公开(公告)号：US06806207B2

公开(公告)日：2004-10-19

申请号：US10375852

申请日：2003-02-25

申请人： Tzu-Fang Huang ,  Yung-Cheng Lu ,  Li-Qun Xia ,  Ellie Yieh ,  Wai-Fan Yau ,  David W. Cheung ,  Ralf B. Willecke ,  Kuowei Liu ,  Ju-Hyung Lee ,  Farhad K. Moghadam ,  Yeming Jim Ma

发明人： Tzu-Fang Huang ,  Yung-Cheng Lu ,  Li-Qun Xia ,  Ellie Yieh ,  Wai-Fan Yau ,  David W. Cheung ,  Ralf B. Willecke ,  Kuowei Liu ,  Ju-Hyung Lee ,  Farhad K. Moghadam ,  Yeming Jim Ma

IPC分类号： H01L2131

CPC分类号： H01L21/31612 ,  C23C16/045 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02208 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76808 ,  H01L21/76829 ,  H01L21/76835 ,  H01L2221/1031

摘要： A silicon oxide layer is produced by plasma enhanced decomposition of an organosilicon compound to deposit films having a carbon content of at least 1% by atomic weight. An optional carrier gas may be introduced to facilitate the deposition process at a flow rate less than or equal to the flow rate of the organosilicon compounds. An oxygen rich surface may be formed adjacent the silicon oxide layer by temporarily increasing oxidation of the organosilicon compound.

摘要翻译： 氧化硅层通过有机硅化合物的等离子体增强分解产生，以沉积碳原子量至少为1％的膜。 可以引入任选的载气，以便以小于或等于有机硅化合物的流速的流速促进沉积过程。 可以通过暂时增加有机硅化合物的氧化而在氧化硅层附近形成富氧表面。

公开(公告)号：US06593247B1

公开(公告)日：2003-07-15

申请号：US09553461

申请日：2000-04-19

申请人： Tzu-Fang Huang ,  Yung-Cheng Lu ,  Li-Qun Xia ,  Ellie Yieh ,  Wai-Fan Yau ,  David W. Cheung ,  Ralf B. Willecke ,  Kuowei Liu ,  Ju-Hyung Lee ,  Farhad K. Moghadam ,  Yeming Jim Ma

发明人： Tzu-Fang Huang ,  Yung-Cheng Lu ,  Li-Qun Xia ,  Ellie Yieh ,  Wai-Fan Yau ,  David W. Cheung ,  Ralf B. Willecke ,  Kuowei Liu ,  Ju-Hyung Lee ,  Farhad K. Moghadam ,  Yeming Jim Ma

IPC分类号： H01L2131

CPC分类号： H01L21/31612 ,  C23C16/045 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02208 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76808 ,  H01L21/76829 ,  H01L21/76835 ,  H01L2221/1031

摘要： A silicon oxide layer is produced by plasma enhanced oxidation of an organosilicon compound to deposit films having a carbon content of at least 1% by atomic weight. Films having low moisture content and resistance to cracking are deposited by introducing oxygen into the processing chamber at a flow rate of less than or equal to the flow rate of the organosilicon compounds, and generating a plasma at a power density ranging between 0.9 W/cm2 and about 3.2 W/cm2. An optional carrier gas may be introduced to facilitate the deposition process at a flow rate less than or equal to the flow rate of the organosilicon compounds. The organosilicon compound preferably has 2 or 3 carbon atoms bonded to each silicon atom, such as trimethylsilane, (CH3)3SiH. An oxygen rich surface may be formed adjacent the silicon oxide layer by temporarily increasing oxidation of the organosilicon compound.

摘要翻译： 氧化硅层通过有机硅化合物的等离子体增强氧化制备，以沉积碳原子量至少为1％的膜。 通过以小于或等于有机硅化合物的流速的流量将氧引入处理室，并且以0.9W / cm 2的功率密度产生等离子体来沉积具有低水分含量和耐开裂性的膜 和约3.2W / cm 2。 可以引入任选的载气，以便以小于或等于有机硅化合物的流速的流速促进沉积过程。 有机硅化合物优选与每个硅原子键合2或3个碳原子，例如三甲基硅烷，（CH 3）3 SiH。 可以通过暂时增加有机硅化合物的氧化而在氧化硅层附近形成富氧表面。

公开(公告)号：US07160821B2

公开(公告)日：2007-01-09

申请号：US10765361

申请日：2004-01-27

申请人： Tzu-Fang Huang ,  Yung-Cheng Lu ,  Li-Qun Xia ,  Ellie Yieh ,  Wai-Fan Yau ,  David W. Cheung ,  Ralf B. Willecke ,  Kuowei Liu ,  Ju-Hyung Lee ,  Farhad K. Moghadam ,  Yeming Jim Ma

发明人： Tzu-Fang Huang ,  Yung-Cheng Lu ,  Li-Qun Xia ,  Ellie Yieh ,  Wai-Fan Yau ,  David W. Cheung ,  Ralf B. Willecke ,  Kuowei Liu ,  Ju-Hyung Lee ,  Farhad K. Moghadam ,  Yeming Jim Ma

IPC分类号： H01L21/02 ,  H01L21/469

CPC分类号： H01L21/31612 ,  C23C16/045 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02208 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76808 ,  H01L21/76829 ,  H01L21/76835 ,  H01L2221/1031

摘要： A silicon oxide layer is produced by plasma enhanced decomposition of an organosilicon compound to deposit films having a carbon content of at least 1% by atomic weight. An optional carrier gas may be introduced to facilitate the deposition process at a flow rate less than or equal to the flow rate of the organosilicon compounds. An oxygen rich surface may be formed adjacent the silicon oxide layer by temporarily increasing oxidation of the organosilicon compound.

摘要翻译： 氧化硅层通过有机硅化合物的等离子体增强分解产生，以沉积碳原子量至少为1％的膜。 可以引入任选的载气，以便以小于或等于有机硅化合物的流速的流速促进沉积过程。 可以通过暂时增加有机硅化合物的氧化而在氧化硅层附近形成富氧表面。

公开(公告)号：US06709715B1

公开(公告)日：2004-03-23

申请号：US09336368

申请日：1999-06-17

申请人： Chi-I Lang ,  Shin-Puu Jeng ,  Yeming Jim Ma ,  Fong Chang ,  Peter Wai-Man Lee ,  David W. Cheung

发明人： Chi-I Lang ,  Shin-Puu Jeng ,  Yeming Jim Ma ,  Fong Chang ,  Peter Wai-Man Lee ,  David W. Cheung

IPC分类号： H05H146

CPC分类号： H01L21/3122 ,  B05D1/62 ,  C08G61/025 ,  C08G61/12 ,  C08G2261/3424 ,  C09D4/00 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32522 ,  H01L21/02126 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/76801 ,  H01L21/76807 ,  C08G77/00

摘要： A method and apparatus for depositing a low dielectric constant film by plasma assisted copolymerization of p-xylylene and a comonomer having carbon-carbon double bonds at a constant RF power level from about 0W to about 100W or a pulsed RF power level from about 20W to about 160W. The copolymer film has a dielectric constant from about 2.2 to about 2.5. Preferred comonomers include tetravinyltetramethylcyclotetrasiloxane, tetraallyloxysilane, and trivinylmethylsilane. The copolymer films include at least 1% by weight of the comonomer.

摘要翻译： 一种用于通过等离子体辅助共聚对苯二甲烯和具有碳 - 碳双键的共聚单体在约0W至约100W的恒定RF功率水平或约20W至约20W的脉冲RF功率水平沉积低介电常数薄膜的方法和装置 约160W。 共聚物膜的介电常数为约2.2至约2.5。 优选的共聚单体包括四乙烯基四甲基环四硅氧烷，四烯丙氧基硅烷和三乙烯基甲基硅烷。 共聚物膜包括至少1重量％的共聚单体。

公开(公告)号：US6086952A

公开(公告)日：2000-07-11

申请号：US97365

申请日：1998-06-15

申请人： Chi-I Lang ,  Yeming Jim Ma ,  Fong Chang ,  Peter Wai-Man Lee ,  Shin-Puu Jeng ,  David Cheung

发明人： Chi-I Lang ,  Yeming Jim Ma ,  Fong Chang ,  Peter Wai-Man Lee ,  Shin-Puu Jeng ,  David Cheung

IPC分类号： C08F212/12 ,  B05D7/24 ,  C08F230/08 ,  C08G61/12 ,  H01L21/312 ,  H01L21/316 ,  C23C16/00

CPC分类号： B05D1/60

摘要： A method for forming thin polymer layers having low dielectric constants or semiconductor substrates. In one embodiment, the method includes the vaporization of stable di-p-xylylene, the pyrolytic conversion of such gaseous dimer material into reactive monomers, and blending of the resulting gaseous p-xylylene monomers with one or more comonomers having silicon-oxygen bonds and at least two pendent carbon--carbon double bonds. The copolymer films have low dielectric constants, improved thermal stability, and excellent adhesion to silicon oxide layers in comparison to parylene-N homopolymers.

摘要翻译： 一种形成具有低介电常数或半导体衬底的薄聚合物层的方法。 在一个实施方案中，该方法包括稳定的二对二甲苯的蒸发，将这种气态二聚体材料热解转化为反应性单体，以及将所得气态对二甲苯单体与一个或多个具有硅 - 氧键的共聚单体共混， 至少两个悬挂的碳 - 碳双键。 与聚对二甲苯-N均聚物相比，共聚物膜具有低介电常数，改善的热稳定性和与氧化硅层的优异粘附性。