公开(公告)号：US07476597B2

公开(公告)日：2009-01-13

申请号：US11456404

申请日：2006-07-10

申请人： Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

发明人： Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

IPC分类号： H01L21/322 ,  H01L21/44 ,  H01L21/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K26/0006 ,  B23K26/22 ,  B23K26/352 ,  B23K28/02 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85039 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.

摘要翻译： 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺，氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后，使自由空气球与调节的接合表面接触以形成焊缝。

公开(公告)号：US20080009129A1

公开(公告)日：2008-01-10

申请号：US11456404

申请日：2006-07-10

申请人： Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

发明人： Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K26/0006 ,  B23K26/22 ,  B23K26/352 ,  B23K28/02 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85039 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.

摘要翻译： 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺，氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后，使自由空气球与调节的接合表面接触以形成焊缝。

公开(公告)号：US06800555B2

公开(公告)日：2004-10-05

申请号：US09817696

申请日：2001-03-23

申请人： Howard R. Test ,  Gonzalo Amador ,  Willmar E. Subido

发明人： Howard R. Test ,  Gonzalo Amador ,  Willmar E. Subido

IPC分类号： H01L2144

CPC分类号： H01L23/53238 ,  H01L21/288 ,  H01L23/53233 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05184 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/0568 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/4868 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48769 ,  H01L2224/4878 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4888 ,  H01L2224/78252 ,  H01L2224/78253 ,  H01L2224/85013 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3025 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2224/48869 ,  H01L2224/48744

摘要： A robust, reliable and low-cost metal structure and process enabling electrical wire/ribbon connections to the interconnecting copper metallization of integrated circuits. The structure comprises a layer of barrier metal that resists copper diffusion, deposited on the non-oxidized copper surface in a thickness such that the barrier layer reduces the diffusion of copper at 250° C. by more than 80% compared with the absence of the barrier metal. The structure further comprises an outermost bondable layer which reduces the diffusion of the barrier metal at 250° C. by more than 80% compared with the absence of the bondable metal. Finally, a metal wire is bonded to the outermost layer for metallurgical connection. The barrier metal is selected from a group consisting of nickel, cobalt, chromium, molybdenum, titanium, tungsten, and alloys thereof. The outermost bondable metal layer is selected from a group consisting of gold, platinum, and silver.

摘要翻译： 坚固，可靠和低成本的金属结构和工艺，使电线/带能够连接到集成电路的互连铜金属化。 该结构包括阻挡铜扩散的层，其沉积在非氧化的铜表面上，其厚度使得阻挡层将铜在250℃下的扩散减少了80％以上，与不存在 屏障金属。 该结构还包括最外面的可结合层，与不存在可结合金属相比，阻挡金属在250℃下的扩散减少大于80％。 最后，将金属丝结合到用于冶金连接的最外层。阻挡金属选自镍，钴，铬，钼，钛，钨及其合金。 最外层的可焊接金属层选自金，铂和银。

公开(公告)号：US6112973A

公开(公告)日：2000-09-05

申请号：US178843

申请日：1998-10-26

申请人： Edgardo R. Hortaleza ,  Willmar E. Subido

发明人： Edgardo R. Hortaleza ,  Willmar E. Subido

IPC分类号： B23K20/00 ,  B23K20/10 ,  H01L21/607 ,  B23K1/06 ,  B23K31/02 ,  B23K37/00 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/106 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/4845 ,  H01L2224/48455 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14

摘要： A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. A second capillary is provided for forming a stitch bond to the second bonding location, the second capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal to the predetermined direction and substantially parallel to the plane of the conveying surface and a stitch bond is formed on the second bonding location with the second capillary. The second capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. The first and second capillaries are disposed at an angle of about 90 degrees with respect to each other with respect to each other in a direction normal to said plane.

摘要翻译： 一种在半导体器件中的至少一对接合位置和接合器之间接合引线的方法。 输送机具有输送表面，用于沿预定方向输送具有第一和第二粘合位置的部分制造的半导体器件。 第一毛细管被提供用于形成与第一接合位置的针脚接合，第一毛细管以相对于预定方向约45度的角度设置，并且与其垂直并且基本上平行于输送表面的平面设置。 在与第一毛细管的第一结合位置处形成针迹结合。 第一毛细管相对于与输送表面的平面垂直的线呈大致45度的角度。 提供第二毛细管用于形成与第二接合位置的针脚接合，第二毛细管相对于预定方向以大约45度的角度设置，以及垂直于预定方向的线并且基本上平行于 在第二接合位置与第二毛细管形成传送表面和针脚接合。 第二毛细管相对于垂直于输送表面平面的线呈大致45度的角度。 第一和第二毛细管以垂直于所述平面的方向相对于彼此以大约90度的角度设置。

公开(公告)号：US6131792A

公开(公告)日：2000-10-17

申请号：US517512

申请日：2000-03-02

申请人： Edgardo R. Hortaleza ,  Willmar E. Subido

发明人： Edgardo R. Hortaleza ,  Willmar E. Subido

IPC分类号： B23K20/00 ,  B23K37/00 ,  B23K1/00 ,  B23K1/19

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/49171 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

摘要： A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions. Then the first bonding head is caused to make wire bonds in a predetermined one of the plurality of regions and the second bonding head is caused to make wire bonds in a predetermined second one of the plurality of regions. The first major axis is preferably at an angle of about 45 degrees with respect to the first predetermined direction and the second major axis is preferably at an angle of about 45 degrees with respect to the second predetermined direction. The first predetermined direction is preferably substantially normal to the second predetermined direction.

公开(公告)号：US6089443A

公开(公告)日：2000-07-18

申请号：US178820

申请日：1998-10-26

申请人： Edgardo R. Hortaleza ,  Willmar E. Subido

发明人： Edgardo R. Hortaleza ,  Willmar E. Subido

IPC分类号： B23K20/00 ,  B23K31/02 ,  B23K37/04

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/49171 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

摘要： A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions. Then the first bonding head is caused to make wire bonds in a predetermined one of the plurality of regions and the second bonding head is caused to make wire bonds in a predetermined second one of the plurality of regions. The first major axis is preferably at an angle of about 45 degrees with respect to the first predetermined direction and the second major axis is preferably at an angle of about 45 degrees with respect to the second predetermined direction. The first predetermined direction is preferably substantially normal to the second predetermined direction.

摘要翻译： 一种接合线和接合器的方法，包括提供用于将线接合到接合位置的引线接合器。 引线接合器具有设计成在沿第一预定方向行进时形成线圈接合的第一接合头，第一接合头具有垂直于第一长轴的第一长轴和第一短轴，第一长轴为 角度约为45度至相对于第一预定方向大于零的有限角度;以及第二接合头，设计成在沿第二预定方向行进时形成线迹接合，所述第二接合头具有第二长轴和第二长轴 与第二长轴垂直的短轴，第二长轴相对于第二预定方向成大于零的角度约为45度。 具有接合位置的接合位置的区域被划分为多个区域。 然后使第一接合头在多个区域中的预定的一个区域中引线接合，并且使第二接合头在多个区域中的预定的第二个区域中引线接合。 第一长轴优选地相对于第一预定方向成大约45度的角度，并且第二长轴优选地相对于第二预定方向成大约45度的角度。 优选地，第一预定方向基本上垂直于第二预定方向。

公开(公告)号：US06855578B2

公开(公告)日：2005-02-15

申请号：US10222245

申请日：2002-08-16

申请人： Charles A. Odegard ,  Willmar E. Subido

发明人： Charles A. Odegard ,  Willmar E. Subido

IPC分类号： H01L21/56 ,  H01L21/48

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05169

摘要： A semiconductor assembly comprising an integrated circuit chip with a first plurality of metallic contact pads exposed, having a pitch center-to-center of less than 180 μm. A metallic bump of reflowable metal is attached to each of these contact pads. The assembly further has an electrically insulating substrate with a second plurality of metallic terminal pads in locations matching the locations of the contact pads. Each of the bumps also attached to these matching terminal pads, respectively, whereby the chip is interconnected with the substrate spaced apart by a gap. An adherent polymeric encapsulant fills the gap so that the encapsulant is free of voids.It is a pivotal feature in the method that vibration energy, up to ultrasonic frequencies, is used while the encapsulant is still in a low-viscosity precursor state in order to ensure the void-free spreading of the precursor throughout the gap between chip and substrate. The vibration energy ensures uniform underfill distribution even when the gap and the bump pitch are narrow, with uniform distribution of any fillers, and enhanced adhesion to chip, substrate and bumps.

摘要翻译： 一种半导体组件，包括具有暴露的第一多个金属接触焊盘的集成电路芯片，具有小于180μm的间距中心到中心。 可回流金属的金属凸块连接到这些接触垫中的每一个上。 该组件还具有电绝缘衬底，其具有与接触焊盘的位置匹配的位置中的第二多个金属端子焊盘。 每个凸块也分别连接到这些匹配的端子焊盘，由此芯片与间隔开间隙的衬底互连。 粘附的聚合物密封剂填充间隙，使得密封剂没有空隙。在该方法中的关键特征是使用高达超声波频率的振动能量，同时密封剂仍处于低粘度前体状态，以便 确保前体在芯片和基板之间的间隙中无空隙扩散。 振动能量即使在间隙和凸起节距较窄时也能确保均匀的底部填充分布，任何填料的分布均匀，增强了对芯片，基板和凸块的粘附力。

公开(公告)号：US06182882B2

公开(公告)日：2001-02-06

申请号：US09542005

申请日：2000-04-03

申请人： Edgardo R. Hortaleza ,  Willmar E. Subido

发明人： Edgardo R. Hortaleza ,  Willmar E. Subido

IPC分类号： B23K100

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/106 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/4845 ,  H01L2224/48455 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01039 ,  H01L2924/14 ,  H01L2224/45099

摘要： A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. A second capillary is provided for forming a stitch bond to the second bonding location, the second capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal to the predetermined direction and substantially parallel to the plane of the conveying surface and a stitch bond is formed on the second bonding location with the second capillary. The second capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. The first and second capillaries are disposed at an angle of about 90 degrees with respect to each other with respect to each other in a direction normal to said plane.

摘要翻译： 一种在半导体器件中的至少一对接合位置和接合器之间接合引线的方法。 输送机具有输送表面，用于沿预定方向输送具有第一和第二粘合位置的部分制造的半导体器件。 第一毛细管被提供用于形成与第一接合位置的针脚接合，第一毛细管以相对于预定方向约45度的角度设置，并且与其垂直并且基本上平行于输送表面的平面设置。 在与第一毛细管的第一结合位置处形成针迹结合。 第一毛细管相对于与输送表面的平面垂直的线呈大致45度的角度。 提供第二毛细管用于形成与第二接合位置的针脚接合，第二毛细管相对于预定方向以大约45度的角度设置，以及垂直于预定方向的线并且基本上平行于 在第二接合位置与第二毛细管形成传送表面和针脚接合。 第二毛细管相对于垂直于输送表面平面的线呈大致45度的角度。 第一和第二毛细管以垂直于所述平面的方向相对于彼此以大约90度的角度设置。