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公开(公告)号:US20110219849A1
公开(公告)日:2011-09-15
申请号:US13114684
申请日:2011-05-24
申请人: Yasushi Kuriso , Yoshiaki Shia , Kazuto Yamamura , Yuuichi Ishimori , Hiroyuki Mitake , Tetsuo Shima , Hiroshi Fukuchi , Norimasa Yamasaki
发明人: Yasushi Kuriso , Yoshiaki Shia , Kazuto Yamamura , Yuuichi Ishimori , Hiroyuki Mitake , Tetsuo Shima , Hiroshi Fukuchi , Norimasa Yamasaki
IPC分类号: B21D45/00
CPC分类号: B21D37/16 , B21D22/022 , B21D22/208
摘要: A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.