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公开(公告)号:US08878220B2
公开(公告)日:2014-11-04
申请号:US13209765
申请日:2011-08-15
申请人: Jeong Hee Yang , Kyoung Wan Kim , Yeo Jin Yoon , Ye Seul Kim , Sang Hyun Oh , Duk Il Suh , Keum Ju Lee , Jin Woong Lee , Da Yeon Jeong
发明人: Jeong Hee Yang , Kyoung Wan Kim , Yeo Jin Yoon , Ye Seul Kim , Sang Hyun Oh , Duk Il Suh , Keum Ju Lee , Jin Woong Lee , Da Yeon Jeong
CPC分类号: H01L33/385 , H01L33/20 , H01L33/38 , H01L33/42 , H01L2933/0091
摘要: Exemplary embodiments of the present invention relate to light emitting diodes. A light emitting diode according to an exemplary embodiment of the present invention includes a substrate having a first side edge and a second side edge, and a light emitting structure arranged on the substrate. The light emitting structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A transparent electrode layer including a concave portion and a convex portion is arranged on the second conductivity-type semiconductor layer. A first electrode pad contacts an upper surface of the first conductivity-type semiconductor layer and is located near a center of the first side edge. Two second electrode pads are located near opposite distal ends of the second side edge to supply electric current to the second conductivity-type semiconductor layer. A first pad extension extends from the first electrode pad and a second pad extension extends from each of the two second electrode pads.
摘要翻译: 本发明的示例性实施例涉及发光二极管。 根据本发明的示例性实施例的发光二极管包括具有第一侧边缘和第二侧边缘的基板和布置在基板上的发光结构。 发光结构包括第一导电型半导体层,有源层和第二导电型半导体层。 在第二导电型半导体层上配置有包含凹部和凸部的透明电极层。 第一电极焊盘接触第一导电类型半导体层的上表面并且位于第一侧边缘的中心附近。 两个第二电极焊盘位于第二侧边缘的相对的远端附近,以向第二导电类型半导体层提供电流。 第一焊盘延伸部从第一电极焊盘延伸,并且第二焊盘延伸部从两个第二电极焊盘中的每一个延伸。
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公开(公告)号:US09024345B2
公开(公告)日:2015-05-05
申请号:US13818267
申请日:2011-04-05
申请人: Ye Seul Kim , Da Yeon Jeong , Kyoung Wan Kim , Yeo Jin Yoon , Sang Hyun Oh
发明人: Ye Seul Kim , Da Yeon Jeong , Kyoung Wan Kim , Yeo Jin Yoon , Sang Hyun Oh
摘要: Disclosed is a light emitting diode (LED) comprising a light emitting stacked structure and an electrode structure formed to have a pattern on the light emitting stacked structure. The electrode structure of the LED includes a cluster of reflectors disposed along the pattern on the light emitting stacked structure, and a pad material layer formed to entirely cover the reflectors.
摘要翻译: 公开了一种发光二极管(LED),其包括发光层叠结构和形成为在发光层叠结构上具有图案的电极结构。 LED的电极结构包括在发光层叠结构上沿着图案设置的反射体簇,以及形成为完全覆盖反射体的焊盘材料层。
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公开(公告)号:US20130234192A1
公开(公告)日:2013-09-12
申请号:US13885777
申请日:2011-02-28
申请人: Ye Seul Kim , Kyoung Wan Kim , Yeo Jin Yoon , Sang Hyun Oh , Keum Ju Lee , Jin Woong Lee , Da Yeon Jeong , Sang Won Woo
发明人: Ye Seul Kim , Kyoung Wan Kim , Yeo Jin Yoon , Sang Hyun Oh , Keum Ju Lee , Jin Woong Lee , Da Yeon Jeong , Sang Won Woo
IPC分类号: H01L33/46
CPC分类号: H01L33/387 , H01L33/0008 , H01L33/10 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/40 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/60 , H01L2933/0016 , H01L2933/0066
摘要: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
摘要翻译: 本文公开了包括电极焊盘的LED芯片。 LED芯片包括:第一导电型半导体层,第一导电型半导体层上的第二导电型半导体层和介于第一导电型半导体层和第二导电型半导体层之间的有源层的半导体堆叠; 位于与第一导电类型半导体层相对的第二导电类型半导体层上的第一电极焊盘; 从所述第一电极焊盘延伸并连接到所述第一导电型半导体层的第一电极延伸部; 电连接到第二导电类型半导体层的第二电极焊盘; 以及插入在第一电极焊盘和第二导电型半导体层之间的绝缘层。 LED芯片包括在第二导电类型半导体层上的第一电极焊盘,由此增加发光面积。
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公开(公告)号:US20130146929A1
公开(公告)日:2013-06-13
申请号:US13818267
申请日:2011-04-05
申请人: Ye Seul Kim , Da Yeon Jeong , Kyoung Wan Kim , Yeo Jin Yoon , Sang Hyun Oh
发明人: Ye Seul Kim , Da Yeon Jeong , Kyoung Wan Kim , Yeo Jin Yoon , Sang Hyun Oh
IPC分类号: H01L33/60
摘要: Disclosed is a light emitting diode (LED) comprising a light emitting stacked structure and an electrode structure formed to have a pattern on the light emitting stacked structure. The electrode structure of the LED includes a cluster of reflectors disposed along the pattern on the light emitting stacked structure, and a pad material layer formed to entirely cover the reflectors.
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公开(公告)号:US08987772B2
公开(公告)日:2015-03-24
申请号:US13885777
申请日:2011-02-28
申请人: Ye Seul Kim , Kyoung Wan Kim , Yeo Jin Yoon , Sang-Hyun Oh , Keum Ju Lee , Jin Woong Lee , Da Yeon Jeong , Sang Won Woo
发明人: Ye Seul Kim , Kyoung Wan Kim , Yeo Jin Yoon , Sang-Hyun Oh , Keum Ju Lee , Jin Woong Lee , Da Yeon Jeong , Sang Won Woo
IPC分类号: H01L33/38 , H01L33/46 , H01L33/10 , H01L33/40 , H01L33/44 , H01L33/60 , H01L33/36 , H01L33/20 , H01L33/42
CPC分类号: H01L33/387 , H01L33/0008 , H01L33/10 , H01L33/20 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/40 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/60 , H01L2933/0016 , H01L2933/0066
摘要: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
摘要翻译: 本文公开了包括电极焊盘的LED芯片。 LED芯片包括:第一导电型半导体层,第一导电型半导体层上的第二导电型半导体层和介于第一导电型半导体层和第二导电型半导体层之间的有源层的半导体堆叠; 位于与第一导电类型半导体层相对的第二导电类型半导体层上的第一电极焊盘; 从所述第一电极焊盘延伸并连接到所述第一导电型半导体层的第一电极延伸部; 电连接到第二导电类型半导体层的第二电极焊盘; 以及插入在第一电极焊盘和第二导电型半导体层之间的绝缘层。 LED芯片包括在第二导电类型半导体层上的第一电极焊盘,由此增加发光面积。
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