-
公开(公告)号：US20240066905A1
公开(公告)日：2024-02-29
申请号：US18387643
申请日：2023-11-07
发明人： Tanya Yvette Moore , David Gomez , Christopher Andrew Bower , Matthew Alexander Meitl , Salvatore Bonafede
CPC分类号： B41K3/04 , B41F16/00 , G03F7/0002
摘要： A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
-
公开(公告)号：US11850874B2
公开(公告)日：2023-12-26
申请号：US16835159
申请日：2020-03-30
发明人： Tanya Yvette Moore , David Gomez , Christopher Andrew Bower , Matthew Alexander Meitl , Salvatore Bonafede
CPC分类号： B41K3/04 , B41F16/00 , G03F7/0002
摘要： A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
-
公开(公告)号：US20210300098A1
公开(公告)日：2021-09-30
申请号：US16835159
申请日：2020-03-30
发明人： Tanya Yvette Moore , David Gomez , Christopher Andrew Bower , Matthew Alexander Meitl , Salvatore Bonafede
摘要： A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
-
公开(公告)号：US10714374B1
公开(公告)日：2020-07-14
申请号：US16408155
申请日：2019-05-09
发明人： Ronald S. Cok , David Gomez , Tanya Yvette Moore , Matthew Alexander Meitl , Christopher Andrew Bower
IPC分类号： H01L21/683 , H01L33/00 , H01L31/18 , H01L21/52
摘要： An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.
-
公开(公告)号：US11024608B2
公开(公告)日：2021-06-01
申请号：US16039191
申请日：2018-07-18
发明人： Matthew Meitl , Brook Raymond , Ronald S. Cok , Christopher Andrew Bower , Salvatore Bonafede , Erich Radauscher , Carl Ray Prevatte, Jr. , António José Marques Trindade , Tanya Yvette Moore
IPC分类号： H01L25/075 , H01L33/00 , H01L33/62 , H01L21/683 , H01L25/00 , H01L25/04 , H01L25/07
摘要： An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.
-
公开(公告)号：US20210101329A1
公开(公告)日：2021-04-08
申请号：US17125037
申请日：2020-12-17
发明人： Tanya Yvette Moore , Ronald S. Cok , David Gomez
IPC分类号： B29C59/02 , H01L23/00 , H01L21/683 , B41F17/00 , B29C59/00
摘要： A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.
-
公开(公告)号：US11318663B2
公开(公告)日：2022-05-03
申请号：US17125037
申请日：2020-12-17
发明人： Tanya Yvette Moore , Ronald S. Cok , David Gomez
IPC分类号： B29C33/38 , B29C59/02 , H01L23/00 , H01L21/683 , B41F17/00 , B29C59/00 , B29L31/34 , B41F16/00 , B29L7/00
摘要： A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.
-
公开(公告)号：US20210193500A1
公开(公告)日：2021-06-24
申请号：US16721897
申请日：2019-12-19
发明人： Tanya Yvette Moore , David Gomez
IPC分类号： H01L21/687 , H01L21/677
摘要： A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.
-
公开(公告)号：US10937679B2
公开(公告)日：2021-03-02
申请号：US15930371
申请日：2020-05-12
发明人： Ronald S. Cok , David Gomez , Tanya Yvette Moore , Matthew Alexander Meitl , Christopher Andrew Bower
IPC分类号： H01L21/683 , H01L33/00 , H01L31/18 , H01L21/52
摘要： An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.
-
公开(公告)号：US11062936B1
公开(公告)日：2021-07-13
申请号：US16721897
申请日：2019-12-19
发明人： Tanya Yvette Moore , David Gomez
IPC分类号： H01L21/687 , B29C59/02 , H01L21/677 , H01L21/683
摘要： A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.019 秒)
