摘要:
A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.
摘要:
A layered heater structure including an electrode layer and a localized tuning method for tuning the electrode layer of a layered heater structure with high precision is provided. The localized tuning method tunes the electrode layer to its proper local resistance to minimize temperature offsets on the heater surface and thus provide a desired thermal profile that is in marked contrast to conventional, non-localized resistance tuning approaches based on thickness trimming practices, such as grinding or blasting, or resistivity adjustment, such as local heat treatment.
摘要:
A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations employing connectors and fillers having excellent chemical resistant properties and optimized CTEs, i.e., having a coefficient of thermal expansion (CTE) that closely matches the CTE of the base substrate layer, the electrode(s), as well as the CTE of coating layer. In one embodiment, a nickel plated molybdenum insert is employed.
摘要:
A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.
摘要:
A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.
摘要:
An etch resistant heater for use in a wafer processing assembly with an excellent ramp rate of at least 20° C. per minute. The heater is coated with a protective overcoating layer allowing the heater to have a radiation efficiency above 70% at elevated heater temperatures of >1500° C., and an etch rate in NF3 at 600° C. of less than 100 A/min.
摘要:
A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.
摘要:
A thermally conductive laminate comprising a first substrate, a second substrate, and a performance layer disposed between the first substrate and the second substrate. The performance layer comprising thermal pyrolytic graphite (TPG) and vias. The TPG board surface and the vias may be at least partially filled with a material comprising at least one of thermally conductive epoxy, soldering metal/alloy or brazing metal/alloy. In addition, the thermally conductive laminate may not contain a framing structure surrounding the performance layer.
摘要:
A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.
摘要:
An improved microfluidic system with an improved microfluidic valve module is disclosed. The microfluidic system includes a microfluidic chip and one or more valve modules. The microfluidic chip has microfluidic channels and one or more cavities formed in the chip, each of the one or more cavities designed to receive one of the one or more valve modules. Each of the one or more valve modules includes a first layer, a control layer and one or more second layers. The first layer includes a deformable material. The control layer has a microfluidic control chamber formed in a portion of it. The control layer is also located adjoining the first layer and the deformable material of the first layer forms a deformable surface of the control chamber. The one or more second layers include an input microfluidic channel and an output microfluidic channel. The input microfluidic channel and the output microfluidic channel are fluidically coupled to the microfluidic control chamber, and fluid flow through the input microfluidic channel, the microfluidic control chamber and the output microfluidic channel is controlled in response to a force deforming the deformable material of the first layer at least a predetermined amount.