-
公开(公告)号：US08394575B2
公开(公告)日：2013-03-12
申请号：US12894930
申请日：2010-09-30
申请人： Xiaoming Wu , David Graham , Sean Weaver , Bart Mansdorf , Rich Wells , Joel Provence
发明人： Xiaoming Wu , David Graham , Sean Weaver , Bart Mansdorf , Rich Wells , Joel Provence
IPC分类号： G03F7/004
CPC分类号： G03F7/038 , G03F7/0045
摘要： Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.
摘要翻译： 公开了用于微流体喷射头和微流体喷射头的环保厚膜层。 环保厚膜层包括衍生自包含多官能环氧化合物，低分子量聚合双官能环氧化合物，单体双官能环氧化合物，不含锑的甲基化光酸产生剂的组合物的负性光致抗蚀剂层， 发色团和芳基酮溶剂。 任选地，光致抗蚀剂层含有粘合增强剂。 负光致抗蚀剂层是环境友好的并且提供良好的分辨率，良好限定的临界尺寸，直的侧壁和大的加工窗口。
-
公开(公告)号：US20120082933A1
公开(公告)日：2012-04-05
申请号：US12894930
申请日：2010-09-30
申请人： XIAOMING WU , David Graham , Sean Weaver , Bart Mansdorf , Rich Wells , Joel Provence
发明人： XIAOMING WU , David Graham , Sean Weaver , Bart Mansdorf , Rich Wells , Joel Provence
IPC分类号： G03F7/004
CPC分类号： G03F7/038 , G03F7/0045
摘要： Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.
摘要翻译： 公开了用于微流体喷射头和微流体喷射头的环保厚膜层。 环保厚膜层包括衍生自包含多官能环氧化合物，低分子量聚合双官能环氧化合物，单体双官能环氧化合物，不含锑的甲基化光酸产生剂的组合物的负性光致抗蚀剂层， 发色团和芳基酮溶剂。 任选地，光致抗蚀剂层含有粘合增强剂。 负光致抗蚀剂层是环境友好的并且提供良好的分辨率，良好限定的临界尺寸，直的侧壁和大的加工窗口。
-
3.发明授权公开(公告)号：US08785524B2
公开(公告)日：2014-07-22
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。
-
公开(公告)号：US20110319513A1
公开(公告)日：2011-12-29
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： C09J163/00
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。
-
5.发明申请METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE USING SPRAY COATABLE ADHESIVE 审中-公开使用喷涂粘合剂粘合到刚性基板上的芯片运动限制方法公开(公告)号：US20110318882A1
公开(公告)日：2011-12-29
申请号：US13168219
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： H01L21/50
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
摘要翻译： 提供了一种以适合于在喷墨打印头中制造加热器芯片的精确对准将芯片结合到晶片的方法。 该方法包括将粘合剂组合物喷涂在基材的表面上，将至少一个芯片对准并固定到涂覆有粘合剂组合物的基材上，将涂覆有至少一个涂有粘合剂组合物的芯片的基材暴露于辐射和加热， 并进行热压接。 该方法使用包含热活化粘合剂和光致酸产生剂的喷涂可涂层粘合剂组合物。
-
6.发明授权Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties 有权用于硅芯片的贴片组合物放置在具有改善的触变性能的平坦基底上公开(公告)号：US08657413B2
公开(公告)日：2014-02-25
申请号：US13008428
申请日：2011-01-18
IPC分类号： B41J2/01 , C09J163/02 , C09J183/10 , H01L21/00 , C08G59/24 , C08G59/30 , C08G59/50
CPC分类号： B41J2/01 , B41J2/0458 , C08G59/306 , C08G59/56 , C08K5/5415 , C09J163/00 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/2919 , H01L2224/32225 , H01L2224/83192 , H01L2224/83855 , H01L2924/00013 , H01L2924/10253 , H01L2924/15787 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.
摘要翻译： 使用芯片附着组合物将硅芯片粘合在平坦的基板上。 芯片附着组合物包括具有刚性主链的可交联环氧树脂，环氧硅氧烷树脂，热解法二氧化硅填料，胺固化剂和硅烷偶联剂。 芯片附着组合物在形成喷墨打印头组件时将硅加热器芯片粘合在平坦陶瓷基板上是特别有用的。 芯片附着组合物允许将硅加热器芯片精确地放置在平坦的陶瓷基板上并显示出良好的耐油墨性。
-
7.发明申请DIE ATTACH COMPOSITION FOR SILICON CHIP PLACEMENT ON A FLAT SUBSTRATE HAVING IMPROVED THIXOTROPIC PROPERTIES 有权具有改进的三面体性能的平坦基材上的硅芯片布置的附件组合物公开(公告)号：US20120182355A1
公开(公告)日：2012-07-19
申请号：US13008428
申请日：2011-01-18
CPC分类号： B41J2/01 , B41J2/0458 , C08G59/306 , C08G59/56 , C08K5/5415 , C09J163/00 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/2919 , H01L2224/32225 , H01L2224/83192 , H01L2224/83855 , H01L2924/00013 , H01L2924/10253 , H01L2924/15787 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.
摘要翻译： 使用芯片附着组合物将硅芯片粘合在平坦的基板上。 芯片附着组合物包括具有刚性主链的可交联环氧树脂，环氧硅氧烷树脂，热解法二氧化硅填料，胺固化剂和硅烷偶联剂。 芯片附着组合物在形成喷墨打印头组件时将硅加热器芯片粘合在平坦陶瓷基板上是特别有用的。 芯片附着组合物允许将硅加热器芯片精确地放置在平坦的陶瓷基板上并显示出良好的耐油墨性。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.021 秒)