-
公开(公告)号:US07411270B2
公开(公告)日:2008-08-12
申请号:US11397493
申请日:2006-04-03
申请人: Won Gi Min , Geno L. Fallico , Amanda M. Kroll , Hongning Yang , Jiang-Kai Zuo
发明人: Won Gi Min , Geno L. Fallico , Amanda M. Kroll , Hongning Yang , Jiang-Kai Zuo
IPC分类号: H01L27/04
CPC分类号: H01G4/33 , H01G4/236 , H01L23/5223 , H01L27/0805 , H01L28/60 , H01L2924/0002 , H01L2924/00
摘要: An electronic assembly (98) includes a substrate (20), a capacitor having first and second conductors (38,54) formed over the substrate, a first set of conductive members (76) formed over the substrate and being electrically connected to the first conductor of the capacitor, and a second set of conductive members (78) formed over the substrate and being electrically connected to the second conductor of the capacitor.
摘要翻译: 电子组件(98)包括衬底(20),具有形成在衬底上的第一和第二导体(38,54)的电容器,形成在衬底上并且电连接到第一衬底的第一组导电构件(76) 电容器的导体,以及形成在衬底上并且电连接到电容器的第二导体的第二组导电构件(78)。