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    Dry coating processes for substrates
    1.
    发明授权
    Dry coating processes for substrates 有权
    基材干涂工艺

    公开(公告)号：US08691324B2

    公开(公告)日：2014-04-08

    申请号：US13438088

    申请日：2012-04-03

    申请人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    发明人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    IPC分类号： C23C26/00 ,  B05D7/00

    CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/184 ,  C01P2004/20 ,  C09C1/44 ,  C09C1/46 ,  C09C1/62 ,  C09C3/041 ,  Y10T428/25

    摘要： Disclosed herein are solvent free, dry coating processes for applying a layered material such as graphene, nanoplate graphite, etc., to a substrate. The applied layered material is devoid of any dispersant and substantially uniform in thickness. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. Such processes may be especially useful for applying conductive films onto a polymeric substrate without the need for additives such as a surfactant or a polymeric binder.

    摘要翻译： 本文公开了用于将诸如石墨烯，纳米板石墨等层状材料施加到基底上的无溶剂的干法涂布方法。 所施加的层状材料没有任何分散剂并且厚度基本均匀。 通常，将层状材料前体组合物与研磨介质混合，使得研磨介质涂覆有分层材料。 然后将基材与涂覆的研磨介质接触。 研磨介质上的层状材料转移到基底上以在基底上形成涂层。 这种方法对于将导电膜施加到聚合物基材上而不需要添加剂如表面活性剂或聚合物粘合剂可能是特别有用的。

    DRY COATING PROCESSES FOR SUBSTRATES
    3.
    发明申请
    DRY COATING PROCESSES FOR SUBSTRATES 有权
    干燥基材涂层工艺

    公开(公告)号：US20130260136A1

    公开(公告)日：2013-10-03

    申请号：US13438088

    申请日：2012-04-03

    申请人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    发明人： Yiliang Wu ,  Sandra J. Gardner ,  Ping Liu ,  Nan-Xing Hu

    IPC分类号： B05D5/12 ,  B32B5/16 ,  B82Y40/00

    CPC分类号： B82Y40/00 ,  B82Y30/00 ,  C01B32/184 ,  C01P2004/20 ,  C09C1/44 ,  C09C1/46 ,  C09C1/62 ,  C09C3/041 ,  Y10T428/25

    摘要： Disclosed herein are solvent free, dry coating processes for applying a layered material such as graphene, nanoplate graphite, etc., to a substrate. The applied layered material is devoid of any dispersant and substantially uniform in thickness. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. Such processes may be especially useful for applying conductive films onto a polymeric substrate without the need for additives such as a surfactant or a polymeric binder.

    摘要翻译： 本文公开了用于将诸如石墨烯，纳米板石墨等层状材料施加到基底上的无溶剂的干法涂布方法。 所施加的层状材料没有任何分散剂并且厚度基本均匀。 通常，将层状材料前体组合物与研磨介质混合，使得研磨介质涂覆有分层材料。 然后将基底与涂覆的研磨介质接触。 研磨介质上的层状材料转移到基底上以在基底上形成涂层。 这种方法对于将导电膜施加到聚合物基材上而不需要添加剂如表面活性剂或聚合物粘合剂可能是特别有用的。

    SEMICONDUCTOR COMPOSITION
    10.
    发明申请
    SEMICONDUCTOR COMPOSITION 有权
    半导体组成

    公开(公告)号：US20120161110A1

    公开(公告)日：2012-06-28

    申请号：US12977464

    申请日：2010-12-23

    申请人： Yiliang Wu ,  Anthony James Wigglesworth ,  Ping Liu ,  Nan-Xing Hu

    发明人： Yiliang Wu ,  Anthony James Wigglesworth ,  Ping Liu ,  Nan-Xing Hu

    IPC分类号： H01L51/30 ,  H01L51/40 ,  H01B1/12

    CPC分类号： C07D495/04 ,  H01L51/0074 ,  H01L51/0541 ,  H01L51/0545

    摘要： An electronic device, such as a thin-film transistor, includes a semiconducting layer formed from a semiconductor composition. The semiconductor composition comprises a polymer binder and a small molecule semiconductor of Formula (I): wherein R1, m, n, a, b, c, and X are as described herein. Devices formed from the composition exhibit high mobility and excellent stability.

    摘要翻译： 诸如薄膜晶体管的电子器件包括由半导体组合物形成的半导体层。 半导体组合物包含聚合物粘合剂和式（I）的小分子半导体：其中R 1，m，n，a，b，c和X如本文所述。 由该组合物形成的装置显示出高移动性和优异的稳定性。