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    Spray coatable adhesive for bonding silicon dies to rigid substrates
    1.
    发明授权
    Spray coatable adhesive for bonding silicon dies to rigid substrates 有权
    用于将硅模具粘合到刚性基材上的喷涂可涂层粘合剂

    公开(公告)号：US08785524B2

    公开(公告)日：2014-07-22

    申请号：US13168063

    申请日：2011-06-24

    申请人： Xiaoming Wu ,  Paul Dryer ,  David Rhine ,  Anna Pearson ,  Jeanne Marie Saldanha Singh ,  Richard Wells ,  Joel Provence

    发明人： Xiaoming Wu ,  Paul Dryer ,  David Rhine ,  Anna Pearson ,  Jeanne Marie Saldanha Singh ,  Richard Wells ,  Joel Provence

    IPC分类号： C08K5/06 ,  C08K5/07 ,  C08L63/02

    CPC分类号： B41J2/1601 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1645

    摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

    摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。

    SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES
    2.
    发明申请
    SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES 有权
    用于将硅胶粘结到刚性基材上的喷涂胶粘剂

    公开(公告)号：US20110319513A1

    公开(公告)日：2011-12-29

    申请号：US13168063

    申请日：2011-06-24

    申请人： Xiaoming Wu ,  Paul Dryer ,  David Rhine ,  Anna Pearson ,  Jeanne Marie Saldanha Singh ,  Richard Wells ,  Joel Provence

    发明人： Xiaoming Wu ,  Paul Dryer ,  David Rhine ,  Anna Pearson ,  Jeanne Marie Saldanha Singh ,  Richard Wells ,  Joel Provence

    IPC分类号： C09J163/00

    CPC分类号： B41J2/1601 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1645

    摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

    摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。

    PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS
    4.
    发明申请
    PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS 有权
    用于组装原理的标题和方法

    公开(公告)号：US20120236076A1

    公开(公告)日：2012-09-20

    申请号：US13046845

    申请日：2011-03-14

    申请人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, JR. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    发明人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, JR. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    IPC分类号： B41J2/145 ,  B23P17/00

    CPC分类号： B41J2/1628 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

    摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

    摘要翻译： 公开了一种用于打印机的打印头，其包括多个排出芯片单元。 多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。 打印头还包括多个支撑单元。 多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。 每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。 此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。 基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。 另外公开了一种组装打印头的方法。

    Printheads and method for assembling printheads
    5.
    发明授权
    Printheads and method for assembling printheads 有权
    打印头和组装打印头的方法

    公开(公告)号：US08636340B2

    公开(公告)日：2014-01-28

    申请号：US13046845

    申请日：2011-03-14

    申请人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, Jr. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    发明人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, Jr. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    IPC分类号： B41J2/25

    CPC分类号： B41J2/1628 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

    摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

    摘要翻译： 公开了一种用于打印机的打印头，其包括多个排出芯片单元。 多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。 打印头还包括多个支撑单元。 多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。 每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。 此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。 基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。 另外公开了一种组装打印头的方法。

    Formulations for environmentally friendly photoresist film layers
    7.
    发明授权
    Formulations for environmentally friendly photoresist film layers 有权
    环保光致抗蚀剂膜层的配方

    公开(公告)号：US08394575B2

    公开(公告)日：2013-03-12

    申请号：US12894930

    申请日：2010-09-30

    申请人： Xiaoming Wu ,  David Graham ,  Sean Weaver ,  Bart Mansdorf ,  Rich Wells ,  Joel Provence

    发明人： Xiaoming Wu ,  David Graham ,  Sean Weaver ,  Bart Mansdorf ,  Rich Wells ,  Joel Provence

    IPC分类号： G03F7/004

    CPC分类号： G03F7/038 ,  G03F7/0045

    摘要： Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.

    摘要翻译： 公开了用于微流体喷射头和微流体喷射头的环保厚膜层。 环保厚膜层包括衍生自包含多官能环氧化合物，低分子量聚合双官能环氧化合物，单体双官能环氧化合物，不含锑的甲基化光酸产生剂的组合物的负性光致抗蚀剂层， 发色团和芳基酮溶剂。 任选地，光致抗蚀剂层含有粘合增强剂。 负光致抗蚀剂层是环境友好的并且提供良好的分辨率，良好限定的临界尺寸，直的侧壁和大的加工窗口。

    Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plate
    8.
    发明授权
    Non-photosensitive siloxane coating for processing hydrophobic photoimageable nozzle plate 有权
    非光敏硅氧烷涂层用于加工疏水性光致成像喷嘴板

    公开(公告)号：US08728715B2

    公开(公告)日：2014-05-20

    申请号：US13350155

    申请日：2012-01-13

    申请人： David Bernard ,  Paul Dryer ,  Bart Mansdorf ,  Xiaoming Wu

    发明人： David Bernard ,  Paul Dryer ,  Bart Mansdorf ,  Xiaoming Wu

    IPC分类号： G03F7/26

    CPC分类号： B05B1/02 ,  B01L3/502707 ,  G03F7/265 ,  G03F7/38

    摘要： A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.

    摘要翻译： 提供了形成具有疏水性表面的图案化光致抗蚀剂层的方法。 该方法包括在基板上形成光致抗蚀剂层和图像图案化。 光致抗蚀剂层可以包括聚合材料。 然后，成像的光致抗蚀剂层可以进行两步曝光后烘烤。 在二级曝光后烘烤中可以在光致抗蚀剂层上进行表面处理。 表面处理可以包括在部分曝光后烘烤的光致抗蚀剂层上施加硅氧烷溶液。 然后曝光后烘烤的光致抗蚀剂层可以显影以形成图案化的光致抗蚀剂层。 该方法可用于形成具有改善的机械性能和稳定的疏水性质的微流体喷射头的疏水可光成像喷嘴板。

    Aqueous phase pore sealing agent imroving PCB coating oxidation-resistant and corrosion-resistant properties and method for using same
    9.
    发明授权
    Aqueous phase pore sealing agent imroving PCB coating oxidation-resistant and corrosion-resistant properties and method for using same 有权
    水相孔密封剂可以使PCB涂层具有抗氧化和耐腐蚀性能和使用方法

    公开(公告)号：US09441115B2

    公开(公告)日：2016-09-13

    申请号：US14358026

    申请日：2011-11-14

    申请人： Xiaoming Wu ,  Yong Lu ,  Hong Liu ,  Yinfeng Wu ,  Qianyuan Liu

    发明人： Xiaoming Wu ,  Yong Lu ,  Hong Liu ,  Yinfeng Wu ,  Qianyuan Liu

    IPC分类号： C09D5/08 ,  C23C22/60 ,  C23C22/68 ,  H05K3/28

    CPC分类号： C09D5/086 ,  C23C22/60 ,  C23C22/68 ,  H05K3/282 ,  H05K2203/0786 ,  H05K2203/0793

    摘要： The present invention relates to a water-based pore sealing agent enhancing PCB coating anti-oxidation and anti-corrosion properties, consisting of, by weight, 4-12 parts of a corrosion inhibitor, 15-25 parts of a mixed surfactants system, 10-20 parts of an ion chelating agent, 6-15 parts of a pH regulator, 20-40 parts of a builder, and the rest being purified water. When used to perform pore sealing on a PCB, the water-based pore sealing agent is diluted with purified water first to be diluted 10-100 times, preferably, 100/8-100/3 times. The pH value is 7-11, and is preferably 7.5-9.5. The surface tension is 18-28 dyn/cm. The pore sealing treatment uses a immersion process, and preferably ultrasonic waves are added at the same time to assist in cleaning the pores. For the pore sealing treatment, the temperature is 20-60° C., and the time is 60-150 seconds. After pore sealing, the temperature for drying the coated piece is 80-150° C., and the time is 60-120 seconds. The PCB treated with the water-based pore sealing agent of the present invention undergoes the neutral salt spray test, the nitric acid vapor test, the mixed gas test, and the sulfur dioxide and bonding tensile strength test, and the results have indicated that the anti-oxidation and anti-corrosion properties of the coating thereof are significantly enhanced.

    摘要翻译： 本发明涉及一种提高PCB涂层抗氧化和抗腐蚀性能的水性密封剂，由重量比为4-12份的缓蚀剂组成，15-25份混合表面活性剂体系，10 -20份离子螯合剂，6-15份pH调节剂，20-40份助洗剂，其余为纯化水。 当用于在PCB上进行孔密封时，首先用净化水稀释水基密封剂以稀释10-100倍，优选为100 / 8-100 / 3倍。 pH值为7-11，优选为7.5-9.5。 表面张力为18-28dyn / cm。 孔密封处理使用浸渍法，优选同时加入超声波以辅助清洁毛孔。 对于孔密封处理，温度为20-60℃，时间为60-150秒。 孔密封后，涂层的干燥温度为80-150℃，时间为60-120秒。 用本发明的水性密封剂处理的PCB经过中性盐雾试验，硝酸蒸汽试验，混合气体试验，二氧化硫和接合拉伸强度试验，结果表明， 其涂层的抗氧化和抗腐蚀性能显着提高。

    AQUEOUS PHASE PORE SEALING AGENT IMROVING PCB COATING OXIDATION- RESISTANT AND CORROSION-RESISTANT PROPERTIES AND METHOD FOR USING SAME
    10.
    发明申请
    AQUEOUS PHASE PORE SEALING AGENT IMROVING PCB COATING OXIDATION- RESISTANT AND CORROSION-RESISTANT PROPERTIES AND METHOD FOR USING SAME 有权
    水性相位密封剂代用PCB涂层耐氧化和耐腐蚀性能及使用方法

    公开(公告)号：US20140314967A1

    公开(公告)日：2014-10-23

    申请号：US14358026

    申请日：2011-11-14

    申请人： Xiaoming Wu ,  Yong Lu ,  Hong Liu ,  Yinfeng Wu ,  Qianyuan Liu

    发明人： Xiaoming Wu ,  Yong Lu ,  Hong Liu ,  Yinfeng Wu ,  Qianyuan Liu

    IPC分类号： H05K3/28 ,  C09D5/08

    CPC分类号： C09D5/086 ,  C23C22/60 ,  C23C22/68 ,  H05K3/282 ,  H05K2203/0786 ,  H05K2203/0793

    摘要： The present invention relates to a water-based pore sealing agent enhancing PCB coating anti-oxidation and anti-corrosion properties, consisting of, by weight, 4-12 parts of a corrosion inhibitor, 15-25 parts of a mixed surfactants system, 10-20 parts of an ion chelating agent, 6-15 parts of a pH regulator, 20-40 parts of a builder, and the rest being purified water. When used to perform pore sealing on a PCB, the water-based pore sealing agent is diluted with purified water first to be diluted 10-100 times, preferably, 100/8-100/3 times. The pH value is 7-11, and is preferably 7.5-9.5. The surface tension is 18-28 dyn/cm. The pore sealing treatment uses a immersion process, and preferably ultrasonic waves are added at the same time to assist in cleaning the pores. For the pore sealing treatment, the temperature is 20-60° C., and the time is 60-150 seconds. After pore sealing, the temperature for drying the coated piece is 80-150° C., and the time is 60-120 seconds. The PCB treated with the water-based pore sealing agent of the present invention undergoes the neutral salt spray test, the nitric acid vapor test, the mixed gas test, and the sulfur dioxide and bonding tensile strength test, and the results have indicated that the anti-oxidation and anti-corrosion properties of the coating thereof are significantly enhanced.

    摘要翻译： 本发明涉及一种提高PCB涂层抗氧化和抗腐蚀性能的水性密封剂，由重量比为4-12份的缓蚀剂组成，15-25份混合表面活性剂体系，10 -20份离子螯合剂，6-15份pH调节剂，20-40份助洗剂，其余为纯化水。 当用于在PCB上进行孔密封时，首先用净化水稀释水基密封剂以稀释10-100倍，优选为100 / 8-100 / 3倍。 pH值为7-11，优选为7.5-9.5。 表面张力为18-28dyn / cm。 孔密封处理使用浸渍法，优选同时加入超声波以辅助清洁毛孔。 对于孔密封处理，温度为20-60℃，时间为60-150秒。 孔密封后，涂层的干燥温度为80-150℃，时间为60-120秒。 用本发明的水性密封剂处理的PCB经过中性盐雾试验，硝酸蒸汽试验，混合气体试验，二氧化硫和接合拉伸强度试验，结果表明， 其涂层的抗氧化和抗腐蚀性能显着提高。