公开(公告)号：US07564125B2

公开(公告)日：2009-07-21

申请号：US10313078

申请日：2002-12-06

申请人： William E. Burdick, Jr. ,  James W. Rose ,  Donna M. Sherman ,  James E. Sabatini ,  George Edward Possin

发明人： William E. Burdick, Jr. ,  James W. Rose ,  Donna M. Sherman ,  James E. Sabatini ,  George Edward Possin

IPC分类号： H01L23/02

CPC分类号： G01T1/2928 ,  H04N5/335 ,  H04N5/3415

摘要： A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.

摘要翻译： 传感器阵列包括：基板，包括前侧和后侧;多个换能器，其制造在所述基板的前侧;多个输入/输出连接，位于所述基板的背面，所述输入/输出连接电气 耦合到所述换能器，至少一个电子设备和位于所述基板和所述电子设备之间的插入器，所述插入器包括被配置为将所述输入/输出连接电连接到所述电子设备的多层互连系统。

公开(公告)号：US06819001B2

公开(公告)日：2004-11-16

申请号：US10388997

申请日：2003-03-14

申请人： William E. Burdick, Jr. ,  James W. Rose

发明人： William E. Burdick, Jr. ,  James W. Rose

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached.

摘要翻译： 提供了一种插入器，插入器封装和采用其的器件组件。 插入器具有由半导体材料形成的衬底，第一输入/输出触点设置在其第一主表面上，第二输入/输出触点设置在其第二主表面上。 第二输入/输出触点电连接到第一输入/输出触点。 设置在插入器基板的第一主表面上的第一输入/输出触点用于附接到要插入插入器的装置的输入/输出焊盘。 布置在插入器基板的第二主表面上的第二输入/输出触点有助于电连接到插入器也要附接的部件。

公开(公告)号：US5230965A

公开(公告)日：1993-07-27

申请号：US895584

申请日：1992-06-08

申请人： Herbert S. Cole, Jr. ,  James W. Rose

发明人： Herbert S. Cole, Jr. ,  James W. Rose

IPC分类号： C25D5/02 ,  H01L21/48 ,  H01L23/538 ,  H05K3/10 ,  H05K3/38

CPC分类号： C25D5/024 ,  C25D5/022 ,  H01L21/4846 ,  H01L23/5389 ,  H05K3/108 ,  H01L2924/0002 ,  H05K2203/0315 ,  H05K2203/0361 ,  H05K2203/107 ,  H05K3/388 ,  Y10S428/935 ,  Y10T428/12396 ,  Y10T428/12458 ,  Y10T428/1259

摘要： Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.

摘要翻译： 在导电体或非导电体上的选择性电解沉积是通过在被电镀体的表面上形成一层形成电镀防止化合物的金属来提供的，并且将镀覆金属选择性地相互扩散到该镀层的表面中 在需要电镀的地方进行化合物形成金属，并对其进行电镀。 可以在化合物形成层的表面上形成电镀防止化合物之前或之后进行相互扩散。 在电镀期间，电镀金属只能沉积在可镀金属与化合物形成金属相互扩散的位置。 在该过程结束时，化合物形成金属可以在未被电镀金属覆盖的那些位置处被去除以提供多个单独的电镀导体。

公开(公告)号：US5178976A

公开(公告)日：1993-01-12

申请号：US580058

申请日：1990-09-10

申请人： James W. Rose ,  Bradley R. Karas ,  Lubomry S. Onyshkevych

发明人： James W. Rose ,  Bradley R. Karas ,  Lubomry S. Onyshkevych

IPC分类号： G03F1/00 ,  H05K1/00 ,  H05K3/00

CPC分类号： H05K3/0002 ,  G03F1/70 ,  H05K1/0284 ,  H05K2203/056 ,  H05K2203/107

摘要： A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises an opaque layer, opaque and degradation resistant to UV light, having at least one side with a contoured shape conforming to the surface irregularities on the surfaces of the three-dimensional substrate being photo-imaged. A membrane transparent and degradation resistant to UV light, having at least one side cemented to the side of the opaque layer not in contact with the surfaces of the three-dimensional substrate being photo-imaged. A pattern of grooves positioned on the opaque layer allow transmission of UV light during the photo-imaging of the surfaces of the three-dimensiional substrate. The pattern of grooves is in accordance with a conductive metal trace pattern desired on the surfaces of the three-dimensional printed circuit board substrate. The photo-mask is prepared by first forming an opaque material layer on the surfaces of the three-dimensional substrate, followed by a membrane material to form the membrane. The pattern of grooves is created by ablating the opaque layer in selected areas by means of a laser beam from a laser moved in a boustrophedonous manner.

摘要翻译： 一种用于制备用于对三维印刷电路板基板的表面上的选定区域进行光学成像的光掩模的方法。 所述光掩模包括不透明的并且对UV光具有耐劣化性的不透明层，其具有至少一个侧面，所述至少一个侧面具有与所述三维基板的表面上的表面不规则性相一致的光学成像。 具有至少一面粘合到不透明层的不与三维基板的表面接触的一面的紫外光透明和降解的膜被光成像。 定位在不透明层上的凹槽的图案允许在三维基底的表面的光成像期间透射UV光。 凹槽的图案与三维印刷电路板基板的表面上所需的导电金属迹线图案相一致。 通过首先在三维基板的表面上形成不透明材料层，然后形成膜材料来制备光掩模。 凹槽的图案通过借助于以双向方式移动的激光器的激光束烧蚀选定区域中的不透明层而产生。

公开(公告)号：US5008049A

公开(公告)日：1991-04-16

申请号：US410398

申请日：1989-09-21

申请人： James W. Rose ,  Theresa A. Sitnik

发明人： James W. Rose ,  Theresa A. Sitnik

IPC分类号： B29C65/14 ,  B29C65/16 ,  B29C67/00 ,  G02F1/1341

CPC分类号： B29C65/4845 ,  B29C65/1435 ,  B29C65/1483 ,  B29C65/542 ,  B29C67/004 ,  G02F1/1341 ,  B29C65/1406 ,  B29C65/1606 ,  B29C65/1635 ,  B29C65/1683

摘要： A device containing a fluid material is sealed by sealant material placed essentially completely around the periphery of the device to join spaced apart first and second members of the device; and aperture is formed through the seal and the device interior is evacuated. Then fluid material is introduced into the device interior through the aperture and only a limited region of the device, confined substantially to the aperture is exposed to electromagnetic radiation from a laser or the like, to hermetically close the aperture when a photoreactive adhesive is injected into the aperture to cause the adhesive to solidify when contacted by the electromagnetic radiation. In an alternate embodiment, the aperture is filled with a plug of thermoplastic material, which is then selectively heat treated by a laser or the like to cause the plug to bind to the aperture boundary and hermetically enclose the fluid material.

摘要翻译： 包含流体材料的装置由基本上完全围绕装置的周边放置的密封剂材料密封，以连接装置的间隔开的第一和第二构件; 并且通过密封件形成孔，并且将装置内部抽真空。 然后，流体材料通过孔被引入装置内部，并且仅当基本上限定在孔的受限区域暴露于来自激光器等的电磁辐射时，当将光反应粘合剂注入时气密地关闭孔 当电磁辐射接触时导致粘合剂固化的孔。 在替代实施例中，孔用一个热塑性材料塞填充，然后用激光等进行选择性热处理，以使塞子与孔口边界结合并气密地封闭流体材料。

公开(公告)号：US5471421A

公开(公告)日：1995-11-28

申请号：US358202

申请日：1994-12-16

申请人： James W. Rose ,  Godfrey P. D'Souza ,  Jonathan J. Stinehelfer ,  James F. Testa

发明人： James W. Rose ,  Godfrey P. D'Souza ,  Jonathan J. Stinehelfer ,  James F. Testa

IPC分类号： G11C11/412 ,  G11C11/404 ,  G11C11/407 ,  G11C11/418 ,  G11C13/00

CPC分类号： G11C11/404 ,  G11C11/418

摘要： A storage cell includes a first bit line, a storage circuit, and a pass transistor. The storage circuit has a first storage node for holding a logic state indicative of a logic value. The pass transistor is coupled to the first bit line and the first storage node for establishing a conduction path therebetween. The pass transistor receives a bias voltage to switch the pass transistor into a substantially nonconducting state when the storage cell is not being accessed. The reverse bias on the first transistor substantially reduces the leakage current through the pass transistor.

摘要翻译： 存储单元包括第一位线，存储电路和传输晶体管。 存储电路具有用于保持指示逻辑值的逻辑状态的第一存储节点。 传输晶体管耦合到第一位线和第一存储节点，用于在它们之间建立传导路径。 当存储单元不被访问时，传输晶体管接收偏置电压以将传输晶体管切换到基本上非导通状态。 第一晶体管上的反向偏压基本上减小了通过晶体管的漏电流。

公开(公告)号：US5270371A

公开(公告)日：1993-12-14

申请号：US955776

申请日：1992-10-02

申请人： Herbert S. Cole ,  James W. Rose

发明人： Herbert S. Cole ,  James W. Rose

IPC分类号： C08G73/10 ,  H01L23/498 ,  C08K5/07 ,  C08K3/10 ,  C08K3/36

CPC分类号： H01L23/49883 ,  C08G73/1064 ,  H01L2924/0002

摘要： Chip adhesives with improved working time comprise a polyetherimide prepared from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and bis(4-aminophenyl) sulfone; at least one of silica and conductive metal particles, especially silver particles; and at least one substituted acetophenone as solvent. The preferred substituted acetophenone is 4-methylacetophenone.

摘要翻译： 具有改进的工作时间的片状粘合剂包括由2,2-双[4-（3,4-二羧基苯氧基）苯基]丙烷二酐和双（4-氨基苯基）砜制备的聚醚酰亚胺; 二氧化硅和导电金属颗粒中的至少一种，特别是银颗粒; 和至少一种取代的苯乙酮作为溶剂。 优选的取代苯乙酮是4-甲基苯乙酮。

公开(公告)号：US07069228B1

公开(公告)日：2006-06-27

申请号：US09302034

申请日：1999-04-29

申请人： James W. Rose ,  Theodore C. Chen

发明人： James W. Rose ,  Theodore C. Chen

IPC分类号： G06Q10/00

CPC分类号： G06Q10/109 ,  G06F17/30864 ,  G06Q10/02 ,  G06Q10/025 ,  G06Q30/02 ,  G06Q50/12 ,  G06Q50/14

摘要： The present invention is a software product that provides merchants that sell time-slot inventories tools to capitalize on the Internet revolution. The present invention enables the creation of web-sites for merchants with a built-in web-based reservation booking system. This offers customers the on-line benefits of access, selection and immediacy in making real-time reservation/appointments over the Internet. The software product also simplifies the merchant's booking process by providing a central web-based reservation/appointment management system that can be used for all bookings, regardless if made by telephone, by a walk-in customer, or by a customer via the Internet. The software product also provides the merchant with a powerful direct marketing tool. As a merchant uses the software product, user-customer profiles and demographics are captured in the database module, thus creating (in Web jargon) a “community” of customers specific to the merchant. The merchant is thus empowered, using the mail module, to directly communicate with its customer base, using customer profiles and demographics to create a highly targeted and effective marketing and promotional ad campaign. The software product also allows the merchant to auction off time-slot inventory over the Internet. Lastly, the software product enables the creation of Web “super-communities” consisting of the aggregate of all the individual merchant's customer-communities using the software product.

摘要翻译： 本发明是提供销售时隙库存工具以利用因特网革命的商家的软件产品。 本发明使得能够使用内置的基于网络的预订系统为商家创建网站。 这为客户提供访问，选择和即时性在互联网上实时预约/约会的在线优势。 软件产品还可以通过提供一个基于网络的中央预约/预约管理系统来简化商家的预订过程，该系统可以用于所有预订，无论是通过电话，步入式客户还是通过互联网客户使用。 该软件产品还为商家提供了强大的直接营销工具。 随着商家使用软件产品，用户 - 客户资料和人口统计数据被捕获在数据库模块中，从而创建（以Web术语）商家特有的客户的“社区”。 因此，通过使用邮件模块，商人可以直接与客户沟通，使用客户资料和客层来创建高度针对性和有效的营销和促销广告活动。 该软件产品还允许商家通过互联网拍卖时隙资源。 最后，该软件产品可以创建由使用该软件产品的所有个体商家的客户社区的总和组成的Web“超级社区”。

公开(公告)号：US5141829A

公开(公告)日：1992-08-25

申请号：US580057

申请日：1990-09-10

申请人： William V. Dumas ,  Bradley R. Karas ,  Donald F. Foust ,  James W. Rose

发明人： William V. Dumas ,  Bradley R. Karas ,  Donald F. Foust ,  James W. Rose

IPC分类号： B29C51/10 ,  G03F1/00 ,  G03F1/60 ,  G03F7/20 ,  H05K1/00 ,  H05K3/00 ,  H05K9/00

CPC分类号： H05K3/0002 ,  G03F1/50 ,  G03F1/60 ,  G03F7/20 ,  B29C2791/006 ,  B29C2795/002 ,  B29C51/10 ,  H05K1/0284 ,  H05K2203/056

摘要： A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises a membrane transparent and degradation resistant to UV light, having at least one side with a contoured shape conforming, and flexible enough to comply with surface irregularities on the surfaces of the three-dimensional substrate being photo-imaged. A pattern of tracks opaque to UV light is posiitoned along the contoured shape of the membrane. The pattern of tracks on the photo-mask is in accordance with a desired conductive metal trace pattern on the surfaces of the three-dimensional printed circuit board substrate. The photo-mask is prepared by photo-imaging and then depositing a track material on a film that conformed to the surfaces of the three-dimensional substrate. An adhesive layer applied over the film cements a membrane material poured upon the adhesive layer. Once the membrane material sets into the membrane it is sepaarated from the substrate to form the photo-mask of the present invention.

摘要翻译： 一种用于制备用于对三维印刷电路板基板的表面上的选定区域进行光学成像的光掩模的方法。 所述光掩模包括透明且耐紫外光降解的膜，其具有至少一个具有轮廓形状的侧面，并且足够柔性以使其符合正在被光成像的三维基底的表面上的表面凹凸。 沿紫外光不透明的轨迹图沿着膜的轮廓形状放置。 光掩模上的轨迹图案与三维印刷电路板基板表面上所需的导电金属迹线图案相符。 通过光成像制备光掩模，然后将轨道材料沉积在符合三维基板表面的膜上。 施加在膜上的粘合剂层将浇注在粘合剂层上的膜材料粘合。 一旦膜材料进入膜，就将其从基底上分离出来形成本发明的光掩膜。

公开(公告)号：US5127998A

公开(公告)日：1992-07-07

申请号：US459844

申请日：1990-01-02

申请人： Herbert S,. Cole, Jr. ,  James W. Rose

发明人： Herbert S,. Cole, Jr. ,  James W. Rose

IPC分类号： C23C14/04 ,  C23C14/58 ,  C25D5/02 ,  H01L21/48 ,  H01L23/538 ,  H05K3/10 ,  H05K3/38

CPC分类号： H01L23/5389 ,  C25D5/022 ,  C25D5/50 ,  C25D7/123 ,  H01L21/4846 ,  H05K3/108 ,  H01L2924/0002 ,  H05K2203/0315 ,  H05K2203/0361 ,  H05K2203/107 ,  H05K3/388

摘要： Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.