Abstract:
Digital duty cycle correction circuits are provided including a duty cycle detector circuit configured to generate first and second control values associated with a first internal clock signal and a second internal clock signal, respectively. A comparator circuit is also provided and is configured to compare the first control value to the second control value and provide a comparison result. A counter circuit is configured to perform an addition and/or a subtraction operation responsive to the comparison result to provide a digital code. A digital to analog converter is configured to generate third and fourth control values responsive to the digital code. Finally, a duty cycle corrector circuit is configured to receive first and second external clock signals and the first through fourth control values and generate the first and second internal clock signals having a corrected duty cycle. The first and second control values are received over a first path and the third and fourth control values are received over a second path, different from the first path. Related methods of operating duty cycle correction circuits are also provided.
Abstract:
The present invention relates to a passive wavelength division multiplexing device for automatic wavelength locking and a system thereof including an optical multiplexer, an optical filter, an integrated optical receiver monitor, and a tunable optical transmitter. Through wavelength locking that adjusts a wavelength of an optical signal, which changes according to an external environment such as a temperature change, into a wavelength of an optical signal having the maximum optical intensity, communication quality may be maximized by securing a stable communication channel, a locking time and a communication channel setting time may be reduced, and more robust locking may be guaranteed.
Abstract:
A method of forming a conformal dielectric film having Si—N bonds on a substrate having a patterned surface includes: introducing a reactant gas into a reaction space; introducing a silicon precursor in pulses of less than 5-second duration into the reaction space; applying a first RF power to the reaction space during the pulse of the silicon precursor; applying a second RF power to the reaction space during the interval of the silicon precursor pulse, wherein an average intensity of the second RF power during the interval of the silicon precursor pulse is greater than that of the first RF power during the pulse of the silicon precursor; and repeating the cycle to form a conformal dielectric film having Si—N bonds with a desired thickness on the patterned surface of the substrate.
Abstract:
A mobile terminal includes a housing comprising a light emitting portion disposed on at least a portion of the housing, a light emitting unit disposed inside the housing, a light transmission member configured to transmit light emitted from the light emitting unit, and a guiding structure formed on the light transmission member and configured to direct and emit the light toward the light emitting portion.
Abstract:
A method of forming a conformal dielectric film having Si—N bonds on a semiconductor substrate by plasma enhanced chemical vapor deposition (PECVD) includes: introducing a nitrogen- and hydrogen-containing reactive gas and an additive gas into a reaction space inside which a semiconductor substrate is placed; applying RF power to the reaction space; and introducing a hydrogen-containing silicon precursor in pulses into the reaction space wherein a plasma is excited, thereby forming a conformal dielectric film having Si—N bonds on the substrate.
Abstract:
A method for managing a schedule as a supplementary function of a mobile communication terminal. The method is capable of efficiently managing schedule information such as anniversaries to be repeated every year. Further, the method is capable of conveniently making contact with another party by providing telephone numbers of the other party at the same time when the schedule information is provided to a user.
Abstract:
According to an example embodiment, a semiconductor memory device may include a memory core, input circuit, and/or an output circuit. The input circuit may be configured to generate second data from first data using latch circuits operating in response to input control signals enabled during different periods. The input circuit may be further configured to provide the second data to the memory core. The second data may have 2N times the number of bits of the first data, where N is a positive integer. The output circuit may be configured to generate fourth data from third data using latch circuits operating in response to output control signals enabled during different periods. The output circuit may be further configured to provide the fourth data to data output pins. The fourth data may have ½N times the number of bits of the third data. A method of inputting/outputting data is also provided.
Abstract:
A semiconductor memory device includes a primary output driver which outputs a data signal through an output terminal; a secondary output driver which is connected to the output terminal and performs a pre-emphasis operation; and a pre-emphasis signal generator which outputs a pre-emphasis signal to enable the secondary output driver The pre-emphasis signal generator includes a auto pulse generator which generates an auto pulse in response to a transition of a control signal; a delay circuit which receives the auto pulse output from the auto pulse generator, delays the auto pulse by a predetermined period, and outputs a pre-emphasis signal; and a delay control unit which applies a delay control signal to the delay circuit and controls a delay amount of the delay circuit.
Abstract:
A method of forming a semiconductor device can include forming an insulation layer using a material having a composition selected to provide resistance to subsequent etching process. The composition of the material can be changed to reduce the resistance of the material to the subsequent etching process at a predetermined level in the insulation layer. The subsequent etching process can be performed on the insulation layer to remove an upper portion of the insulation layer above the predetermined level and leave a lower portion of the insulation layer below the predetermined level between adjacent conductive patterns extending through the lower portion of the insulation layer. A low-k dielectric material can be formed on the lower portion of the insulation layer between the adjacent conductive patterns to replace the upper portion of the insulation layer above the predetermined level.
Abstract:
A method for fabricating a semiconductor device includes sequentially forming an interlayer insulating layer and a hard mask pattern including a first opening on a substrate including a lower pattern, forming a trench exposing the lower pattern in the interlayer insulating layer using the hard mask pattern, forming a liner layer including a first part formed along sidewalls and a bottom surface of the trench and a second part formed along a top surface of the hard mask pattern, forming a sacrificial pattern exposing the second part of the liner layer in the trench, removing the second part of the liner layer and the hard mask pattern using the sacrificial pattern, and after the removing of the hard mask pattern, removing the sacrificial pattern to expose the first part of the liner layer.