公开(公告)号：US07752749B2

公开(公告)日：2010-07-13

申请号：US11886533

申请日：2006-03-17

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75822 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/048 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/05599

摘要： One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.

摘要翻译： 电子部件的电极端子和布线基板的连接端子之一预先设置有焊料，确保了布线基板和电子部件中的一个，使电极端子和连接端子彼此抵接 保持布线基板和电子部件中的任一个（取决于不固定的）。 电子部件被加热使得焊料熔化，并且焊料在保持电子部件的同时固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔融的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的XY面上的表面相对于彼此微细移动; 方向。

公开(公告)号：US20090049687A1

公开(公告)日：2009-02-26

申请号：US11886533

申请日：2006-03-17

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

IPC分类号： H05K3/34

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75822 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/048 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/05599

摘要： [Problem] To improve productivity and reliability in mounting an electronic component.[Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.

摘要翻译： [问题]提高安装电子元件的生产力和可靠性。 解决问题的手段电子部件的电极端子和布线基板的连接端子中的至少一个预先设置有焊料，布线基板和电子部件中的一个被固定，电子端子 使布线基板的连接端子与布线基板和电子部件中的一方（以未固定的方式）保持的状态相互抵接。 然后，电子部件被加热使得焊料熔化，并且在保持电子部件的同时使焊料​​固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔化的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的表面在XYθ方向上相对于彼此微细移动。

公开(公告)号：US20050014035A1

公开(公告)日：2005-01-20

申请号：US10890329

申请日：2004-07-12

申请人： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： C08J5/04 ,  D04H1/42 ,  D04H13/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C04B35/64 ,  B28B1/00 ,  B28B3/00 ,  B28B5/00 ,  B32B3/00 ,  B32B5/02 ,  B32B9/00 ,  C04B33/32 ,  C04B33/36 ,  D04H1/00 ,  D04H3/00 ,  D04H5/00 ,  H01R12/04 ,  H05K1/11

CPC分类号： H05K1/0366 ,  C08J5/046 ,  D04H1/4318 ,  D04H1/64 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/20

摘要： A prepreg for a printed wiring board includes fluorocarbon fibers as a reinforcing material, and the reinforcing material is impregnated with a resin. The fluorocarbon fibers include short fibers having a branch structure. The reinforcing material includes a nonwoven fabric formed by interlacing the fluorocarbon fibers in the thickness direction. The proportion of the fluorocarbon fibers among the fibers constituting the nonwoven fabric ranges from 50 wt % to 100 wt %, and the remaining fibers are synthetic fibers or inorganic fibers. The nonwoven fabric is heat-treated at 330° C. to 390° C., then annealed at 200° C. to 270° C., and impregnated with the resin. This prepreg can used to provide a printed wiring board with low Interstitial Via Hole connection resistance and high connection stability and a method for manufacturing the printed wiring board.

摘要翻译： 用于印刷线路板的预浸料包括作为增强材料的氟碳纤维，并且增强材料用树脂浸渍。 氟碳纤维包括具有分支结构的短纤维。 增强材料包括通过使碳氟化合物纤维沿厚度方向交织而形成的无纺布。 构成无纺布的纤维中的氟碳纤维的比例为50重量％〜100重量％，剩余的纤维为合成纤维或无机纤维。 无纺布在330℃至390℃下热处理，然后在200℃下退火至270℃，并用树脂浸渍。 该预浸料可用于提供具有低间隙通孔连接电阻和高连接稳定性的印刷线路板以及印刷线路板的制造方法。

公开(公告)号：US08847229B2

公开(公告)日：2014-09-30

申请号：US13820859

申请日：2012-02-21

申请人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

发明人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

IPC分类号： H01L29/04 ,  H01L21/027 ,  H01L29/66 ,  H01L27/12 ,  H01L29/786 ,  H01L33/08 ,  H01L23/544

CPC分类号： H01L29/786 ,  H01L21/0274 ,  H01L23/544 ,  H01L27/124 ,  H01L29/66742 ,  H01L29/78603 ,  H01L29/78606 ,  H01L29/78693 ,  H01L33/08 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method of the flexible semiconductor device of the present invention comprising the steps of: forming a gate electrode; forming a gate insulating film so that the gate insulating film contacts with the gate electrode; forming a semiconductor layer on the gate insulating film such that the semiconductor layer is opposed to the gate electrode; forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; forming vias in the flexible film layer; forming a first metal layer by disposing a metal foil onto the flexible film layer, and thereby a semiconductor device precursor is provided; and subjecting the first metal layer to a processing treatment to form a wiring from a part of the first metal layer, wherein, in the step of the processing treatment of the first metal layer, the wiring is formed in a predetermined position by using at least one of the vias as an alignment marker.

摘要翻译： 提供了一种用于制造柔性半导体器件的方法。 本发明的柔性半导体器件的制造方法包括以下步骤：形成栅电极; 形成栅极绝缘膜，使得栅极绝缘膜与栅电极接触; 在所述栅极绝缘膜上形成半导体层，使得所述半导体层与所述栅电极相对; 形成源极和漏极，使得源极和漏极与半导体层接触; 形成柔性膜层，使得柔性膜层覆盖半导体层和源极和漏极; 在柔性膜层中形成通孔; 通过将金属箔设置在柔性膜层上形成第一金属层，从而提供半导体器件前体; 以及对所述第一金属层进行处理处理以从所述第一金属层的一部分形成布线，其中，在所述第一金属层的所述加工处理的步骤中，通过至少使用所述布线形成所述布线在预定位置 其中一个通孔作为对准标记。

公开(公告)号：US20100064761A1

公开(公告)日：2010-03-18

申请号：US12300290

申请日：2007-03-09

申请人： Takeharu Onishi ,  Shinobu Masuda

发明人： Takeharu Onishi ,  Shinobu Masuda

IPC分类号： B21K27/00

CPC分类号： B21K27/00 ,  B21J13/08 ,  B21K27/04

摘要： This invention provides a billet-rearranging device which receives billets fed in a row and rearranges two billets in tandem. The billet-rearranging device “A” is disposed between a chute “S” with an outlet to feed billets “b” in a row to the device “A” and a charger “Cg” with a holder unit “B” with two holders “B1” and “B2” to hold two billets “b” in tandem and has a billet-rearranging mechanism to rearrange two billets “b” in tandem and feed them to the holder unit “B” of the charger “Cg.” The billet-rearranging mechanism comprising (i) an upper slide plate 1 positioned below the outlet of the chute “S”, (ii) a lower slide plate 2 positioned below the upper slide plate 1, and (iii) a fixed plate 3 positioned below the lower slide plate 2, above the holder unit “B” of the charger “Cg.” The upper slide plate 1 has the function of rearranging two billets “b” in tandem. The lower slide plate 2 has the function of feeding two billets “b” in tandem one by one to the fixed plate 3. The fixed plate 3 has the function of guiding two billets “b” in tandem simultaneously to the holder unit “B.”

摘要翻译： 本发明提供了一种坯料重排装置，其接收一排供给的坯料并串联地重新排列两个坯料。 坯料重新排列装置“A”设置在具有排出口的排出口“S”与排出装置“A”成行的充气器“Cg”和具有两个保持架的保持架单元“B” “B1”和“B2”串联连接两个坯料“b”，并具有一个坯料重排机构，以串联重新排列两个坯料“b”，并将其送入充电器“Cg”的保持架单元“B”。 坯料重排机构包括：（i）位于滑槽“S”的出口下方的上滑板1，（ii）位于上滑板1下方的下滑板2，以及（iii）位于下滑动板1下方的固定板3 下滑板2，在充电器“Cg”的保持器单元“B”的上方。上滑板1具有串联地重新排列两个坯料“b”的功能。 下滑板2具有一个接一个地向固定板3供给两个坯料“b”的功能。固定板3具有将两个坯料“b”同时导引到保持架单元“B”的功能。 “

公开(公告)号：US20130168681A1

公开(公告)日：2013-07-04

申请号：US13821352

申请日：2012-02-21

申请人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

发明人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

IPC分类号： H01L29/66 ,  H01L29/786

CPC分类号： H01L29/66765 ,  H01L21/0274 ,  H01L23/544 ,  H01L27/3262 ,  H01L29/78603 ,  H01L29/78669 ,  H01L29/78678 ,  H01L29/7869 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2227/323 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a method for manufacturing a flexible semiconductor device. The method of the flexible semiconductor device according to the present invention comprises the steps of: (i) forming an insulating layer on one of principal surfaces of a metal foil; (ii) forming a semiconductor layer on the insulating layer, and then forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; (iii) forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; (iv) forming vias in the flexible film layer, and thereby a semiconductor device precursor is provided; and (v) subjecting the metal foil to a processing treatment, and thereby forming a gate electrode from the metal foil, wherein, in the step (v) of the processing treatment of the metal foil, the gate electrode is formed in a predetermined position by using at least one of the vias of the semiconductor device precursor as an alignment marker.

摘要翻译： 提供了一种用于制造柔性半导体器件的方法。 根据本发明的柔性半导体器件的方法包括以下步骤：（i）在金属箔的主表面之一上形成绝缘层; （ii）在所述绝缘层上形成半导体层，然后形成源电极和漏电极，使得所述源极和漏极与所述半导体层接触; （iii）形成柔性膜层，使得柔性膜层覆盖半导体层和源极和漏极; （iv）在柔性膜层中形成通孔，从而提供半导体器件前体; 和（v）对所述金属箔进行处理处理，从而从所述金属箔形成栅电极，其中在所述金属箔的所述加工处理的步骤（v）中，所述栅电极形成在预定位置 通过使用半导体器件前体的至少一个通孔作为对准标记。

公开(公告)号：US08993387B2

公开(公告)日：2015-03-31

申请号：US13821352

申请日：2012-02-21

申请人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

发明人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

IPC分类号： H01L29/786 ,  H01L29/66 ,  H01L23/544 ,  H01L21/027 ,  H01L27/32

CPC分类号： H01L29/66765 ,  H01L21/0274 ,  H01L23/544 ,  H01L27/3262 ,  H01L29/78603 ,  H01L29/78669 ,  H01L29/78678 ,  H01L29/7869 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2227/323 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a method for manufacturing a flexible semiconductor device. The method of the flexible semiconductor device according to the present invention comprises the steps of: (i) forming an insulating layer on one of principal surfaces of a metal foil; (ii) forming a semiconductor layer on the insulating layer, and then forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; (iii) forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; (iv) forming vias in the flexible film layer, and thereby a semiconductor device precursor is provided; and (v) subjecting the metal foil to a processing treatment, and thereby forming a gate electrode from the metal foil, wherein, in the step (v) of the processing treatment of the metal foil, the gate electrode is formed in a predetermined position by using at least one of the vias of the semiconductor device precursor as an alignment marker.

摘要翻译： 提供了一种用于制造柔性半导体器件的方法。 根据本发明的柔性半导体器件的方法包括以下步骤：（i）在金属箔的主表面之一上形成绝缘层; （ii）在所述绝缘层上形成半导体层，然后形成源电极和漏电极，使得所述源极和漏极与所述半导体层接触; （iii）形成柔性膜层，使得柔性膜层覆盖半导体层和源极和漏极; （iv）在柔性膜层中形成通孔，从而提供半导体器件前体; 和（v）对所述金属箔进行处理处理，从而从所述金属箔形成栅电极，其中在所述金属箔的所述加工处理的步骤（v）中，所述栅电极形成在预定位置 通过使用半导体器件前体的至少一个通孔作为对准标记。

公开(公告)号：US20130161628A1

公开(公告)日：2013-06-27

申请号：US13820859

申请日：2012-02-21

申请人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

发明人： Takeshi Suzuki ,  Koichi Hirano ,  Shinobu Masuda

IPC分类号： H01L29/786 ,  H01L33/08 ,  H01L29/66

CPC分类号： H01L29/786 ,  H01L21/0274 ,  H01L23/544 ,  H01L27/124 ,  H01L29/66742 ,  H01L29/78603 ,  H01L29/78606 ,  H01L29/78693 ,  H01L33/08 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method of the flexible semiconductor device of the present invention comprising the steps of: forming a gate electrode; forming a gate insulating film so that the gate insulating film contacts with the gate electrode; forming a semiconductor layer on the gate insulating film such that the semiconductor layer is opposed to the gate electrode; forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; forming vias in the flexible film layer; forming a first metal layer by disposing a metal foil onto the flexible film layer, and thereby a semiconductor device precursor is provided; and subjecting the first metal layer to a processing treatment to form a wiring from a part of the first metal layer, wherein, in the step of the processing treatment of the first metal layer, the wiring is formed in a predetermined position by using at least one of the vias as an alignment marker.

摘要翻译： 提供了一种用于制造柔性半导体器件的方法。 本发明的柔性半导体器件的制造方法包括以下步骤：形成栅电极; 形成栅极绝缘膜，使得栅极绝缘膜与栅电极接触; 在所述栅极绝缘膜上形成半导体层，使得所述半导体层与所述栅电极相对; 形成源极和漏极，使得源极和漏极与半导体层接触; 形成柔性膜层，使得柔性膜层覆盖半导体层和源极和漏极; 在柔性膜层中形成通孔; 通过将金属箔设置在柔性膜层上形成第一金属层，从而提供半导体器件前体; 以及对所述第一金属层进行处理处理以从所述第一金属层的一部分形成布线，其中，在所述第一金属层的所述加工处理的步骤中，通过至少使用所述布线形成所述布线在预定位置 其中一个通孔作为对准标记。

公开(公告)号：US08117880B2

公开(公告)日：2012-02-21

申请号：US12300290

申请日：2007-03-09

申请人： Takeharu Onishi ,  Shinobu Masuda

发明人： Takeharu Onishi ,  Shinobu Masuda

IPC分类号： B21C33/00 ,  B21J13/10 ,  B21D43/20

CPC分类号： B21K27/00 ,  B21J13/08 ,  B21K27/04

摘要： This invention provides a billet-rearranging device which receives billets fed in a row and rearranges two billets in tandem. The billet-rearranging device “A” is disposed between a chute “S” with an outlet to feed billets “b” in a row to the device “A” and a charger “Cg” with a holder unit “B” with two holders “B1” and “B2” to hold two billets “b” in tandem and has a billet-rearranging mechanism to rearrange two billets “b” in tandem and feed them to the holder unit “B” of the charger “Cg.” The billet-rearranging mechanism comprising (i) an upper slide plate 1 positioned below the outlet of the chute “S”, (ii) a lower slide plate 2 positioned below the upper slide plate 1, and (iii) a fixed plate 3 positioned below the lower slide plate 2, above the holder unit “B” of the charger “Cg.” The upper slide plate 1 has the function of rearranging two billets “b” in tandem. The lower slide plate 2 has the function of feeding two billets “b” in tandem one by one to the fixed plate 3. The fixed plate 3 has the function of guiding two billets “b” in tandem simultaneously to the holder unit “B.”

摘要翻译： 本发明提供了一种坯料重排装置，其接收一排供给的坯料并串联地重新排列两个坯料。 坯料重新排列装置“A”设置在具有排出口的排出口“S”与排出装置“A”成行的充气器“Cg”和具有两个保持架的保持架单元“B” “B1”和“B2”串联连接两个坯料“b”，并具有一个坯料重排机构，以串联重新排列两个坯料“b”，并将其送入充电器“Cg”的保持架单元“B”。 坯料重排机构包括：（i）位于滑槽“S”的出口下方的上滑板1，（ii）位于上滑板1下方的下滑板2，以及（iii）位于下滑动板1下方的固定板3 下滑板2，在充电器“Cg”的保持器单元“B”的上方。上滑板1具有串联地重新排列两个坯料“b”的功能。 下滑板2具有一个接一个地向固定板3供给两个坯料“b”的功能。固定板3具有将两个坯料“b”同时导引到保持架单元“B”的功能。 “