refractive index of the core is higher than the refractive indices of the first cladding and the second cladding.

    摘要翻译： 光波导包括第一包层，第二包层和芯。 芯被嵌入第一包层中，以便暴露在与第二包层相对的第一包层的一个主表面上。 第一包层和第二包层被布置成夹着芯。 核心是通过使包含支链聚硅烷和聚硅氧烷的聚合物材料经受加热和紫外线照射中的至少一种方法的反应形成的产物。 芯的折射率高于第一包层和第二包层的折射率。

    Wavelength multiplexing device and optical transmission module provided with the same
    4.
    发明申请
    Wavelength multiplexing device and optical transmission module provided with the same 审中-公开
    波长多路复用器件和光传输模块配有相同的

    公开(公告)号：US20050175345A1

    公开(公告)日：2005-08-11

    申请号：US11041210

    申请日：2005-01-25

    申请人： Mikihiro Shimada ,  Nobuki Itoh ,  Tsuguhiro Korenaga ,  Kunio Hibino

    发明人： Mikihiro Shimada ,  Nobuki Itoh ,  Tsuguhiro Korenaga ,  Kunio Hibino

    IPC分类号： G02B6/34 ,  H04J14/02

    CPC分类号： G02B6/425 ,  G02B6/29329 ,  G02B6/29361 ,  H04J14/02

    摘要： A wavelength multiplexing device has an emitter capable of independently emitting at least two optical signals for at least two kinds of wavelength, respectively and a transmitter including a plurality of optical waveguides into which the optical signals emitted by the emitter are coupled and which independently transmit the coupled optical signals, respectively. While coupling optical signals with the same wavelength among the optical signals emitted by the emitter into the optical waveguides different from each other, the transmitter couples optical signals with wavelengths different from each other into a same optical waveguide.

    摘要翻译： 波长多路复用装置具有分别发射至少两种波长的至少两种光信号的发射器和包括发射器发射的光信号耦合在其中的多个光波导的发射器，并且独立地发送 耦合光信号。 在将由发射器发射的光信号中的相同波长的光信号耦合到彼此不同的光波导中的同时，发射器将具有彼此不同的波长的光信号耦合到相同的光波导中。

    METHOD OF MANUFACTURING A MAGNETIC RECORDING MEDIUM
    7.
    发明申请
    METHOD OF MANUFACTURING A MAGNETIC RECORDING MEDIUM 有权
    制造磁记录介质的方法

    公开(公告)号：US20100330270A1

    公开(公告)日：2010-12-30

    申请号：US12821104

    申请日：2010-06-22

    申请人： Yuichi HASHIZUME ,  Kunio Hibino

    发明人： Yuichi HASHIZUME ,  Kunio Hibino

    IPC分类号： B05D5/00

    CPC分类号： G11B5/855

    摘要： A method of manufacturing a magnetic recording medium includes providing a substrate that is a magnetic recording medium substrate having a disc shape, having two main surfaces, and having defined therein a center hole; holding the center hole of the substrate from both main surfaces with two holding members that each have a disc shape to hold the substrate and to cover at least the periphery of the center hole adjacent to the two main surfaces of the substrate; and applying resist liquid simultaneously to both main surfaces of the substrate using spin coating to form a resist layer simultaneously on both main surfaces while maintaining the periphery of the center hole immediately adjacent to the two main surfaces of the substrate resist-free as an unapplied portion. The method enables efficient formation of uniform resist layers without defects on both faces of the substrate.

    摘要翻译： 制造磁记录介质的方法包括：提供作为具有盘形状的磁记录介质基板的基板，具有两个主表面，并且在其中限定有中心孔; 从两个主表面保持基板的中心孔，其中两个保持构件具有保持基板的盘形状并至少覆盖与基板的两个主表面相邻的中心孔的周边; 并使用旋转涂布同时对基板的两个主表面施加抗蚀剂液体，同时在两个主表面上形成抗蚀剂层，同时保持与基板的两个主表面紧邻的中心孔的周边无抗蚀剂作为未施加部分 。 该方法能够有效地形成均匀的抗蚀剂层，而在衬底的两个表面上没有缺陷。

    METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONENT IS MOUNTED
    8.
    发明申请
    METHOD FOR MANUFACTURING CIRCUIT BOARD ON WHICH ELECTRONIC COMPONENT IS MOUNTED 有权
    电子元件安装电路板的制造方法

    公开(公告)号：US20090070994A1

    公开(公告)日：2009-03-19

    申请号：US12094219

    申请日：2006-11-13

    申请人： Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Kunio Hibino

    发明人： Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Kazuhiro Nishikawa ,  Kunio Hibino

    IPC分类号： H05K3/30

    CPC分类号： H05K3/323 ,  H05K3/321 ,  Y10T29/49114 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

    摘要： A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.

    摘要翻译： 一种制造其上安装有电子部件的电路板的方法至少包括以下步骤：（a）将包含分散在其中的导电粒子的液体光聚合性粘合剂供应到印刷电路板的表面上，以形成粘合剂层 板表面; （b）用紫外线照射光聚合性粘合剂变成凝胶，以提供粘合剂层的粘附性; 以及（c）从粘合剂层的上表面侧将电子部件压靠在印刷基板的部件安装部上，形成电子部件与部件安装部之间的电连接，在该方法中， 可聚合粘合剂是延迟的反应性粘合剂。

    Substrate connecting member and connecting structure
    10.
    发明授权
    Substrate connecting member and connecting structure 失效
    基板连接构件和连接结构

    公开(公告)号：US07762819B2

    公开(公告)日：2010-07-27

    申请号：US11918121

    申请日：2006-07-06

    申请人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

    发明人： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

    IPC分类号： H01R12/00

    CPC分类号： H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

    摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

    摘要翻译： 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。