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公开(公告)号：US06665186B1
公开(公告)日：2003-12-16
申请号：US10280642
申请日：2002-10-24
IPC分类号： H05K720
CPC分类号： H01L23/42 , H01L21/563 , H01L23/16 , H01L23/473 , H01L2224/32225 , H01L2224/32245
摘要： A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.
摘要翻译： 散热系统利用高导电性液体金属的薄层来为诸如半导体芯片的电子子组件提供冷却。 液体金属优选是镓或其合金，其将热量从芯片传递到散热器或散热器。 该系统包括一个或多个通气口，其允许填充和排出由液体占据的空间。 它还使用柔性密封件，例如O形圈或用保持环保持在适当位置的膜，或密封填充通气口的塞子。 密封件弯曲以适应液体的膨胀和收缩，以及从液相到固相的相变。
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公开(公告)号：US06665187B1
公开(公告)日：2003-12-16
申请号：US10198393
申请日：2002-07-16
申请人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
发明人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
IPC分类号： H05K720
CPC分类号： H01L23/10 , H01L23/36 , H01L23/42 , H01L23/427 , H01L24/73 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/00012 , H01L2924/00
摘要： An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
摘要翻译： 一种具有一个或多个部件的电子封装件，包括：具有第一热膨胀系数的基板; 盖子，附着在基板上，盖子包括蒸汽室，盖子具有第二热膨胀系数，第一热膨胀系数与第二膨胀系数匹配; 与每个部件的背面接触的热转印介质和盖的下壁的外表面; 并且每个部件电连接到基板的顶表面。
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公开(公告)号：US07186590B2
公开(公告)日：2007-03-06
申请号：US10665669
申请日：2003-09-18
申请人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
发明人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
IPC分类号： H01L21/44
CPC分类号： H01L23/10 , H01L23/36 , H01L23/42 , H01L23/427 , H01L24/73 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/00012 , H01L2924/00
摘要： An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
摘要翻译： 一种具有一个或多个部件的电子封装件，包括：具有第一热膨胀系数的基板; 盖子，附着在基板上，盖子包括蒸汽室，盖子具有第二热膨胀系数，第一热膨胀系数与第二膨胀系数匹配; 与每个部件的背面接触的热转印介质和盖的下壁的外表面; 并且每个部件电连接到基板的顶表面。
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公开(公告)号：US20130025839A1
公开(公告)日：2013-01-31
申请号：US13189980
申请日：2011-07-25
申请人： Frank Egitto , Voya R. Markovich , Varaprasad V. Calmidi , Timothy Antesberger , William E. Wilson
发明人： Frank Egitto , Voya R. Markovich , Varaprasad V. Calmidi , Timothy Antesberger , William E. Wilson
CPC分类号： H01L23/145 , F28F2013/006 , H01L23/3677 , H01L23/49822 , H01L23/49894 , H01L24/16 , H01L2224/131 , H01L2224/16235 , H01L2224/81191 , H01L2224/81192 , H01L2924/12042 , H05K1/0206 , H05K3/4679 , Y10T29/49826 , Y10T428/24322 , H01L2924/014 , H01L2924/00
摘要： An organic substrate capable of providing effective heat transfer through its entire thickness by the use of parallel, linear common thermally conductive openings that extend through the substrate, the substrate having thin dielectric layers bonded together to form an integral substrate structure. The structure is adapted for assisting in providing cooling of high temperature electrical components on one side by effectively transferring heat from the components to a cooling structure positioned on an opposing side. Methods of making the substrate are also provided, as is an electrical assembly including the substrate, component and cooling structure.
摘要翻译： 一种能够通过使用延伸穿过衬底的平行的线性共同导热开口，通过其整个厚度提供有效的热传递的有机衬底，该衬底具有结合在一起的细介电层以形成一体的衬底结构。 该结构适于通过有效地将热量从部件传递到位于相对侧的冷却结构来辅助提供一侧的高温电气部件的冷却。 还提供制造基板的方法，以及包括基板，部件和冷却结构的电气组件。
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5.发明授权Method of making wirebond electronic package with enhanced chip pad design 失效制造具有增强的芯片焊盘设计的引线键合电子封装的方法公开(公告)号：US07510912B2
公开(公告)日：2009-03-31
申请号：US11822573
申请日：2007-07-09
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.
摘要翻译： 一种制造引线键合电子封装的方法，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。 这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。 同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。
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6.发明授权Method of inspecting articles using imaging inspection apparatus with directional cooling 有权使用具有定向冷却的成像检查装置检查物品的方法公开(公告)号：US07510324B2
公开(公告)日：2009-03-31
申请号：US11882473
申请日：2007-08-02
IPC分类号： H01J35/12
CPC分类号： G01N23/046 , G01N2223/419
摘要： A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
摘要翻译： 使用成像检查装置检查制品的方法，所述成像检查装置利用多个单独的成像装置将光束引导到其上具有物体的物品上，以根据建立的标准检测物体。 该方法涉及对发热成像装置进行增强的冷却，其中风扇将冷却流体引导到多个偏转器上，反过来将导流体引导到所选择的成像装置上。
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公开(公告)号：US07354197B2
公开(公告)日：2008-04-08
申请号：US11141494
申请日：2005-06-01
IPC分类号： H01J35/10 , H01J35/12 , H05G1/02 , G01N23/083
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
摘要翻译： 一种成像检查装置，其利用位于框架上的多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。 该装置利用冷却结构为成像装置提供冷却。
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8.发明申请公开(公告)号：US20080144768A1
公开(公告)日：2008-06-19
申请号：US12071537
申请日：2008-02-22
IPC分类号： G01N23/04
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.
摘要翻译： 一种制造成像检查装置的方法，其包括将多个单独的成像装置（例如，X射线计算机断层摄影扫描装置）定位在框架上，用于将束指向具有其中的物体的物品，以基于建立的标准检测物体。 该方法还包括以这样的方式提供冷却结构，以便在设备操作期间将冷却流体引导到成像装置上以冷却它们。
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9.发明授权Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same 失效具有增强的芯片焊盘设计的Wirebond电子封装，其制造方法以及利用它的信息处理系统公开(公告)号：US07253518B2
公开(公告)日：2007-08-07
申请号：US11152048
申请日：2005-06-15
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.
摘要翻译： 一种引线键合电子封装，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。 这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。 同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。 还提供了制造包装的方法，以及适于利用这种包装的信息处理系统（例如，计算机）。
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公开(公告)号：US07183642B2
公开(公告)日：2007-02-27
申请号：US10241994
申请日：2002-09-11
IPC分类号： H01L23/36 , H01L23/34 , H01L31/024
CPC分类号： H01L23/42 , H01L21/563 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/0401
摘要： Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
摘要翻译： 从芯片和包含芯片的电子封装中去除由工作IC芯片产生的热量对于正确的系统操作和延长电子封装的寿命至关重要。 使用具有电子封装的透气盖增加远离IC芯片和电子封装的热传递，从而冷却芯片和封装。
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