公开(公告)号：US20070086168A1

公开(公告)日：2007-04-19

申请号：US11249911

申请日：2005-10-13

申请人： Vijayeshwar Khanna ,  Joseph Kuczynski ,  Arvind Sinha ,  Sri Sri-Jayantha

发明人： Vijayeshwar Khanna ,  Joseph Kuczynski ,  Arvind Sinha ,  Sri Sri-Jayantha

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

摘要翻译： 传热组件包括支撑包括一个或多个半导体芯片的电子部件组件的印刷电路板组件。 散热器组件适于与一个或多个半导体芯片热接合。 包括用于将一个或多个半导体芯片加载以与散热器组件接合的装载组件。 提供了一种封装机构，其包含足够量的导热介质以在半导体芯片和散热器组件中的一个或多个的表面之间传递热量，其中导热介质填充一个或多个半导体芯片之间的任何间隙或空间 半导体芯片和散热器组件。

公开(公告)号：US20060124705A1

公开(公告)日：2006-06-15

申请号：US11008769

申请日：2004-12-09

申请人： Joseph Kuczynski ,  Arvind Sinha ,  Timothy Tofil

发明人： Joseph Kuczynski ,  Arvind Sinha ,  Timothy Tofil

IPC分类号： B23K31/02

CPC分类号： H05K3/3494 ,  B23K1/005 ,  B23K2101/40 ,  H05K2201/10734 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/081 ,  H05K2203/1572 ,  H05K2203/1581

摘要： A reflow heating system includes a housing assembly defining an internal thermal processing chamber that encapsulates at least a microelectronic assembly on a substrate. A first heating source is coupled to the housing assembly and within the thermal processing chamber. The first heating source is biased by a force-applying assembly into engagement with the microelectronic assembly. The first heating source comprises one or more heating platens adapted to engage the microelectronic assembly for applying direct heat sufficient to melt solder. A vacuum assembly is incorporated in the heating platen for allowing application of at least a partial vacuum to the microelectronic assembly to permit withdrawal thereof from the substrate. A radiant heating source is applied beneath the substrate and a directional heating source is applied to the microelectronic assembly.

摘要翻译： 回流加热系统包括限定内部热处理室的壳体组件，其将至少一个微电子组件封装在衬底上。 第一加热源联接到壳体组件并在热处理室内。 第一加热源由施力组件偏压成与微电子组件接合。 第一加热源包括适于接合微电子组件的一个或多个加热压板，用于施加足以熔化焊料的直接热。 真空组件被结合在加热台板中，以允许至少部分真空施加到微电子组件以允许从基板取出。 将辐射加热源施加在基底下方，并将定向加热源施加到微电子组件。

公开(公告)号：US20060170904A1

公开(公告)日：2006-08-03

申请号：US11050053

申请日：2005-02-03

申请人： Joseph Kuczynski ,  Arvind Sinha ,  Kevin Splittstoesser ,  Timothy Tofil ,  Paul Vermilyea

发明人： Joseph Kuczynski ,  Arvind Sinha ,  Kevin Splittstoesser ,  Timothy Tofil ,  Paul Vermilyea

IPC分类号： G01B11/16

CPC分类号： G01K5/52 ,  G01K5/72 ,  G01K11/32 ,  G05D23/1917 ,  G05D23/27

摘要： Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.

摘要翻译： 公开了热管理方法，系统和计算机程序产品，其包括安装在印刷板上的至少一个光学应变计，所述光学应变计附近被监测用于温度变化的物体。 响应于计量器的光学参考信号的变化来修改对对象的热控制的功率，由此这种变化与被测物体相对于被监视物体的预定温度变化测量的物体中的应变变化速率相关。

公开(公告)号：US20080090440A1

公开(公告)日：2008-04-17

申请号：US11865103

申请日：2007-10-01

申请人： Brian Beaman ,  Joseph Kuczynski ,  Theron Lewis ,  Amanda Mikhail ,  Arvind Sinha

发明人： Brian Beaman ,  Joseph Kuczynski ,  Theron Lewis ,  Amanda Mikhail ,  Arvind Sinha

IPC分类号： H01R13/62

CPC分类号： H01R13/533 ,  H01R12/716 ,  Y10T29/49222

摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

摘要翻译： 说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的热膨胀系数的差异的方法。 插座包括表面安装的触点和细长的外壳。 细长壳体包括孔，其中表面安装的接触件从孔径延伸。 至少一个板连接到细长壳体，其中至少一个板具有选择的热膨胀系数以补偿插座和印刷电路板之间的热膨胀系数差。

公开(公告)号：US20080000087A1

公开(公告)日：2008-01-03

申请号：US11774723

申请日：2007-07-09

申请人： Joseph Kuczynski ,  Arvind Sinha

发明人： Joseph Kuczynski ,  Arvind Sinha

IPC分类号： G03C5/00 ,  B05D3/12

CPC分类号： H05K1/0203 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0272 ,  H05K1/0366 ,  H05K3/3452 ,  H05K3/429 ,  H05K2201/064 ,  H05K2203/1394 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/4935 ,  H01L2924/00

摘要： A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.

摘要翻译： 芯片模块传热装置包括一个或多个芯片，通过控制的崩溃芯片连接（C4）焊接点电连接到模块基板。 优选为FR-4层叠体或其他有机基板的模块基板在其上形成有切口通道。 永久性焊接掩模层叠在切口通道上以形成与输入和输出端口流体连通的散热通道。 C4焊点包括将芯片上的端子电连接到通过掩模暴露的衬底上相应的附接焊盘的焊球。 散热通道沿连续焊盘排。 诸如惰性全氟化碳流体之类的冷却流体由于散热通道而流过，以便由于芯片和衬底之间的热膨胀系数（CTE）不匹配而消除热量并减轻焊球上的应变。

公开(公告)号：US20060090918A1

公开(公告)日：2006-05-04

申请号：US10981021

申请日：2004-11-04

申请人： John Dangler ,  Phillip Isaacs ,  Arvind Sinha

发明人： John Dangler ,  Phillip Isaacs ,  Arvind Sinha

IPC分类号： H01L23/28 ,  H05K5/06

CPC分类号： H05K5/0213 ,  H01L23/573 ,  H01L23/585 ,  H01L2924/0002 ,  H05K5/0208 ,  Y10T29/49885 ,  H01L2924/00

摘要： A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside the outer case, the vent channel passing between overlapping layers of the tamper sensing mesh and having at least one right angle bend along its length. The venting device consists of two strips of a thin polyamide coverlay material laminated together along their length, and a length of wool yarn sandwiched between the two thin strips and extending from one end of the strips to the other end of the strips to form the vent channel. The length of yarn follows a zig-zag path between the first and second strips, the zig-zag path including at least one right angle bend.

摘要翻译： 用于电子电路的防篡改外壳包括内铜壳，围绕内壳缠绕的篡改感测网，包围内壳和篡改感测网的外铜壳，以及从内部内部形成通风通道的排气装置 壳体到外壳外部，排气通道在篡改感测网的重叠层之间通过，并且沿其长度具有至少一个直角弯曲。 排气装置由沿着其长度层压在一起的两条薄的聚酰胺覆盖层材料组成，并且一长度的羊毛纱线夹在两条薄条之间并从条的一端延伸到条的另一端以形成通风口 渠道。 纱线的长度遵循第一和第二条带之间的之字形路径，之字形路径包括至少一个直角弯曲部。

公开(公告)号：US06800271B2

公开(公告)日：2004-10-05

申请号：US10112044

申请日：2002-04-01

申请人： Arvind Sinha ,  Jui Chakraborty ,  Samar Das ,  Swapan K. Das ,  Venkatesh Rao ,  Patcha R. Rao

发明人： Arvind Sinha ,  Jui Chakraborty ,  Samar Das ,  Swapan K. Das ,  Venkatesh Rao ,  Patcha R. Rao

IPC分类号： C01G4900

CPC分类号： B82Y30/00 ,  C01G49/08 ,  C01P2004/50 ,  C01P2004/52 ,  C01P2004/54 ,  C01P2004/64 ,  H01F1/0045 ,  H01F1/0063

摘要： The present invention relates to a biomimetic process for preparation of nanosized magnetite particles used for the enhancement of magnetic resonance imaging contrast.

摘要翻译： 本发明涉及用于增强磁共振成像对比度的纳米级磁铁矿颗粒的制备仿生方法。

公开(公告)号：US20070241449A1

公开(公告)日：2007-10-18

申请号：US11766997

申请日：2007-06-22

申请人： John Colbert ,  Justin Rogers ,  Arvind Sinha

发明人： John Colbert ,  Justin Rogers ,  Arvind Sinha

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/4006 ,  G06F1/20 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/73204 ,  H01L2224/73253

摘要： Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

摘要翻译： 装置和方法包括使用裸模微电子器件; 散热器组件; 散热器安装组件，用于独立于裸露的微电子器件安装散热器组件; 以及施力机构，其在受控的作用力下将裸模的表面在与散热器组件的热界面处直接传热关系。

公开(公告)号：US20050006055A1

公开(公告)日：2005-01-13

申请号：US10607361

申请日：2003-06-26

申请人： John Colbert ,  Roger Hamilton ,  Arvind Sinha

发明人： John Colbert ,  Roger Hamilton ,  Arvind Sinha

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including at least one mounting member directly coupled to the base and for direct attachment to the electronic component so that loading forces for mounting on it the electronic component are not directly applied to the base. The thermally conductive member is a graphite-based material. A compliant force applying mechanism is mounted generally on the base for controlling forces applied on the base.

摘要翻译： 传热装置包括导热构件，其包括具有适于吸收来自电子部件的热量的一个或多个表面的底座和安装组件，该安装组件包括至少一个安装构件，该至少一个安装构件直接连接到基座并用于直接附接到电子部件，因此 用于安装在其上的电子部件的负载力不直接施加到基座。 导热构件是石墨基材料。 柔性力施加机构通常安装在基座上以控制施加在基座上的力。

公开(公告)号：US20050275420A1

公开(公告)日：2005-12-15

申请号：US10865253

申请日：2004-06-10

申请人： John Colbert ,  Roger Hamilton ,  Arvind Sinha

发明人： John Colbert ,  Roger Hamilton ,  Arvind Sinha

IPC分类号： G01R31/02 ,  H05K3/30 ,  H05K7/10

CPC分类号： H05K7/1061 ,  H05K3/301 ,  H05K3/303

摘要： An apparatus adapted for use in a field replacement unit that is to be coupled to an electronic module. Included in the apparatus are a cover assembly; a biasing assembly disposed within the cover assembly; and, an aligning and coupling mechanism retained in the cover assembly in juxtaposed relation with the biasing assembly for mounting an interposer assembly in a manner, whereby the interposer assembly is generally self-aligned along in-plane axes with respect to the cover assembly for subsequent coupling to an electronic module. A method for use of the apparatus is disclosed.

摘要翻译： 一种适用于要耦合到电子模块的现场更换单元的设备。 装置中包括盖组件; 设置在所述盖组件内的偏置组件; 以及保持在盖组件中的对准和联接机构，其与偏置组件并置关系，用于以一种方式安装插入件组件，由此插入器组件通常相对于盖组件沿着平面轴线自对准，用于随后 耦合到电子模块。 公开了一种使用该装置的方法。