公开(公告)号：US20060221578A1

公开(公告)日：2006-10-05

申请号：US11093445

申请日：2005-03-30

申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

摘要翻译： 用于常规存储器模块（例如DIMM）的h9接收器设备，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。

公开(公告)号：US20070211438A1

公开(公告)日：2007-09-13

申请号：US11748020

申请日：2007-05-14

申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

公开(公告)号：US20070201212A1

公开(公告)日：2007-08-30

申请号：US11746322

申请日：2007-05-09

申请人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

发明人： Jimmy Foster ,  Michael June ,  Vinod Kamath ,  Beth Loebach ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

摘要翻译： 用于常规存储器模块（例如DIMM）的散热装置，其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离，使得当放置在相邻的存储器模块之间时，弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物，用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时，单个散热器件便于从两个相邻的存储器模块散热。

公开(公告)号：US20050141194A1

公开(公告)日：2005-06-30

申请号：US10747569

申请日：2003-12-29

申请人： Vinod Kamath ,  Beth Loebach ,  Albert Makley

发明人： Vinod Kamath ,  Beth Loebach ,  Albert Makley

IPC分类号： H01L23/427 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.

摘要翻译： 声学和热能管理系统和方法包括微处理器和与微处理器一定距离的热质量传感器，微处理器和热质量以将热能从微处理器转移到热质量的方式热连接到微处理器。 声学和热能管理系统将热量从微处理器传递到热质量，以消除微处理器处的热量，从而限制风扇的运行或操作水平。

公开(公告)号：US20060215366A1

公开(公告)日：2006-09-28

申请号：US11088661

申请日：2005-03-24

申请人： Vinod Kamath ,  Albert Makley ,  Jason Matteson

发明人： Vinod Kamath ,  Albert Makley ,  Jason Matteson

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus, system, and method are disclosed for removing excess heat from a component. A heat sink is included and located in an area in a computer with excess cooling capacity. A heat pipe is included and is connected to the heat sink and extends to a heat sensitive component located in the computer. A heat conducting compliance pad is connected to the heat sensitive component. A heat conducting metallic connector is connected to the heat pipe and to the compliance pad.

摘要翻译： 公开了用于从部件去除多余热量的装置，系统和方法。 包括散热器，位于具有过冷却能力的计算机的区域中。 包括热管并且连接到散热器并延伸到位于计算机中的热敏元件。 导热符合垫连接到热敏部件。 导热金属连接器连接到热管和柔性垫。

公开(公告)号：US09307674B2

公开(公告)日：2016-04-05

申请号：US13102200

申请日：2011-05-06

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H01L23/427 ,  H01L23/473 ,  H05K7/20 ,  F28D15/02

CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

公开(公告)号：US09027360B2

公开(公告)日：2015-05-12

申请号：US13102195

申请日：2011-05-06

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： F25D23/12 ,  F25D17/06

CPC分类号： H05K7/20763 ,  F25B21/02 ,  F25B21/04 ,  F25D17/06 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却 热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

公开(公告)号：US08638559B2

公开(公告)日：2014-01-28

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US08493738B2

公开(公告)日：2013-07-23

申请号：US13102211

申请日：2011-05-06

申请人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

公开(公告)号：US20130074339A1

公开(公告)日：2013-03-28

申请号：US13247275

申请日：2011-09-28

申请人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： B21D53/02 ,  B23P15/26

CPC分类号： B23P15/26 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/53113 ,  H01L2924/00

摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

摘要翻译： 提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。 实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。