公开(公告)号：US20110164258A1

公开(公告)日：2011-07-07

申请号：US12809508

申请日：2008-12-19

Applicant: Yasuyuki Nakamura

Inventor： Yasuyuki Nakamura

IPC: G06K15/02

CPC classification number: H04N1/0402 ,  G06T1/00 ,  G06T3/4053 ,  H04N1/0411 ,  H04N1/0414 ,  H04N1/0417 ,  H04N1/0455 ,  H04N1/1017 ,  H04N1/3871 ,  H04N1/40068

Abstract: An image processing apparatus is provided with an area sensor which is formed by arranging sensor components for a pixel in a two-dimensional array and is attached in an inclined manner with respect to a reference installation position. The apparatus has a sensor unit which reads, from the sensor components which are determined based on an inclination angle indicating an inclination of the area sensor from the reference installation position and have been arranged within the area sensor, image data in which the inclination has been corrected; an image obtaining unit which obtains a plurality of frames of image data having a shift of less than one pixel, by scanning an original document image once by the sensor unit; and a high resolution conversion unit which obtains image data with a resolution higher than resolutions of the sensor components by using the obtained image data to perform interpolation processing.

Abstract translation: 一种图像处理装置设置有区域传感器，该区域传感器通过将二维阵列中的像素的传感器部件布置并相对于参考安装位置倾斜地安装而形成。 该装置具有传感器单元，该传感器单元从传感器部件读出基于表示区域传感器与参考安装位置的倾斜度并且已经布置在区域传感器内的倾斜角度确定的部件，其中已经倾斜的图像数据 纠正 图像获取单元，通过由传感器单元扫描原始文件图像一次，获得具有小于一个像素的移位的多个帧的图像数据; 以及高分辨率转换单元，其通过使用所获得的图像数据来获得具有高于传感器组件的分辨率的分辨率的图像数据，以进行插值处理。

公开(公告)号：US20080311428A1

公开(公告)日：2008-12-18

申请号：US12088389

申请日：2006-09-28

Applicant: Toru Mori ,  Yoshimi Kubo ,  Akira Okamoto ,  Yasuyuki Nakamura

Inventor： Toru Mori ,  Yoshimi Kubo ,  Akira Okamoto ,  Yasuyuki Nakamura

IPC: C01F17/00 ,  B32B9/00

CPC classification number: C09K5/08 ,  C01G45/1264 ,  C01P2002/34 ,  C03C17/23 ,  C03C17/3417 ,  C03C17/3435 ,  C03C2217/23

Abstract: In an Mn-containing perovskite oxide which is a conventional phase-change substance (A1−xBx)MnO3, when the mixing amount x is increased, the transition temperature (Tc) is shifted to higher temperature side, but the slope of a change in the emittance become gentle and Δε (ε at higher temperature−ε at lower temperature) also become small. In the present invention, the compositional formula of the phase-change substance is the Mn-containing perovskite oxide represented by (A1−xBx)Mn1+yO3 with 0

Abstract translation: 在常规相变物质（A1-xBx）MnO3的含Mn钙钛矿氧化物中，当混合量x增加时，转变温度（Tc）转变到较高温度侧，但是斜率 发光度变得平缓，而Deltaepsilon（较低温度下的ε-ε较高）也变小。 在本发明中，相变物质的组成式是由（A1-xBx）Mn1 + yO3表示的含有Mn的钙钛矿氧化物，其中Mn比由化学计量组成变化，从而使转变 温度（Tc）升高到更高的温度，其发射特性与具有从化学计量组成不变的组成的相变物质相当。

公开(公告)号：US20060256120A1

公开(公告)日：2006-11-16

申请号：US11487370

申请日：2006-07-17

Applicant: Katsutoshi Ushida ,  Yuichi Naoi ,  Yoshiaki Katahira ,  Yasuyuki Nakamura ,  Koichi Morishita ,  Makoto Fukuo

Inventor： Katsutoshi Ushida ,  Yuichi Naoi ,  Yoshiaki Katahira ,  Yasuyuki Nakamura ,  Koichi Morishita ,  Makoto Fukuo

IPC: G09G5/39

CPC classification number: G06T1/60 ,  G06T1/0007

Abstract: To provide an image processing technique compatible with both a CCD and a CIS, which controls storage of image data read by each device in a memory and the read of the stored data for each rectangular area to obtain a high memory efficiency, an image processing apparatus includes a memory area control section which sets, for image data bitmapped on a first memory, a rectangular area divided in a main scanning direction and sub-scanning direction, an address generation section which generates address information to read out image data corresponding to the rectangular area in correspondence with the set rectangular area, a memory control section which reads out the image data corresponding to the rectangular area and DMA-transfers the image data to a second memory in accordance with the generated address information, and an image processing section which executes image processing for each rectangular area of the DMA-transferred data by using the second memory.

公开(公告)号：US06506167B1

公开(公告)日：2003-01-14

申请号：US09641585

申请日：2000-08-18

Applicant: Tetsushi Ishimito ,  Yasuyuki Nakamura ,  Katsutoshi Hamada

Inventor： Tetsushi Ishimito ,  Yasuyuki Nakamura ,  Katsutoshi Hamada

IPC: A61B500

CPC classification number: B01L3/5021 ,  A61B5/15003 ,  A61B5/150251 ,  A61B5/150351 ,  A61B5/150389 ,  A61B5/150473 ,  A61B5/154 ,  G01N33/491

Abstract: An object of the invention is to achieve an increased speed of blood collection and separation as well as ease of handling of plasma components after blood separation. A blood-collecting tube, which draws in blood and separates it by using an internal negative pressure in the tube, comprises an upstream tube 10 having a blood inlet 11 and blood outlets 18, a filter 20 for separating blood and a downstream tube 12. A plug 18 is fitted to the blood inlet 11 to thereby close the interior of the upstream tube 10, and the filter 20 is installed so that it blocks the blood outlets 18. The downstream tube 12 is disposed to enclose the filter 20 and constructed in such a way that the downstream tube 12 can be attached to and detached from the upstream tube 10.

Abstract translation: 本发明的目的是提高血液采集和分离的速度，以及在血液分离后容易处理血浆成分。 吸入血液并通过使用管中的内部负压将其分离的采血管包括具有血液入口11和血液出口18的上游管10，用于分离血液的过滤器20和下游管12。 插塞18装配到血液入口11，从而封闭上游管10的内部，并且安装过滤器20以便阻止血液出口18.下游管12设置成包围过滤器20并构成 使得下游管12能够与上游管10连接和分离。

公开(公告)号：US06237809B1

公开(公告)日：2001-05-29

申请号：US09429629

申请日：1999-10-29

Applicant: Keiji Kawai ,  Yoshiaki Ito ,  Yasuyuki Nakamura

Inventor： Keiji Kawai ,  Yoshiaki Ito ,  Yasuyuki Nakamura

IPC: B67D502

CPC classification number: B67D7/0261

Abstract: A container does not cause any quality deterioration of high purity chemicals included therein during the storage and transportation thereof and is not easily broken. The container also permits easy and safe discharge of the high purity chemical. The container for a high purity chemical comprises a flexible internal container formed from a polyolefinic high purity resin and a gas-tight, self-supporting external container, which accommodates the internal container, wherein these internal and external containers are joined together in such a manner that the space formed between these two containers are arbitrary closed and opened so as to ensure the communication with the outside, a liquid-discharge pipe provided with a check valve connected to the pipe midway therein is gas-tightly inserted into the internal container down to the bottom thereof and a connector connected to a pressure source is fitted to the external container.

Abstract translation: 容器在储存和运输期间不会引起其中包含的高纯度化学品的任何质量劣化，并且不容易破裂。 容器还允许容易且安全地排出高纯度化学品。 用于高纯度化学品的容器包括由聚烯烃高纯度树脂形成的柔性内部容器和容纳内部容器的气密的自支撑外部容器，其中这些内部和外部容器以这种方式连接在一起 形成在这两个容器之间的空间是任意关闭和打开的，以确保与外部的连通，设置有连接到其中途的管道的止回阀的排液管气密地插入到内部容器中，直到 其底部和连接到压力源的连接器装配到外部容器。

公开(公告)号：US5517152A

公开(公告)日：1996-05-14

申请号：US948355

申请日：1992-09-23

Applicant: Takahiro Miki ,  Yasuyuki Nakamura ,  Shiro Hosotani

Inventor： Takahiro Miki ,  Yasuyuki Nakamura ,  Shiro Hosotani

IPC: G05F3/24 ,  H02J1/00 ,  H03F3/343 ,  H03F3/345 ,  H03F3/347 ,  H03K3/356 ,  H03K17/041 ,  H03M1/74 ,  H01J19/82 ,  G05F1/10 ,  G05F3/04 ,  H03K3/00

CPC classification number: G05F3/242 ,  H03K17/04106 ,  H03K3/356017 ,  H03M1/745

Abstract: A current source circuit according to the present invention is provided with an output terminal 100, a bias voltage source 21, N channel MOS transistors 2 and 1 and P channel MOS transistor 3. The source of transistor 2, the drain of transistor 1 and the drain of transistor 3 are connected to a common node, the drain of transistor 2 is connected to output terminal 100 and the gate of transistor 2 is connected to bias voltage source 21. Conductions of transistors 1 and 3 are dynamically controlled in response to an external signal. As a result, it is possible to implement a current source circuit having a small number of devices and enabling an operation at a high speed.

Abstract translation: 根据本发明的电流源电路设置有输出端子100，偏置电压源21，N沟道MOS晶体管2和1以及P沟道MOS晶体管3.晶体管2的源极，晶体管1的漏极和 晶体管3的漏极连接到公共节点，晶体管2的漏极连接到输出端子100，晶体管2的栅极连接到偏置电压源21.晶体管1和3的结合是响应于外部的 信号。 结果，可以实现具有少量器件的电流源电路，并且能够高速地进行操作。

公开(公告)号：US5358795A

公开(公告)日：1994-10-25

申请号：US959606

申请日：1992-10-13

Applicant: Yasuyuki Nakamura ,  Makoto Kawakami

Inventor： Yasuyuki Nakamura ,  Makoto Kawakami

IPC: B23K20/227 ,  H01L21/48 ,  H01L23/373 ,  B32B3/24 ,  B23K20/04 ,  H05K7/20

CPC classification number: B23K20/227 ,  H01L21/4882 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T428/12486 ,  Y10T428/12528 ,  Y10T428/1291 ,  Y10T428/12917

Abstract: This invention provides heat-conductive materials which may receive evenly the heat as applied thereto, which have an improved heat-releasing effect, which are free from fine pores on the surfaces thereof and therefore have excellent adhesiveness to thin films of plating materials or brazing materials, which have excellent compatibility with materials to be applied thereto, such as chips or sealant resins, with respect to the thermal expansion coefficients of them, and have excellent thermal conductivity, and which may have any desired thermal expansion coefficient and thermal conductivity in accordance with the use and object of them. It also provides methods of producing the heat-conductive materials. One aspect of the heat-conductive materials is such that a two-layer sheet or three-layer sheet to be formed by previously welding under pressure a copper foil to one surface or both surfaces of a Kovar sheet followed by forming a number of small through-holes through the sheet has been welded under pressure to and integrated with one surface or both surfaces of a copper sheet as previously heated up to a temperature not lower than the recrystallizing temperature thereof with a heating device. Another aspect of them is such that a copper sheet as previously heated up to a temperature not lower than the recrystallizing temperature thereof has been welded under pressure to the lower surface of a Kovar sheet having a number of small through-holes therethrough, with a welding machine, and additionally another copper sheet has been welded under pressure to the upper surface of the same with a welding machine, all the welded sheets having been integrated together. Still another aspect of them is such that the materials of the first aspect and/or the second aspect have been laminated and integrated together. The heat-conductive materials of all the aspects have a high welding strength even though the welding of the constitutive sheets is effected at a small reduction ratio, and they may have determined thermal expansion coefficient and thermal conductivity without fluctuating the previously determined ratio of the copper exposing surface areas (through-hole areas) to the Kovar surface.

公开(公告)号：US5355017A

公开(公告)日：1994-10-11

申请号：US979489

申请日：1992-11-20

Applicant: Yasuyuki Nakamura ,  Shin Nemoto

Inventor： Yasuyuki Nakamura ,  Shin Nemoto

IPC: H01L23/495 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H02B1/00

CPC classification number: H01L23/49582 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181

Abstract: In a lead frame material made of a strip of copper or copper alloy sheet for use in resin packages in which semiconductor chips are mounted to and resin-sealed in island portions of a lead frame fabricated from a strip of substrate material, the lead frame material includes selective spot-clad material in which metal foils of low thermal expansion, each of a predetermined size, are roll-bonded and arranged at a predetermined interval to respective positions to be formed with island portions in the longitudinal direction of the substrate material, either on the surface where the semiconductor chips are not to be mounted or on both the surface where the semiconductor chips are to be mounted and on the opposite side. Damage to the chips such as warping or peeling can be prevented during heating upon mounting them.

Abstract translation: 在由用于树脂封装中的铜或铜合金板条制成的引线框架材料中，其中半导体芯片安装到树脂密封在由基板材料条制成的引线框架的岛部分中，引线框架材料 包括选择性点覆层材料，其中每个具有预定尺寸的低热膨胀的金属箔以预定的间隔被辊压和布置成在基板材料的纵向方向上形成有岛部分的各个位置，或者 在半导体芯片不要安装的表面上或者半导体芯片要被安装的表面上和在相反的一侧。 在加热时可以防止芯片的翘曲或剥离等损坏。

公开(公告)号：US4826736A

公开(公告)日：1989-05-02

申请号：US873350

申请日：1986-06-12

Applicant: Yasuyuki Nakamura ,  Adio Hashimoto ,  Toshiaki Fujita ,  Makoto Kawakami

Inventor： Yasuyuki Nakamura ,  Adio Hashimoto ,  Toshiaki Fujita ,  Makoto Kawakami

IPC: B23K20/04 ,  B23K26/08 ,  B32B15/01 ,  C23C26/00 ,  C23C28/02 ,  H01L21/48 ,  H01L23/495 ,  C21D8/02

CPC classification number: C23C28/021 ,  B23K20/04 ,  B23K26/0846 ,  B32B15/01 ,  C23C26/00 ,  C23C28/023 ,  H01L21/4821 ,  H01L23/49582 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48639 ,  H01L2224/48739 ,  H01L2224/85439 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/3025 ,  Y10S148/903 ,  Y10S428/931 ,  Y10T428/12472 ,  Y10T428/12479

Abstract: A clad sheet comprising a metal substrate and a metal cladding layer laminated on at least one surface of said substrate, wherein said cladding layer-laminated surface of said substrate includes a hardened layer portion formed by melting and rapid solidification through laser beam irradiation. In intermediate layer may be interposed between the substrate and the cladding layer through like hardened layer portion. Lamination is made by cold-cladding layer elements after irradiating any one of layer elements with laser beam to produce strong bonding through uniform microcrack formed in the hardened layer portion of several micrometer thick. The clad sheets are useful for making IC lead frames, for which the substrate is conductor metal and the cladding layer is solder applied to partial area of the substrate. The irradiation and cladding process is carried out continuously with a reduced draft.

Abstract translation: 包括金属基板和层压在所述基板的至少一个表面上的金属覆层的复合板，其中所述基板的所述包层层压表面包括通过激光束照射熔化和快速凝固形成的硬化层部分。 中间层可以通过类似的硬化层部分介于衬底和包覆层之间。 在用激光束照射任何一个层元件之后，通过冷敷层元件进行层压，以通过在几微米厚的硬化层部分中形成的均匀微裂纹产生强粘合。 复合板可用于制造IC引线框架，其中基板是导体金属，并且包覆层被焊接到基板的部分区域。 照射和包层过程以减小的吃水持续进行。

公开(公告)号：US10277592B2

公开(公告)日：2019-04-30

申请号：US15046520

申请日：2016-02-18

Applicant: Takao Saka ,  Yasuyuki Nakamura

Inventor： Takao Saka ,  Yasuyuki Nakamura

IPC: H04L29/06 ,  G06F21/44 ,  G06F21/30 ,  H04W12/06 ,  H04W12/08

Abstract: An apparatus management system managing an apparatus through an information terminal includes a transmission part configured to transmit terminal information identifying the information terminal and apparatus information identifying the apparatus, a reception part configured to receive the terminal information and the apparatus information, an authentication part configured to determine whether the received terminal information and apparatus information match one of registered combinations of terminal information and apparatus information, and a notification part configured to transmit apparatus management information to the information terminal when the authentication part determines that the received terminal information and apparatus information match one of the registered combinations of terminal information and apparatus information.