摘要:
A high voltage transistor with high speed capability is disposed in a semiconductor body having a thickness greater than about 100 microns. The collector region adjoining one major surface of the semiconductor body has two collector portions: A first collector portion adjoins selected internal portions of the major surface and has an impurity concentration at the major surface of greater than about 8 X 1018 atoms/cm3. A second collector portion adjoins the major surface at peripheral portions contiguously around the first collector portion and adjoins the first collector portion interior of the body at said internal portions and has a resistivity throughout of greater than 30 ohm-cm. Said second collector portion at said internal portions has a substantially uniform thickness of at least about 30 microns and a reach-through voltage less than the avalanche breakdown voltage thereof, and said second collector portion at said peripheral portions has a thickness at least about 20% greater than the thickness of said second collector portion at said internal portions. Further, the width of the second collector portion at said peripheral portions is greater than 1 and preferably less than 3 times the thickness of the second collector portion at said internal portions. The base region of the transistor adjoins the second collector portion interior of the body and has a minority carrier diffusion length at least an order of magnitude greater than the thickness of the base region at said internal portions. Preferably, the first collector portion laterally circumscribes the emitter region of the transistor by at least the thickness of the second collector portion at the internal portions of the body.
摘要:
A surface gate-induced semiconductor device is provided which exhibits conductivity modulated transient negative resistance. First and second base electrodes are spaced from each other and make ohmic contact to a semiconductor body adjacent a major surface thereof. An insulator layer with a gate electrode thereon is positioned on a major surface of the semiconductor body between the base electrodes. A gate bias voltage is applied to the gate electrode to form an inversion layer in the semiconductor body at the major surface adjacent the gate electrode. The modulation control signal is also applied to the gate electrode to inject minority carriers from the inversion layer into the semiconductor body and conductivity modulate an electric field applied across the body between the base electrodes by an interbase voltage source. The device is characterized by an operational parameter h 1 greater than 1 and preferably greater than 3. The semiconductor devices can be utilized in a spaced parallel array, preferably with common base electrodes, to form a neuristor device capable of propagating a minority carrier traveling wave without attenuation.