公开(公告)号：US06267853B1

公开(公告)日：2001-07-31

申请号：US09350210

申请日：1999-07-09

申请人： Yezdi Dordi ,  Muhammad Atif Malik ,  Henan Hao ,  Timothy H. Franklin ,  Joe Stevens ,  Donald Olgado

发明人： Yezdi Dordi ,  Muhammad Atif Malik ,  Henan Hao ,  Timothy H. Franklin ,  Joe Stevens ,  Donald Olgado

IPC分类号： C25B1500

CPC分类号： C25D17/001 ,  C25D7/123 ,  H01L21/2885 ,  H05K3/241

摘要： The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes an edge bead removal/spin-rinse-dry (EBR/SRD) station disposed on the mainframe adjacent the loading station, a rapid thermal anneal chamber attached to the loading station, a seed layer repair station disposed on the mainframe, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

摘要翻译： 本发明提供了一种电化学沉积系统，其被设计成具有可扩展以适应未来设计和间隙填充要求的柔性结构，并提供令人满意的生产量以满足其它处理系统的需求。 电化学沉积系统通常包括具有主机晶片传送机器人的主机，与主机连接设置的加载站，与主机连接设置的一个或多个处理单元，以及流体连接到该主机的一个或多个 电加工电池。 优选地，电化学沉积系统包括设置在与装载站相邻的主机上的边缘珠去除/旋转干燥（EBR / SRD）站，附接到装载站的快速热退火室，种子层修复站 设置在主机上，以及用于控制电化学沉积过程和电化学沉积系统的部件的系统控制器。

公开(公告)号：US07025862B2

公开(公告)日：2006-04-11

申请号：US10278527

申请日：2002-10-22

申请人： Harald Herchen ,  Henan Hao ,  Celina M. Esteban ,  Timothy R. Webb ,  Son N. Trinh

发明人： Harald Herchen ,  Henan Hao ,  Celina M. Esteban ,  Timothy R. Webb ,  Son N. Trinh

IPC分类号： C25B9/00

CPC分类号： C25D17/06 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/5313 ,  Y10T29/532

摘要： An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.

摘要翻译： 描述了一种用于在处理系统中向基板提供电偏压的装置。 该装置通常包括限定中心开口的导电环形体。 导电环形体可以具有适于容纳衬底的衬底安置表面和形成在与衬底安置表面相对的表面上的多个扇贝。 多个电触头可以形成在与多个扇贝相对的基板支座表面上。 电触点可以适于接合基板的电镀表面。