公开(公告)号：US20240324152A1

公开(公告)日：2024-09-26

申请号：US18578862

申请日：2022-07-15

Applicant: YASA LIMITED

Inventor： Simon David Hart ,  Tim Woolmer ,  Michael David Pantrey ,  Rajesh Kudikala ,  Daniel Rendell ,  Paul Donald Spendley ,  Timothy James Leopold Farmer ,  Adam Robert Neal ,  Antony John Webster

IPC: H05K7/20 ,  H02M7/00

CPC classification number: H05K7/20927 ,  H02M7/003 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/209

Abstract: We describe a power converter cooling arrangement in which a base has a top plate of a thermally conductive material, and a bottom plate and side walls define a chamber. An inlet and outlet are in fluid communication with the chamber, and the chamber is flooded with a cooling fluid that flows between the inlet and outlet. A PCB of a power converter is mounted to, and thermally coupled with, the top plate, where the PCB receives a plurality of power modules (that are used in the power conversion). The base comprises a plurality of fluid channels for flowing cooling fluid therethrough. Each of the fluid channels is arranged to coincide with a location of one or more components mounted to the PCB.