公开(公告)号：US08587943B2

公开(公告)日：2013-11-19

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。

公开(公告)号：US08638559B2

公开(公告)日：2014-01-28

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US20130147503A1

公开(公告)日：2013-06-13

申请号：US13323330

申请日：2011-12-12

申请人： Vinod Kamath ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Vinod Kamath ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： G01R31/02 ,  G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20772

摘要： A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.

摘要翻译： 一种液体冷却刨床，包括：一个或多个安装在所述刨床上的计算部件，其中至少一个或多个所述计算部件是液体冷却的; 安装在刨床上的一个或多个导电冷却组件; 以及安装在刨床上的一个或多个对流冷却部件，其中所述对流冷却部件可从所述刨床移除，而不从所述刨床移除所述导电冷却部件。

公开(公告)号：US20130135812A1

公开(公告)日：2013-05-30

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  F28F9/02

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。

公开(公告)号：US20130120926A1

公开(公告)日：2013-05-16

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： G06F1/20 ,  F28F7/00

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US09307674B2

公开(公告)日：2016-04-05

申请号：US13102200

申请日：2011-05-06

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H01L23/427 ,  H01L23/473 ,  H05K7/20 ,  F28D15/02

CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

公开(公告)号：US09027360B2

公开(公告)日：2015-05-12

申请号：US13102195

申请日：2011-05-06

申请人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： F25D23/12 ,  F25D17/06

CPC分类号： H05K7/20763 ,  F25B21/02 ,  F25B21/04 ,  F25D17/06 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却 热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

公开(公告)号：US08493738B2

公开(公告)日：2013-07-23

申请号：US13102211

申请日：2011-05-06

申请人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

公开(公告)号：US20130074339A1

公开(公告)日：2013-03-28

申请号：US13247275

申请日：2011-09-28

申请人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Michael A. Boraas ,  Vinod Kamath ,  Michael S. Miller ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： B21D53/02 ,  B23P15/26

CPC分类号： B23P15/26 ,  H01L21/565 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/53113 ,  H01L2924/00

摘要： Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

摘要翻译： 提供了用于形成包覆成型的双列直插存储器模块（DIMM）冷却结构的方法，装置和计算机程序产品。 实施例包括通过标签模块识别指示拍摄照片的情况的上下文信息; 基于上下文信息，由标签模块从与用户的简档相关联的多个朋友简档中选择候选简档; 并且通过标签模块向用户提示所选择的候选简档作为在照片中标记的潜在朋友。

公开(公告)号：US08687364B2

公开(公告)日：2014-04-01

申请号：US13283933

申请日：2011-10-28

申请人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H05K7/20

CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。