公开(公告)号：US4855796A

公开(公告)日：1989-08-08

申请号：US871236

申请日：1986-06-06

申请人： Wah S. Wong ,  Cheng P. Wen ,  Jen K. Kung

发明人： Wah S. Wong ,  Cheng P. Wen ,  Jen K. Kung

IPC分类号： H01L21/329 ,  H01L23/482 ,  H01L29/41 ,  H01L29/872

CPC分类号： H01L21/263 ,  H01L23/4822 ,  H01L24/01 ,  H01L29/41 ,  H01L29/66212 ,  H01L29/872 ,  H01L2924/12032 ,  H01L2924/3011

摘要： A beam lead diode configuration is described, employing a planar proton bombarded conversion region and a low-permittivity dielectric separator. The diode enjoys the mechanical ruggedness of the conventional planar diodes and the electrical performance of conventional mesa-type diodes. The diode structure results in the absence of N-type mesa structures on the substrate, allowing fabrication by relatively low-cost, high-yield photolithographic processes.

摘要翻译： 使用平面质子轰击转换区和低介电常数介质分离器来描述束引线二极管配置。 二极管具有常规平面二极管的机械坚固性和常规台面型二极管的电性能。 二极管结构导致在衬底上不存在N型台面结构，允许通过相对低成本的高产量光刻工艺制造。

公开(公告)号：US5877560A

公开(公告)日：1999-03-02

申请号：US803655

申请日：1997-02-21

申请人： Cheng P. Wen ,  Kuo-Hsin Li ,  Wah S. Wong

发明人： Cheng P. Wen ,  Kuo-Hsin Li ,  Wah S. Wong

IPC分类号： H01L23/66 ,  H05K3/34 ,  H01L23/488 ,  H01L23/50 ,  H05K1/18

CPC分类号： H01L23/66 ,  H05K3/3452 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2201/2081 ,  H05K2203/0315

摘要： A monolithic flip chip microwave integrated circuit module formed using titanium coated copper circuitry and a processing method. A dam is formed on a substrate by forming a thin protective layer such as titanium or other metal on a copper layer formed on a surface of the substrate to which a monolithic microwave integrated circuit is to be attached. The protective layer is oxidized upon exposure to air. Vias or openings are then formed in the oxidized protective layer. Solder is disposed in the openings in the oxidized protective layer, and is confined to the openings while solder is reflowed to attach the integrated circuit to the substrate. The oxidized protective layer serves a dual function that provides both a solder dam and a protective coating for the underlying copper circuitry. Copper surfaces not covered by the oxidized protective layer may be environmentally protected by depositing a thin layer containing electroless plated nickel and electroless plated gold.

摘要翻译： 使用镀钛铜电路形成的单片倒装芯片微波集成电路模块及其加工方法。 通过在形成有单片微波集成电路的基板的表面上形成的铜层上形成诸如钛或其它金属的薄保护层，在基板上形成堤坝。 保护层在暴露于空气中时被氧化。 然后在氧化保护层中形成通孔或开口。 焊料设置在氧化保护层的开口中，并且被限制在开口处，而焊料被回流以将集成电路附接到衬底。 氧化保护层具有双重功能，同时为下面的铜电路提供焊接和保护涂层。 未被氧化保护层覆盖的铜表面可以通过沉积含有无电镀镍和无电镀金的薄层来进行环境保护。

公开(公告)号：US5514838A

公开(公告)日：1996-05-07

申请号：US314461

申请日：1994-09-27

申请人： Cheng P. Wen ,  Wah S. Wong ,  Min-Wen Chiang

发明人： Cheng P. Wen ,  Wah S. Wong ,  Min-Wen Chiang

IPC分类号： H01L23/485 ,  H01L23/498 ,  H01L23/66 ,  H05K1/09

CPC分类号： H01L24/10 ,  H01L23/49816 ,  H01L23/49866 ,  H01L23/66 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1423

摘要： An integrated circuit assembly that prevents silver migration by providing conductive rims around oxidizable silver contacts that contact a substrate. Typically the silver contacts are supported by respective metal pads on the substrate with a contact potential existing at each contact-pad junction. In many applications an electrical circuit transmits electrical signals via the contacts to produce potential differences between the contacts and create electrical fields at their surfaces. The conductive rims have a work function that is sufficiently small to reduce the electric fields and contact potentials so as to inhibit the ionization of the oxidized contacts' surfaces and prevent silver migration across the metal pads and the substrate.

摘要翻译： 一种集成电路组件，其通过在与基板接触的可氧化银触点周围设置导电边框来防止银迁移。 通常，银触点由衬底上的相应金属焊盘支撑，每个触点焊点处存在接触电位。 在许多应用中，电路经由触点传输电信号，以产生触点之间的电位差并在其表面产生电场。 导电边缘具有足够小的功函数以减小电场和接触电位，从而抑制氧化的接触表面的电离，并防止银迁移穿过金属焊盘和衬底。

公开(公告)号：US5773897A

公开(公告)日：1998-06-30

申请号：US803656

申请日：1997-02-21

申请人： Cheng P. Wen ,  Wah S. Wong

发明人： Cheng P. Wen ,  Wah S. Wong

IPC分类号： H01L23/485 ,  H01L23/66 ,  H05K1/09 ,  H01L29/46

CPC分类号： H01L23/66 ,  H01L24/11 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11901 ,  H01L2224/11902 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787

摘要： Mushroom-shaped, solder-capped, small-diameter (approximately 50 to 75 microns or less), metal bumps are used in the flip chip monolithic microwave integrated circuits (MMICs) attachment process to provide devices having improved solder volume uniformity. The operation of the MMIC device is extended to millimeter-wave frequencies. The self-alignment property of the solder reflow flip chip attachment process is retained, and enhanced by the solder cap that extends beyond the periphery of the metal bump. Solder flux instead of solder paste patterns are printed on the assembly substrate to facilitate flip chip attachment. The metal bumps comprise electroplated silver pillars having a first diameter capped with electroplated solder having a second diameter, where the second diameter is larger than the first diameter, and are formed using a multi-layer negative photoresist, multiple exposure processing sequence.

摘要翻译： 在倒装芯片单片微波集成电路（MMIC）连接工艺中使用蘑菇形，焊锡封口，小直径（约50至75微米或更小）的金属凸块，以提供具有改善的焊料体积均匀性的器件。 MMIC器件的工作扩展到毫米波频率。 保留焊料回流倒装芯片附着工序的自对准性，并且通过延伸超出金属凸块周边的焊锡帽来增强。 将焊剂代替焊膏图案印刷在组件基板上以便于倒装芯片附接。 金属凸块包括具有第一直径的电镀银柱，其具有第二直径的电镀焊料，其中第二直径大于第一直径，并且使用多层负性光致抗蚀剂形成多次曝光处理顺序。

公开(公告)号：US5998817A

公开(公告)日：1999-12-07

申请号：US963529

申请日：1997-11-03

申请人： Cheng P. Wen ,  Peter Chu ,  Michael R. Cole ,  Wah S. Wong ,  Robert F. Wang ,  Liping D. Hou

发明人： Cheng P. Wen ,  Peter Chu ,  Michael R. Cole ,  Wah S. Wong ,  Robert F. Wang ,  Liping D. Hou

IPC分类号： H01L25/18 ,  H01L23/482 ,  H01L23/66 ,  H01L25/04 ,  H01L29/80

CPC分类号： H01L23/4824 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/3011

摘要： A multicell transistor for use in a circuit has an input ground plane for an input waveguide and an output ground plane for an output waveguide. The multicell transistor includes a gate electrode coupled to the input waveguide, a drain electrode coupled to the output waveguide, and a source electrode coupled to the input ground plane. An output ground strap spaced from the drain electrode couples the output ground plane to the source electrode. A pair of transmission lines are orthogonally connected to and extend from the gate electrode to form a pair of inductors for matching the impedances of the gate electrode and the input waveguide.

摘要翻译： 用于电路的多晶体管晶体管具有用于输入波导的输入接地平面和用于输出波导的输出接地平面。 多晶体管晶体管包括耦合到输入波导的栅电极，耦合到输出波导的漏电极和耦合到输入接地层的源电极。 与漏极间隔开的输出接地带将输出接地平面耦合到源电极。 一对传输线与栅电极正交连接并从栅电极延伸，形成一对用于匹配栅电极和输入波导的阻抗的电感器。

公开(公告)号：US5861341A

公开(公告)日：1999-01-19

申请号：US680453

申请日：1996-07-15

申请人： Cheng P. Wen ,  Wah S. Wong ,  Arlene E. Arthur

发明人： Cheng P. Wen ,  Wah S. Wong ,  Arlene E. Arthur

IPC分类号： H01L23/66 ,  H01L21/441

CPC分类号： H01L23/66 ,  H01L2924/0002

摘要： A thin film (at least one atomic layer to about 400 .ANG.) of nickel is electrolytically plated on top of electrolytically-plated gold electrodes in GaAs monolithic microwave integrated circuits (MMICs) without any additional photoresist masking step. The thin electrolytically-plated nickel film improves adhesion of a passivating dielectric layer (e.g., silicon dioxide, silicon nitride, and silicon oxynitride) formed on the electrolytically-plated gold electrodes. The electrolytically-plated nickel film can be removed locally to facilitate the fabrication of plated silver bumps (for off-chip electrical connections and thermal paths) on passivated flip chip MMICs.

摘要翻译： 在GaAs单片微波集成电路（MMIC）中的电解电镀金电极的顶部上电解电镀镍（至少一个原子层至约400）的镍膜，而无需任何额外的光刻胶掩模步骤。 薄的电解镍膜改善了在电解镀金的金电极上形成的钝化介质层（例如，二氧化硅，氮化硅和氮氧化硅）的粘附性。 可以局部去除电解镍膜，以便于在钝化倒装芯片MMIC上制造电镀银凸块（片外电连接和热路径）。

公开(公告)号：US5708283A

公开(公告)日：1998-01-13

申请号：US771458

申请日：1996-12-20

申请人： Cheng P. Wen ,  Wah S. Wong ,  William D. Gray

发明人： Cheng P. Wen ,  Wah S. Wong ,  William D. Gray

IPC分类号： H01L21/60 ,  H01L23/482 ,  H01L23/485 ,  H01L23/66 ,  H01L23/367

CPC分类号： H01L24/10 ,  H01L23/4821 ,  H01L23/66 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13064 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/30107

摘要： A high power, flip-chip microwave monolithic integrated circuit (MMIC) assembly (30) has a high power microwave monolithic integrated circuit (MMIC) having a surface with an active area (72) in which heat is generated. The assembly also has a host substrate (34). A thermally conductive bump (51) formed over the surface of the MMIC has a first portion (51') in close proximity to and in thermal communication with the active area (72) of the MMIC and a second portion (51") which is in close proximity to and in thermal communication with the host substrate (34). The second portion (51") of the thermal bump (51) has a greater cross-sectional area than the first portion (51'). A multi-layer, multi-exposure method of manufacturing the improved thermal bump (51) includes several steps. A plating membrane (80) is formed on a surface of the MMIC (32). A first layer of negative photoresist is applied to the surface of the plating membrane (80), and is exposed with a first masked pattern of light. A second layer of negative photoresist is applied on top of the first layer of photoresist. The second layer of negative photoresist is exposed with a second masked pattern of light. Unexposed areas of the first and second layers of photoresist form a "T" shape. The first and second layers of photoresist are developed with a photoresist developer, thereby leaving a "T"-shaped via in the photoresist. An electrically and thermally conductive metal is plated onto the plating membrane and into the via to form a substantially "T"-shaped bump (51), which is then attached to a host substrate. The resulting bump has greater cross-sectional area at the host substrate than at the MMIC (32).

摘要翻译： 高功率，倒装芯片微波单片集成电路（MMIC）组件（30）具有高功率微波单片集成电路（MMIC），其具有其中产生热的有源区域（72）的表面。 组件还具有主体衬底（34）。 形成在MMIC的表面上的导热凸块（51）具有与MMIC的有源区域（72）紧密并且与热连通的第一部分（51'）和第二部分（51“），第二部分 与主机基板（34）紧密接触并与其进行热连通。 热凸块（51）的第二部分（51“）具有比第一部分（51'）更大的横截面面积。 制造改进的热凸块（51）的多层多曝光方法包括几个步骤。 在MMIC（32）的表面上形成电镀膜（80）。 将第一层负性光致抗蚀剂施加到镀膜（80）的表面，并以第一掩蔽图案曝光。 在第一层光致抗蚀剂的顶部上施加第二层负性光致抗蚀剂。 用第二掩模图案曝光第二层负性光致抗蚀剂。 第一和第二层光致抗蚀剂的未曝光区域形成“T”形。 光致抗蚀剂的第一层和第二层用光致抗蚀剂显影剂显影，从而在光致抗蚀剂中留下“T”形通孔。 将导电和导电的金属镀在镀膜上并通入通孔中，以形成基本上“T”形的凸块（51），然后将其附着到主体衬底上。 所得到的凸起在主体衬底处具有比在MMIC（32）处具有更大的横截面面积。

公开(公告)号：US5616517A

公开(公告)日：1997-04-01

申请号：US616414

申请日：1996-03-15

申请人： Cheng P. Wen ,  Wah S. Wong ,  William D. Gray

发明人： Cheng P. Wen ,  Wah S. Wong ,  William D. Gray

IPC分类号： H01L21/60 ,  H01L23/482 ,  H01L23/485 ,  H01L23/66 ,  H01L21/44

CPC分类号： H01L24/10 ,  H01L23/4821 ,  H01L23/66 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13064 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/30107

摘要： A high power, flip-chip microwave monolithic integrated circuit (MMIC) assembly (30) has a high power microwave monolithic integrated circuit (MMIC) having a surface with an active area (72) in which heat is generated. The assembly also has a host substrate (34). A thermally conductive bump (51) formed over the surface of the MMIC has a first portion (51') in close proximity to and in thermal communication with the active area (72) of the MMIC and a second portion (51") which is in close proximity to and in thermal communication with the host substrate (34). The second portion (51") of the thermal bump (51) has a greater cross-sectional area than the first portion (51'). A multi-layer, multi-exposure method of manufacturing the improved thermal bump (51) includes several steps. A plating membrane (80) is formed on a surface of the MMIC (32). A first layer of negative photoresist is applied to the surface of the plating membrane (80), and is exposed with a first masked pattern of light. A second layer of negative photoresist is applied on top of the first layer of photoresist. The second layer of negative photoresist is exposed with a second masked pattern of light. Unexposed areas of the first and second layers of photoresist form a "T" shape. The first and second layers of photoresist are developed with a photoresist developer, thereby leaving a "T"-shaped via in the photoresist. An electrically and thermally conductive metal is plated onto the plating membrane and into the via to form a substantially "T"-shaped bump (51), which is then attached to a host substrate. The resulting bump has greater cross-sectional area at the host substrate than at the MMIC (32).

摘要翻译： 高功率，倒装芯片微波单片集成电路（MMIC）组件（30）具有高功率微波单片集成电路（MMIC），其具有其中产生热的有源区域（72）的表面。 组件还具有主体衬底（34）。 形成在MMIC的表面上的导热凸块（51）具有与MMIC的有源区域（72）紧密并且与热连通的第一部分（51'）和第二部分（51“），第二部分 与主机基板（34）紧密接触并与其进行热连通。 热凸块（51）的第二部分（51“）具有比第一部分（51'）更大的横截面面积。 制造改进的热凸块（51）的多层多曝光方法包括几个步骤。 在MMIC（32）的表面上形成电镀膜（80）。 将第一层负性光致抗蚀剂施加到镀膜（80）的表面，并以第一掩蔽图案曝光。 在第一层光致抗蚀剂的顶部上施加第二层负性光致抗蚀剂。 用第二掩模图案曝光第二层负性光致抗蚀剂。 第一和第二层光致抗蚀剂的未曝光区域形成“T”形。 光致抗蚀剂的第一层和第二层用光致抗蚀剂显影剂显影，从而在光致抗蚀剂中留下“T”形通孔。 将导电和导电的金属镀在镀膜上并通入通孔中，以形成基本上“T”形的凸块（51），然后将其附着到主体衬底上。 所得到的凸起在主体衬底处具有比在MMIC（32）处具有更大的横截面面积。

公开(公告)号：US06207903B1

公开(公告)日：2001-03-27

申请号：US09209659

申请日：1998-12-10

申请人： Cheng P. Wen ,  Linda P. B. Katehi ,  Stephen Robertson ,  Thomas Ellis ,  Katherine Herrick ,  Gabriel M. Rebeiz

发明人： Cheng P. Wen ,  Linda P. B. Katehi ,  Stephen Robertson ,  Thomas Ellis ,  Katherine Herrick ,  Gabriel M. Rebeiz

IPC分类号： H05K100

CPC分类号： H01P1/047 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/00

摘要： Structures and methods that provide for via transitions between opposite sides of a high resistivity silicon micro-machined membrane substrate. The via transitions provide ground-signal-ground interconnection between coplanar waveguides disposed on opposite sides of substrate. Adjacent via transitions are anisotropically etched from opposite surfaces of the substrate to form the via transitions. The ground-signal-ground configuration provides RF impedance matching at the via transition.

摘要翻译： 提供高电阻硅微加工膜基板的相对侧之间的通孔的结构和方法。 通孔转换在布置在衬底的相对侧上的共面波导之间提供接地信号 - 接地互连。 相邻的通孔转变从衬底的相对表面各向异性地蚀刻以形成通孔转变。 接地信号接地配置在通孔转换时提供RF阻抗匹配。

公开(公告)号：US5077593A

公开(公告)日：1991-12-31

申请号：US457613

申请日：1989-12-27

申请人： Robert N. Sato ,  Chan-Shin Wu ,  Cheng P. Wen

发明人： Robert N. Sato ,  Chan-Shin Wu ,  Cheng P. Wen

IPC分类号： H01L31/0352

CPC分类号： B82Y20/00 ,  H01L31/035236

摘要： A multiquantum well superlattice photodetector for detecting long wavelength infrared radiation in which dark current is reduced by a blocking layer. The tunneling component of the dark current in a multiquantum well photodetector is substantially eliminated by placing a blocking layer at one end of the superlattice. The blocking layer has a potential energy barrier having a height at the same level of the barrier layers of the superlattice. The thickness of the blocking layer is substantially greater than the barrier layers of the superlattice to prevent charge carriers which tunnel through the superlattice from reaching the ohmic contact.

摘要翻译： 一种用于检测长波长红外辐射的多量子阱超晶格光电探测器，其中暗电流被阻挡层减小。 通过在超晶格的一端放置阻挡层，基本上消除了多量子阱光电探测器中的暗电流的隧穿分量。 阻挡层具有在超晶格的阻挡层的相同水平处具有高度的势垒。 阻挡层的厚度基本上大于超晶格的阻挡层，以防止穿过超晶格的电荷载体达到欧姆接触。