摘要:
Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.
摘要:
Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.
摘要:
Apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.
摘要:
Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.
摘要:
Methods and an apparatus for producing a head gimbal assembly with minimum dynamic response and air bearing resonance during flight (e.g., head-disk contact), thereby minimizing disruptions in the desired uniformity of flying height, are described. Embodiment head gimbal assemblies may comprise at least one air bearing surface of a slider and at least one suspension assembly wherein the at least one air bearing surface of the slider and the at least one suspension assembly are individually modeled. In addition, one of the at least one air bearing surface of the slider and one of the at least one suspension assembly may be matched to minimize air bearing resonance and system dynamic response.
摘要:
According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, gold balls are provided and a holder using a vacuum suction force is used to pick up each gold ball. The ball is then placed next to the desired bonding pad(s) and vibrated to achieve partial melting of the ball and bonding pad(s).
摘要:
An apparatus with a head gimbal assembly designed to reduce movement and rotation of components of the head gimbal assembly structure is disclosed. One embodiment head gimbal assembly may comprise a flexure including a ramp limiter, a suspension assembly further comprising a suspension tongue, a slider further comprising a magnetic head; and a load beam further comprising a lift tab; and a ramp further comprising a step to engage and support the ramp limiter and support and constrain the movement of the slider. In certain embodiments, the flexure may further comprise a flexure rail located at its end to reduce movement and rotation of the suspension tongue.
摘要:
In a system and method for adjusting a static torque on a slider in a head-gimbal assembly, a substantially rigid mass is placed on an air-bearing surface (ABS) of a slider. A static attitude of the slider is measured, and an adjustment location and intensity for a flexure to yield a zero slider static attitude are calculated. The flexure is adjusted based on the measurement and calculations.
摘要:
A method is described for calculating head disk interference (HDI) using a dynamic parametric test. In one embodiment, HDI is calculated based on an actual and ideal sensitivity profile based on a read-back signal track profile for the slider/head.
摘要:
In a balanced head gimbal assembly for improved seeking performance, a slider having a magnetic head with a set of read elements to read data and a set of write elements to write data, an air-bearing surface, and a non-air-bearing surface is coupled to a suspension. The suspension includes a loadbeam, a flexure, and a balancing weight. The loadbeam is coupled to an actuator arm. The flexure, coupled to the loadbeam, has a window through which a dimple, coupled to the loadbeam, contacts a dimple contact point. The balancing weight, coupled to the flexure, has a configuration which permits alignment of a center of mass of the head gimbal assembly with the dimple contact point.