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公开(公告)号：US08638559B2
公开(公告)日：2014-01-28
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
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2.发明授权Liquid-cooling memory modules with liquid flow pipes between memory module sockets 有权内存模块插槽之间具有液体流管的液冷存储器模块公开(公告)号：US08587943B2
公开(公告)日：2013-11-19
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US20130147503A1
公开(公告)日：2013-06-13
申请号：US13323330
申请日：2011-12-12
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.
摘要翻译： 一种液体冷却刨床，包括：一个或多个安装在所述刨床上的计算部件，其中至少一个或多个所述计算部件是液体冷却的; 安装在刨床上的一个或多个导电冷却组件; 以及安装在刨床上的一个或多个对流冷却部件，其中所述对流冷却部件可从所述刨床移除，而不从所述刨床移除所述导电冷却部件。
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4.发明申请LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS 有权存储器模块插座之间液体流管的液体冷却存储器模块公开(公告)号：US20130135812A1
公开(公告)日：2013-05-30
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US20130120926A1
公开(公告)日：2013-05-16
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
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6.发明申请公开(公告)号：US20130194745A1
公开(公告)日：2013-08-01
申请号：US13360328
申请日：2012-01-27
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
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7.发明授权公开(公告)号：US08659897B2
公开(公告)日：2014-02-25
申请号：US13360328
申请日：2012-01-27
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
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公开(公告)号：US09307674B2
公开(公告)日：2016-04-05
申请号：US13102200
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20 , F28D15/02
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
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9.发明授权Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system 有权多组分电子系统的热电增强型液态冷却公开(公告)号：US09027360B2
公开(公告)日：2015-05-12
申请号：US13102195
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
CPC分类号： H05K7/20763 , F25B21/02 , F25B21/04 , F25D17/06 , H05K7/20254 , H05K7/20263 , H05K7/20781 , H05K7/2079 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却 热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。
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10.发明授权Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效冷却电子系统，散热器将电子卡耦合到冷轨公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。
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