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30 条记录 (耗时 0.027 秒)

    Vacuum interrupter and vacuum switch thereof
    1.
    发明授权
    Vacuum interrupter and vacuum switch thereof 有权
    真空灭弧室及其真空开关

    公开(公告)号：US06346683B1

    公开(公告)日：2002-02-12

    申请号：US09495317

    申请日：2000-02-01

    申请人： Tsutomu Okutomi ,  Takashi Kusano ,  Iwao Ohshima ,  Mitsutaka Homma ,  Atsushi Yamamoto ,  Takanobu Nishimura

    发明人： Tsutomu Okutomi ,  Takashi Kusano ,  Iwao Ohshima ,  Mitsutaka Homma ,  Atsushi Yamamoto ,  Takanobu Nishimura

    IPC分类号： H01H3366

    CPC分类号： H01H1/0203

    摘要： {W—CuxSb-balance Cu} alloy is employed for contacts. As the anti-arcing constituent in the alloy W or WMo in a content of 65 to 85%, of grain diameter 0.4 to 9 &mgr;m is employed. As auxiliary constituent, CuxSb is employed, the content of the CuxSb being 0.09 to 1.4 weight %, the x being x=1.9 to 5.5, the grain diameter being 0.02 to 20 &mgr;m, and the mean distance between grains being 0.2 to 300 &mgr;m. As conductive constituent, Cu or CuSb solid solution is employed, the Sb content present in solid solution form in the CuSb solid solution being less than 0.5%. As a result, not only is dispersion of CuxSb, which is evaporated on subjection to arcing, reduced, but also generation of severe cracks, which have an adverse effect in terms of occurrence of restriking. Arcing at the contacts surfaces is prevented, suppressing dispersion and exfoliation of W grains. In this way, damage due to melting and dispersion at the contacts surfaces is reduced, enabling both restriking to be prevented and the contact resistance characteristic to be improved.

    摘要翻译： {W-CuxSb-余量Cu}合金用于接触。 由于合金W或WMo中抗弧成分含量为65〜85％，粒径为0.4〜9μm。 作为辅助成分，使用CuxSb，CuxSb的含量为0.09〜1.4重量％，x为x = 1.9〜5.5，粒径为0.02〜20μm，晶粒间的平均距离为0.2〜300μm。 作为导电成分，使用Cu或CuSb固溶体，CuSb固溶体中以固溶体形式存在的Sb含量小于0.5％。 结果是，不仅在电弧放电时蒸发的CuxSb的分散减少，而且产生严重的裂纹，这在再起弧的发生方面具有不利的影响。 防止了在接触表面的电弧，抑制了W晶粒的分散和剥落。 以这种方式，由于触点表面的熔化和分散而导致的损坏减少，从而能够防止再起弧，并且提高接触电阻特性。

    Vacuum valve
    3.
    发明授权
    Vacuum valve 失效
    真空阀

    公开(公告)号：US6107582A

    公开(公告)日：2000-08-22

    申请号：US145337

    申请日：1998-09-01

    申请人： Tsutomu Okutomi ,  Mitsutaka Homma ,  Tsuneyo Seki ,  Atsushi Yamamoto ,  Takashi Kusano ,  Hiromichi Somei

    发明人： Tsutomu Okutomi ,  Mitsutaka Homma ,  Tsuneyo Seki ,  Atsushi Yamamoto ,  Takashi Kusano ,  Hiromichi Somei

    IPC分类号： B22F3/00 ,  C22C1/04 ,  C22C5/06 ,  C22C9/00 ,  H01H1/02 ,  H01H1/023 ,  H01H1/025 ,  H01K1/02 ,  H01H33/66

    CPC分类号： H01H1/0206

    摘要： A vacuum valve which has a contact material having a constituent of high electrical conductivity such as Cu and an anti-arcing constituent including Cr in which particles whose particle size is in the range 0.1.about.150 .mu.m represent at least 90 volume %, and a ratio defined by the formula (.alpha..sub.900 -.alpha..sub.50).times.100/(.alpha..sub.900) for this contact material has a value of 8-12% and is the coefficient of thermal expansion of the contact material .alpha..sub.50 is the coefficient of thermal expansion of the contact material at 50.degree. C. The formation of channels generated at the interfaces of the Cr particles and the Cu matrix after undergoing the brazing step is suppressed, enabling the static withstand-voltage, contact resistance, and the breaking performance characteristics of the vacuum valve to be stabilized.

    摘要翻译： 一种真空阀，其具有诸如Cu的高导电性组成的接触材料和包括Cr的抗弧形成分，其中颗粒尺寸在0.1μm至150μm的范围内的颗粒表示至少90体积％，并且 由该接触材料的公式（α-900-α50）×100 /（α900）定义的比例为8-12％的值，并且是接触材料的热膨胀系数α50是热膨胀系数 50℃下的接触材料。抑制了在经历钎焊步骤之后在Cr颗粒和Cu基体的界面处产生的通道的形成，使得静电耐受电压，接触电阻和真空的断裂性能特性 阀门要稳定。

    Contact material for contacts for vacuum interrupter and method of manufacturing the contact
    6.
    发明授权
    Contact material for contacts for vacuum interrupter and method of manufacturing the contact 有权
    真空灭弧室触头用触点材料及其制造方法

    公开(公告)号：US06303076B1

    公开(公告)日：2001-10-16

    申请号：US09379362

    申请日：1999-08-23

    申请人： Atsushi Yamamoto ,  Takashi Kusano ,  Tsutomu Okutomi ,  Tsuneyo Seki ,  Makoto Kataoka

    发明人： Atsushi Yamamoto ,  Takashi Kusano ,  Tsutomu Okutomi ,  Tsuneyo Seki ,  Makoto Kataoka

    IPC分类号： B22F326

    CPC分类号： H01H1/0203

    摘要： A contact material for forming a contact included in a vacuum interrupter comprises 50 to 70% by weight of a conductive material containing Cu as a principal component, an arc-proof material containing at least either TiC or VC and having a mean particle diameter of 8 &mgr;m or below, and 0.2 to 2.0% by weight of Cr on the basis of the sum of the respective amounts of Cr and Cu or 0.2 to 2/0% by weight of Zr on the basis of the sum of the respective amounts of Zr and Cu. The contact material has a hydrogen content in the range of 0.2 to 50 ppm.

    摘要翻译： 用于形成包含在真空断路器中的接点的接触材料包含50至70重量％的以Cu为主要成分的导电材料，至少含有TiC或VC并具有平均粒径为8的电弧材料 以0.2〜2.0重量％的Cr和0.2〜2/0重量％的Zr为基准，基于Zr和Zr的相对量的总和，以Cr 和铜。 接触材料的氢含量范围为0.2〜50ppm。