DUAL-BULB LAMPHEAD CONTROL METHODOLOGY
    1.
    发明申请
    DUAL-BULB LAMPHEAD CONTROL METHODOLOGY 有权
    双通道灯泡控制方法

    公开(公告)号:US20120129275A1

    公开(公告)日:2012-05-24

    申请号:US13011687

    申请日:2011-01-21

    IPC分类号: H01L21/26 H05B37/02

    摘要: The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a chamber, determining the relative irradiance on a substrate corresponding to a first lamp and a second lamp, and determining correction or compensation factors based on the relative irradiances and the baseline irradiance. The lamps are then adjusted via closed loop control using the correction or compensation factors to individually adjust the lamps to the desired output. The lamps may optionally be adjusted to equal irradiances prior to adjusting the lamps to the desired output. The closed loop control ensures process uniformity from substrate to substrate. The irradiance measurement and the correction or compensation factors allow for adjustment of lamp set points due to chamber component degradation, chamber component replacement, or chamber cleaning.

    摘要翻译: 本发明一般涉及控制UV灯输出以增加辐照度均匀性的方法。 方法通常包括确定室内的基线辐照度,确定对应于第一灯和第二灯的衬底上的相对辐照度,以及基于相对辐照度和基线辐照度确定校正或补偿因子。 然后通过使用校正或补偿因子的闭环控制来调节灯,以将灯单独调节到期望的输出。 在将灯调节到期望的输出之前,灯可以可选地被调整为相等的辐照度。 闭环控制确保从基板到基板的工艺均匀性。 辐照度测量和校正或补偿因素允许由于室部件劣化,腔室部件更换或腔室清洁而调节灯具设定点。

    Dual-bulb lamphead control methodology
    2.
    发明授权
    Dual-bulb lamphead control methodology 有权
    双灯泡灯头控制方法

    公开(公告)号:US08309421B2

    公开(公告)日:2012-11-13

    申请号:US13011687

    申请日:2011-01-21

    IPC分类号: H01L21/336 H01L21/76

    摘要: The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a chamber, determining the relative irradiance on a substrate corresponding to a first lamp and a second lamp, and determining correction or compensation factors based on the relative irradiances and the baseline irradiance. The lamps are then adjusted via closed loop control using the correction or compensation factors to individually adjust the lamps to the desired output. The lamps may optionally be adjusted to equal irradiances prior to adjusting the lamps to the desired output. The closed loop control ensures process uniformity from substrate to substrate. The irradiance measurement and the correction or compensation factors allow for adjustment of lamp set points due to chamber component degradation, chamber component replacement, or chamber cleaning.

    摘要翻译: 本发明一般涉及控制UV灯输出以增加辐照度均匀性的方法。 方法通常包括确定室内的基线辐照度,确定对应于第一灯和第二灯的衬底上的相对辐照度,以及基于相对辐照度和基线辐照度确定校正或补偿因子。 然后通过使用校正或补偿因子的闭环控制来调节灯,以将灯单独调节到期望的输出。 在将灯调节到期望的输出之前,灯可以可选地被调整为相等的辐照度。 闭环控制确保从基板到基板的工艺均匀性。 辐照度测量和校正或补偿因素允许由于室部件劣化,腔室部件更换或腔室清洁而调节灯具设定点。

    METHOD AND APPARATUS FOR SUBSTRATE SUPPORT WITH MULTI-ZONE HEATING
    8.
    发明申请
    METHOD AND APPARATUS FOR SUBSTRATE SUPPORT WITH MULTI-ZONE HEATING 有权
    用于多层加热的基板支撑的方法和装置

    公开(公告)号:US20130284721A1

    公开(公告)日:2013-10-31

    申请号:US13766885

    申请日:2013-02-14

    IPC分类号: H05B3/12

    摘要: Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.

    摘要翻译: 提供了方法和衬底处理系统,用于当衬底设置在衬底支撑组件的衬底支撑表面上时,用于控制衬底加热效率并在衬底的表面上产生期望的温度分布。 基板支撑组件具有最小的软件控制和硬件要求,并且包括由多个加热元件部分组成的加热元件。 加热元件连接到用于调节多个加热元件部分的温度输出的电源并且在处理室内的基板支撑组件的基板支撑表面上提供可调节的多加热区域和期望的温度分布。

    Method for driving an ink jet head having piezoelectric actuator
    9.
    发明申请
    Method for driving an ink jet head having piezoelectric actuator 审中-公开
    用于驱动具有压电致动器的喷墨头的方法

    公开(公告)号:US20070273731A1

    公开(公告)日:2007-11-29

    申请号:US11442407

    申请日:2006-05-26

    IPC分类号: B41J2/045

    摘要: A method for driving an ink jet head (10) having a piezoelectric actuator (103) includes the steps of: (a) transmitting a negative electrical pulse (31) to drive the piezoelectric actuator to transform in a manner such that ink is filled into an ink chamber (102) of the ink jet head; and (b) transmitting a positive electrical pulse (32) to drive the piezoelectric actuator to transform in a manner such that the ink is ejected out of the ink chamber.

    摘要翻译: 一种用于驱动具有压电致动器(103)的喷墨头(10)的方法包括以下步骤:(a)传送负电脉冲(31)以驱动压电致动器以使墨水被填充的方式变换 喷墨头的墨水室(102); 和(b)发送正电脉冲(32)以驱动压电致动器以使得墨水从墨室中喷出的方式变换。

    Method and apparatus for substrate support with multi-zone heating
    10.
    发明授权
    Method and apparatus for substrate support with multi-zone heating 有权
    用于多区域加热的基板支撑的方法和装置

    公开(公告)号:US09089007B2

    公开(公告)日:2015-07-21

    申请号:US13766885

    申请日:2013-02-14

    摘要: Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.

    摘要翻译: 提供了方法和衬底处理系统,用于当衬底设置在衬底支撑组件的衬底支撑表面上时,用于控制衬底加热效率并在衬底的表面上产生期望的温度分布。 基板支撑组件具有最小的软件控制和硬件要求,并且包括由多个加热元件部分组成的加热元件。 加热元件连接到用于调节多个加热元件部分的温度输出的电源并且在处理室内的基板支撑组件的基板支撑表面上提供可调节的多加热区域和期望的温度分布。