公开(公告)号：US08592504B2

公开(公告)日：2013-11-26

申请号：US12991146

申请日：2009-06-16

申请人： Yasuhisa Nishi ,  Syuji Sasaki ,  Hiroshi Murata

发明人： Yasuhisa Nishi ,  Syuji Sasaki ,  Hiroshi Murata

IPC分类号： C08K3/36 ,  C08L63/00 ,  C01B33/18 ,  C01B33/26 ,  H01L23/29

CPC分类号： H01L23/295 ,  C01B33/12 ,  C01B33/18 ,  C01P2004/61 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/2982 ,  H01L2924/00

摘要： A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20.

摘要翻译： 一种半导体封装材料，其即使在高度负载无机填料时也显示出低粘度和进一步提高的封装成型性; 适用于制备可用作包封材料的树脂组合物的无定形硅质粉末; 以及生产无定形硅质粉末的方法。 根据氧化物，Si和Al的含量为99.5质量％以上的无定形硅质粉末，其中，15μm〜小于70μm的粒径区域的Al含量以氧化物换算为100〜30000ppm。 3μm至小于15μm的粒度区域中的Al含量以氧化物换算为100至7000ppm; 并且整个粒度区域中的Al含量以氧化物换算为100〜25000ppm。 优选的是，在15μm至小于70μm的粒径区域中的Al含量（A）与3μm至更小的粒径区域中的Al含量（B）的比率（A）/（B） 超过15个妈妈是1.0到20。

公开(公告)号：US20110077329A1

公开(公告)日：2011-03-31

申请号：US12991146

申请日：2009-06-16

申请人： Yasuhisa Nishi ,  Syuji Sasaki ,  Hiroshi Murata

发明人： Yasuhisa Nishi ,  Syuji Sasaki ,  Hiroshi Murata

IPC分类号： C08K3/34 ,  C09K3/10

CPC分类号： H01L23/295 ,  C01B33/12 ,  C01B33/18 ,  C01P2004/61 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/2982 ,  H01L2924/00

摘要： A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20.

摘要翻译： 一种半导体封装材料，其即使在高度负载无机填料时也显示出低粘度和进一步提高的封装成型性; 适用于制备可用作包封材料的树脂组合物的无定形硅质粉末; 以及生产无定形硅质粉末的方法。 以氧化物换算的含有Si含量为99.5质量％以上的无定形硅质粉末，其中，15μm以上且小于70μm的粒径范围的Al含量以氧化物计为100〜30000ppm， 3μm以上且小于15μm的粒径区域的Al含量以氧化物计为100〜7000ppm， 并且整个粒度区域中的Al含量以氧化物换算为100〜25000ppm。 优选的是，粒径范围为15μm〜70μm的Al含量（A）与粒径范围内的Al含量（B）的比（A）/（B）为3μm以下 超过15μm为1.0〜20。

公开(公告)号：US08480990B2

公开(公告)日：2013-07-09

申请号：US12671375

申请日：2008-07-25

申请人： Syuji Sasaki ,  Hidetoshi Naito ,  Keishi Iizuka ,  Yasuhisa Nishi

发明人： Syuji Sasaki ,  Hidetoshi Naito ,  Keishi Iizuka ,  Yasuhisa Nishi

IPC分类号： C01B33/12 ,  B32B21/02 ,  C08K3/34

CPC分类号： C01B33/181 ,  Y10T428/2982

摘要： A silica powder containing an ultrafine powder in an amount of from 0.1 to 20 mass % and having an average sphericity of at least 0.85, wherein the ultrafine powder has, as the particle size measured by a dynamic light scattering particle size distribution measuring apparatus, an average particle size of from 150 to 250 nm, less than 10 mass % of the ultrafine powder having a particle size of at most 100 nm being less than 10 mass % (not including 0 mass %) and from 10 to 50 mass % of the ultrafine powder having a particle size exceeding 100 nm and not exceeding 150 nm.

摘要翻译： 含有0.1〜20质量％的超细粉末，平均球形度为0.85以上的二氧化硅粉末，其特征在于，超细粉末作为通过动态光散射粒度分布测定装置测定的粒径， 平均粒度为150〜250nm，小于10质量％（不包括0质量％）的小于10质量％的粒径为100质量％以下的超微粉末为10〜50质量％ 具有超过100nm且不超过150nm的超细粉末。

公开(公告)号：US20100204383A1

公开(公告)日：2010-08-12

申请号：US12671375

申请日：2008-07-25

申请人： Syuji Sasaki ,  Hidetoshi Naito ,  Keishi Iizuka ,  Yasuhisa Nishi

发明人： Syuji Sasaki ,  Hidetoshi Naito ,  Keishi Iizuka ,  Yasuhisa Nishi

IPC分类号： C08K3/36 ,  C01B33/12 ,  B32B1/00

CPC分类号： C01B33/181 ,  Y10T428/2982

摘要： To provide a silica powder which is excellent in flowability and packing properties and which is less likely to form a flash, a process for its production, and a composition having it incorporated in at least one of a rubber and a resin, particularly a sealing material.A silica powder containing an ultrafine powder in an amount of from 0.1 to 20 mass % and having an average sphericity of at least 0.85, wherein the ultrafine powder has, as the particle size measured by a dynamic light scattering particle size distribution measuring apparatus, an average particle size of from 150 to 250 nm, a content of particles having a particle size of at most 100 nm being less than 10 mass % (not including 0 mass %) and a content of particles having a particle size exceeding 100 nm and not exceeding 150 nm being from 10 to 50 mass %. A process for producing a silica powder, which comprises spraying a silica powder material to a high temperature zone of at least 1,750° C. formed by a burner for heat treatment, wherein the high temperature zone is formed in a range of from the forward end of the burner to 3.0-4.5 m therefrom, and to such a high temperature zone, a silica powder material containing from 0.05 to 10 mass % of a metal silicon powder is sprayed. A sealing material employing the silica powder of the present invention.

摘要翻译： 为了提供流动性和包装性能优异并且不太可能形成闪光的二氧化硅粉末，其生产方法和将其结合到橡胶和树脂中的至少一种中的组合物，特别是密封材料 。 含有0.1〜20质量％的超细粉末，平均球形度为0.85以上的二氧化硅粉末，其特征在于，超细粉末作为通过动态光散射粒度分布测定装置测定的粒径， 平均粒度为150〜250nm，粒径为100nm以下的粒子的含量小于10质量％（不含0质量％），粒径超过100nm的粒子的含量为 超过150nm为10〜50质量％。 一种二氧化硅粉末的制造方法，其特征在于，将二氧化硅粉末材料喷射到由用于热处理的燃烧器形成的至少1750℃的高温区域，其中，所述高温区域形成在前端 的燃烧器至3.0-4.5μm，并且在这样的高温区域喷射含有0.05〜10质量％的金属硅粉末的二氧化硅粉末材料。 使用本发明的二氧化硅粉末的密封材料。

公开(公告)号：US20100055060A1

公开(公告)日：2010-03-04

申请号：US12516347

申请日：2007-11-27

申请人： Naoyuki Yoshida ,  Yuichi Yamamoto ,  Kazushi Ishida ,  Akiko Yoda ,  Syuji Sasaki

发明人： Naoyuki Yoshida ,  Yuichi Yamamoto ,  Kazushi Ishida ,  Akiko Yoda ,  Syuji Sasaki

IPC分类号： A61K8/73 ,  A61Q19/00 ,  A61Q5/12 ,  A61Q1/06 ,  A61Q1/02 ,  A61Q1/10 ,  A61Q5/06 ,  A61Q5/10 ,  A61Q19/10

CPC分类号： A61K8/731 ,  A61K8/345 ,  A61K2800/782 ,  A61Q19/00

摘要： The problem of the present invention is to provide a cosmetic composition, which has a moisturizing effect, and whose ability to inhibit hyaluronidase activity is high. According to the present invention, by using one or more substances selected from sulfated cellulose and a salt thereof in combination with polyhydric alcohol, the moisturizing effect of sulfated cellulose and the ability to inhibit hyaluronidase activity can be further improved, and thereby the above-described problem can be solved. In addition, the present invention can provide a cosmetic composition having excellent stability through inclusion of an electrolyte having pH buffering ability.

摘要翻译： 本发明的问题在于提供具有保湿作用，抑制透明质酸酶活性的能力高的化妆品组合物。 根据本发明，通过使用一种或多种选自硫酸化纤维素及其盐与多元醇组合的物质，可以进一步提高硫酸纤维素的保湿作用和抑制透明质酸酶活性的能力，由此上述 问题可以解决。 此外，本发明可以提供通过包含具有pH缓冲能力的电解质而具有优异的稳定性的化妆品组合物。

公开(公告)号：US5905939A

公开(公告)日：1999-05-18

申请号：US888010

申请日：1997-07-03

申请人： Zenzo Ishijima ,  Junichi Ichikawa ,  Syuji Sasaki ,  Jun Sakai ,  Hideo Shikata ,  Hideo Urata

发明人： Zenzo Ishijima ,  Junichi Ichikawa ,  Syuji Sasaki ,  Jun Sakai ,  Hideo Shikata ,  Hideo Urata

IPC分类号： F16C7/02 ,  B21K1/14 ,  B22F3/12 ,  B22F5/00 ,  B23D31/00 ,  F16C9/04 ,  B22F3/24

CPC分类号： B22F5/003 ,  B23D31/003 ,  F16C7/023 ,  F16C9/045

摘要： There is provided a connecting rod including a connecting rod body and a cap having excellent alignment properties, and a method of producing such a connecting rod. A connecting rod body and a cap are produced through the steps of molding green compacts respectively corresponding to the connecting rod body and the cap; sintering and unifying both the green compacts; forging the resultant sintered product in a mold; and fracturing the resultant forged product. The green compact corresponding to the cap and/or the green compact corresponding to the connecting rod body includes opposite circumferential end faces formed with one or more projection. A clearance c is formed between both circumferential end faces of the sintered product due to the projection. With this clearance c, both the circumferential end faces are formed with recesses and projections which are fitted to each other during the forging process and which are relatively large and thus have large biting amounts. During the fracturing process, the recesses and the projections are separated into two pieces.

摘要翻译： 提供了一种连杆，包括具有优良对准性能的连杆主体和盖，以及制造这种连杆的方法。 通过分别对应于连杆主体和盖的成型压坯的步骤来制造连杆体和盖， 烧结并统一生坯; 将所得烧结产品锻造在模具中; 并破碎所得的锻造产品。 对应于与连杆主体相对应的盖和/或生坯的生坯具有形成有一个或多个突起的相对的周向端面。 由于突起，在烧结体的两个周向端面之间形成有间隙c。 利用该间隙c，两个周向端面形成有在锻造过程中彼此相配合并且相对较大并因此具有大的咬入量的凹部和突起。 在压裂过程中，凹槽和突起被分成两部分。