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    Optical device including waveguide grating structure
    2.
    发明授权
    Optical device including waveguide grating structure 有权
    光器件包括波导光栅结构

    公开(公告)号：US07548671B2

    公开(公告)日：2009-06-16

    申请号：US11879242

    申请日：2007-07-16

    申请人： Wei Wu ,  David Fattal ,  Charles Santori ,  Robert N. Bicknell ,  Shih-Yuan Wang ,  R. Stanley Williams ,  Nathaniel J. Quitoriano

    发明人： Wei Wu ,  David Fattal ,  Charles Santori ,  Robert N. Bicknell ,  Shih-Yuan Wang ,  R. Stanley Williams ,  Nathaniel J. Quitoriano

    IPC分类号： G02B6/34

    CPC分类号： G02B6/12007 ,  G02B6/124 ,  G02F1/0126 ,  G02F1/3515 ,  G02F2201/307

    摘要： Optical devices including waveguide grating structures are described. In accordance with one embodiment, an optical device is provided comprising a horizontal waveguide grating structure having at least one waveguiding layer and at least one subwavelength periodic grating layer. The optical device further comprises upper and lower cladding layers immediately adjoining respective upper and lower surfaces of the waveguide grating structure and having refractive indices lower than a lowest-index one of the waveguiding layers, incident radiation propagating through one of the upper and lower cladding layers toward the waveguide grating structure. The waveguide grating structure is configured for peak reflection of the incident radiation at a peak reflection frequency. A cumulative thickness of the waveguiding layers is less than one tenth of a free space wavelength of the incident radiation at the peak reflection frequency divided by an average refractive index of the waveguiding layers.

    摘要翻译： 描述了包括波导光栅结构的光学器件。 根据一个实施例，提供一种光学装置，其包括具有至少一个波导层和至少一个亚波长周期光栅层的水平波导光栅结构。 该光学器件还包括紧邻波导光栅结构的相应上表面和下表面的上和下包层，其折射率低于波导层中的最低折射率之一，入射辐射通过上，下包层中的一个传播 朝向波导光栅结构。 波导光栅结构被配置为以峰值反射频率对入射辐射进行峰值反射。 波导层的累积厚度小于峰值反射频率处入射的辐射的自由空间波长除以波导层的平均折射率的十分之一。

    Optical interconnect
    5.
    发明申请
    Optical interconnect 有权
    光互连

    公开(公告)号：US20090034985A1

    公开(公告)日：2009-02-05

    申请号：US11881943

    申请日：2007-07-30

    申请人： David A. Fattal ,  Robert N. Bicknell ,  Charles Santori ,  Wei Wu

    发明人： David A. Fattal ,  Robert N. Bicknell ,  Charles Santori ,  Wei Wu

    IPC分类号： H04B10/00

    CPC分类号： H04B10/803

    摘要： An optical interconnect includes a first circuit board having an optical source and an optical receiver; and a second circuit board having data source and an optical modulator optically coupled with the optical source and optical receiver, wherein the optical modulator is configured to encode data from the data source into an optical signal from the optical source. The optical receiver is configured to receive the optical signal from the optical modulator. A method of optical communication includes generating on a first circuit board an optical signal directed at a second circuit board; modulating the optical signal with data at the second circuit board; reflecting the optical signal to the first circuit board; and demodulating the optical signal to receive the data at the first circuit board.

    摘要翻译： 光学互连包括具有光源和光接收器的第一电路板; 以及第二电路板，其具有数据源和与所述光源和光接收器光学耦合的光学调制器，其中所述光学调制器被配置为将来自所述数据源的数据编码为来自所述光源的光信号。 光接收器被配置为从光调制器接收光信号。 一种光通信方法包括在第一电路板上产生指向第二电路板的光信号; 用第二电路板上的数据调制光信号; 将光信号反射到第一电路板; 以及解调所述光信号以在所述第一电路板处接收所述数据。

    Optical interconnect
    6.
    发明授权
    Optical interconnect 有权

    公开(公告)号：US08929741B2

    公开(公告)日：2015-01-06

    申请号：US11881943

    申请日：2007-07-30

    申请人： David A. Fattal ,  Robert N. Bicknell ,  Charles Santori ,  Wei Wu

    发明人： David A. Fattal ,  Robert N. Bicknell ,  Charles Santori ,  Wei Wu

    IPC分类号： H04B10/80

    CPC分类号： H04B10/803

    摘要： An optical interconnect includes a first circuit board having an optical source and an optical receiver; and a second circuit board having data source and an optical modulator optically coupled with the optical source and optical receiver, wherein the optical modulator is configured to encode data from the data source into an optical signal from the optical source. The optical receiver is configured to receive the optical signal from the optical modulator. A method of optical communication includes generating on a first circuit board an optical signal directed at a second circuit board; modulating the optical signal with data at the second circuit board; reflecting the optical signal to the first circuit board; and demodulating the optical signal to receive the data at the first circuit board.

    Methods for coupling diamond structures to photonic devices
    7.
    发明授权
    Methods for coupling diamond structures to photonic devices 有权
    将金刚石结构耦合到光子器件的方法

    公开(公告)号：US08039845B2

    公开(公告)日：2011-10-18

    申请号：US12228039

    申请日：2008-08-08

    申请人： Charles Santori ,  Sean Spillane ,  Marco Fiorentino ,  David Fattal ,  Raymond G. Beausoleil ,  Wei Wu ,  Theodore I. Kamins

    发明人： Charles Santori ,  Sean Spillane ,  Marco Fiorentino ,  David Fattal ,  Raymond G. Beausoleil ,  Wei Wu ,  Theodore I. Kamins

    IPC分类号： H01L29/66 ,  H01L21/00

    CPC分类号： G02B6/122 ,  G02F2202/32

    摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a photonic device is optically coupled with a diamond structure. The photonic device comprises a semiconductor material and is optically coupled with the diamond structure with an adhesive substance that adheres the photonic device to the diamond structure. A method for coupling the photonic device with the diamond structure is also provided. The method comprises: depositing a semiconductor material on the diamond structure; forming the photonic device in the semiconductor material so that the photonic device couples with the diamond structure; and adhering the photonic device to the diamond structure.

    摘要翻译： 本发明的各种实施例涉及将基于半导体的光子器件耦合到金刚石的方法。 在本发明的一个实施例中，光子器件与金刚石结构光学耦合。 光子器件包括半导体材料，并与金刚石结构光学耦合，粘合剂物质将光子器件粘附到金刚石结构上。 还提供了一种用于将光子器件与金刚石结构耦合的方法。 该方法包括：在金刚石结构上沉积半导体材料; 在半导体材料中形成光子器件，使得光子器件与金刚石结构耦合; 并将光子器件粘附到金刚石结构上。

    Methods for coupling diamond structures to photonic devices
    8.
    发明申请
    Methods for coupling diamond structures to photonic devices 有权
    将金刚石结构耦合到光子器件的方法

    公开(公告)号：US20080303049A1

    公开(公告)日：2008-12-11

    申请号：US12228039

    申请日：2008-08-08

    申请人： Charles Santori ,  Sean Spillane ,  Marco Fiorentino ,  David Fattal ,  Raymond G. Beausoleil ,  Wei Wu ,  Theodore I. Kamins

    发明人： Charles Santori ,  Sean Spillane ,  Marco Fiorentino ,  David Fattal ,  Raymond G. Beausoleil ,  Wei Wu ,  Theodore I. Kamins

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： G02B6/122 ,  G02F2202/32

    摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a photonic device is optically coupled with a diamond structure. The photonic device comprises a semiconductor material and is optically coupled with the diamond structure with an adhesive substance that adheres the photonic device to the diamond structure. A method for coupling the photonic device with the diamond structure is also provided. The method comprises: depositing a semiconductor material on the diamond structure; forming the photonic device in the semiconductor material so that the photonic device couples with the diamond structure; and adhering the photonic device to the diamond structure.

    摘要翻译： 本发明的各种实施例涉及将基于半导体的光子器件耦合到金刚石的方法。 在本发明的一个实施例中，光子器件与金刚石结构光学耦合。 光子器件包括半导体材料，并与金刚石结构光学耦合，粘合剂物质将光子器件粘附到金刚石结构上。 还提供了一种用于将光子器件与金刚石结构耦合的方法。 该方法包括：在金刚石结构上沉积半导体材料; 在半导体材料中形成光子器件，使得光子器件与金刚石结构耦合; 并将光子器件粘附到金刚石结构上。

    Methods for coupling diamond structures to photonic devices
    10.
    发明申请
    Methods for coupling diamond structures to photonic devices 有权
    将金刚石结构耦合到光子器件的方法

    公开(公告)号：US20080096308A1

    公开(公告)日：2008-04-24

    申请号：US11580344

    申请日：2006-10-13

    申请人： Charles Santori ,  Sean Spillane ,  Marco Fiorentino ,  David Fattal ,  Raymond G. Beausoleil ,  Wei Wu ,  Theodore I. Kamins

    发明人： Charles Santori ,  Sean Spillane ,  Marco Fiorentino ,  David Fattal ,  Raymond G. Beausoleil ,  Wei Wu ,  Theodore I. Kamins

    IPC分类号： H01L21/00

    CPC分类号： G02B6/122 ,  G02F2202/32

    摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a method for coupling a photonic device with a diamond structure comprises embedding the diamond structure in a first substrate, where the first substrate comprises a first transparent material. The photonic device is formed in a semiconductor material, which is supported by a second substrate. An intermediate structure is formed by depositing a second transparent material over the photonic device. The second transparent material may have substantially the same refractive index as the first transparent material. The intermediate structure is then separated from the second substrate, and the intermediated structure is adhered to the first substrate so that the photonic device optically couples with the diamond structure.

    摘要翻译： 本发明的各种实施例涉及将基于半导体的光子器件耦合到金刚石的方法。 在本发明的一个实施例中，用于将光子器件与金刚石结构耦合的方法包括将金刚石结构嵌入第一衬底中，其中第一衬底包括第一透明材料。 光子器件形成在由第二衬底支撑的半导体材料中。 通过在光子器件上沉积第二透明材料形成中间结构。 第二透明材料可以具有与第一透明材料基本上相同的折射率。 然后将中间结构与第二衬底分离，并且中间结构粘附到第一衬底，使得光子器件与金刚石结构光学耦合。