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公开(公告)号:US07067916B2
公开(公告)日:2006-06-27
申请号:US09885853
申请日:2001-06-20
申请人: William E. Bernier , Charles F. Carey , Eberhard B. Gramatzki , Thomas R. Homa , Eric A. Johnson , Pierre Langevin , Irving Memis , Son K. Tran , Robert F. White
发明人: William E. Bernier , Charles F. Carey , Eberhard B. Gramatzki , Thomas R. Homa , Eric A. Johnson , Pierre Langevin , Irving Memis , Son K. Tran , Robert F. White
IPC分类号: H01L23/48
CPC分类号: H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H05K3/3436 , H01L2924/00
摘要: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.
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公开(公告)号:US07119003B2
公开(公告)日:2006-10-10
申请号:US11148923
申请日:2005-06-08
申请人: William E. Bernier , Charles F. Carey , Eberhard B. Gramatzki , Thomas R. Homa , Eric A. Johnson , Pierre Langevin , Irving Memis , Son K. Tran , Robert F. White
发明人: William E. Bernier , Charles F. Carey , Eberhard B. Gramatzki , Thomas R. Homa , Eric A. Johnson , Pierre Langevin , Irving Memis , Son K. Tran , Robert F. White
IPC分类号: H01L21/44
CPC分类号: H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H05K3/3436 , H01L2924/00
摘要: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.
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