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42 条记录 (耗时 0.028 秒)

    Plasma display panel and method of forming the same
    1.
    发明授权
    Plasma display panel and method of forming the same 失效
    等离子显示面板及其形成方法

    公开(公告)号：US07081706B2

    公开(公告)日：2006-07-25

    申请号：US10792880

    申请日：2004-03-05

    申请人： Wen-Rung Huang ,  Ching-Chung Cheng ,  Yuan-Chi Lin ,  Yu-Wen Chen

    发明人： Wen-Rung Huang ,  Ching-Chung Cheng ,  Yuan-Chi Lin ,  Yu-Wen Chen

    IPC分类号： H01J17/49

    CPC分类号： H01J11/24 ,  H01J11/12 ,  H01J2211/245

    摘要： A plasma display panel with a plurality of non-transparent display electrode pairs and a method of forming the same. Each electrode of every non-transparent display electrode pair is separated from but close to one another for effective discharging. For effective displaying, it is necessary that the area of the non-transparent display electrodes is smaller than the area of the panel. In the present invention, the shape of the non-transparent display electrodes are manufactured in a shape with a plurality of openings, such as a ladder or a chain.

    摘要翻译： 一种具有多个非透明显示电极对的等离子体显示面板及其形成方法。 每个非透明显示电极对的每个电极彼此分离，但是彼此接近以进行有效放电。 为了有效显示，非透明显示电极的面积必须小于面板的面积。 在本发明中，不透明显示电极的形状被制造成具有多个开口的形状，例如梯子或链条。

    Fixing structure and electronic device using the same
    3.
    发明授权
    Fixing structure and electronic device using the same 有权
    固定结构及使用电子装置

    公开(公告)号：US08199495B2

    公开(公告)日：2012-06-12

    申请号：US12656526

    申请日：2010-02-02

    申请人： Li-Chuan Liu ,  Yin-Ting Chen ,  Kun-Ho Lee ,  Po-Shen Hsiung ,  Yu-Wen Chen ,  Yin-Wei Yeh

    发明人： Li-Chuan Liu ,  Yin-Ting Chen ,  Kun-Ho Lee ,  Po-Shen Hsiung ,  Yu-Wen Chen ,  Yin-Wei Yeh

    IPC分类号： G06F1/16

    CPC分类号： G06F1/1679 ,  Y10T24/32

    摘要： A fixing module and an electronic device using the same are provided. The fixing module includes a male housing and a female housing. The male housing disposed in a bottom cover includes a groove, cylinder and a first magnet. The cylinder is slidingly connected to the groove, and the first magnet is disposed in the cylinder. The female housing is disposed in a top cover, including a cavity and a second magnet. The cavity is disposed in correspondence to the cylinder, and the second magnet is fixed in the cavity.

    摘要翻译： 提供了一种固定模块和使用其的电子设备。 固定模块包括阳壳体和阴壳体。 设置在底盖中的阳壳体包括槽，气缸和第一磁体。 气缸滑动地连接到凹槽，并且第一磁体设置在气缸中。 阴壳体设置在顶盖中，包括空腔和第二磁体。 空腔相对于圆柱体设置，第二磁体固定在空腔中。

    Semiconductor package structure
    8.
    发明授权
    Semiconductor package structure 有权
    半导体封装结构

    公开(公告)号：US07122893B2

    公开(公告)日：2006-10-17

    申请号：US10920077

    申请日：2004-08-17

    申请人： Gwo-Liang Weng ,  Ching-Hui Chang ,  Yung-Li Lu ,  Yu-Wen Chen

    发明人： Gwo-Liang Weng ,  Ching-Hui Chang ,  Yung-Li Lu ,  Yu-Wen Chen

    IPC分类号： H01L23/04

    CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/10155

    摘要： A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substrate. Several solder bumps are disposed in the joint area, for electrically connecting the semiconductor component and the substrate. The underfill is filled in the joint area, for coating the solder bumps and tightly jointing the semiconductor component and the substrate. The buffer means is situated in the jointing area, for buffering the underfill to be confined in the joint area. Several solder balls are disposed on the lower surface of the substrate.

    摘要翻译： 半导体封装结构包括半导体部件，衬底，焊料凸块，底部填充物，缓冲装置和焊球。 衬底在半导体部件下。 在半导体的第一表面和基板的上表面之间形成接合区域。 在接合区域设置有几个焊料凸块，用于电连接半导体部件和基板。 底部填充物填充在接合区域中，用于涂覆焊料凸块并紧密接合半导体部件和基板。 缓冲装置位于接合区域中，用于缓冲封闭在接合区域中的底部填充物。 几个焊球设置在基板的下表面上。

    [CHIP PACKAGE STRUCTURE]
    10.
    发明申请
    [CHIP PACKAGE STRUCTURE] 有权
    [芯片包装结构]

    公开(公告)号：US20050001311A1

    公开(公告)日：2005-01-06

    申请号：US10710344

    申请日：2004-07-02

    申请人： Ming-Lun Ho ,  Yu-Wen Chen

    发明人： Ming-Lun Ho ,  Yu-Wen Chen

    IPC分类号： H01L23/31 ,  H01L23/36 ,  H01L23/34 ,  H01L29/40

    CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： A chip package structure includes a substrate having an upper surface and a lower surface, a chip having an active surface and a back surface, a stiffener, a first heat sink and a second heat sink. The active surface of the chip is attached on the upper surface of the substrate via bumps, so that the chip electrically connects to the substrate. The stiffener is disposed on the upper surface of the substrate and around the chip. The first heat sink is disposed on the back surface of the chip and on the stiffener ring. The second heat sink is disposed on the lower surface of the substrate.

    摘要翻译： 芯片封装结构包括具有上表面和下表面的基板，具有活动表面和后表面的芯片，加强件，第一散热器和第二散热器。 芯片的有源表面经由凸块附着在基板的上表面上，使得芯片电连接至基板。 加强件设置在基板的上表面和芯片周围。 第一散热器设置在芯片的背面和加强环上。 第二散热器设置在基板的下表面上。