摘要:
A signal process circuit includes a signal modulation unit, a first resistor, a second resistor, a first discharge unit, a second discharge unit and a discharge detection unit. The signal modulation unit is used to modulate an input signal for generating a modulated signal. The first resistor is coupled between the signal modulation unit and an operation node. The second resistor is coupled between the operation node and the signal modulation unit. The first discharge unit is coupled to the signal modulation unit. The discharge unit is coupled to the signal modulation unit. The discharge detection unit is coupled to the first discharge unit, the operation node and the second discharge unit for detecting an output common voltage and control a discharge path accordingly.
摘要:
The invention includes two parallel paths. A first path is composed of two contact ends of a first electronic switch and a first, third and fifth diodes, which connect in series. One contact end connects a first end of an AC source, and a control end connects a second end of the AC source. A second path is composed of two contact ends of a second electronic switch and a second, fourth and sixth diodes, which connect in series. One contact end connects the second end of the AC source, and a control end connects the first end of the AC source. The AC source is connected between the positive ends of the first and second diodes. The second end of the AC source separately connects negative ends of the first and third diodes through two capacitors. The first end of the AC source separately connects negative ends of the second and fourth diodes through another two capacitors. Negative ends of the fifth and sixth diodes connect together to form a voltage output end.
摘要:
The invention provides an RF power amplifier with post-distortion linearizer. The power amplifier includes a main amplifier, an auxiliary amplifier and a phase compensator. The first amplifier has a first input end and a first output end and operates in class A or AB. The auxiliary amplifier has a second input end and a second output end and operates in class B or C. The second output end connects the first output end to form a signal output end. The phase compensator has a third input end and a third output end and compensates a phase difference between the main and auxiliary amplifiers to make outputs of the two amplifiers opposite in phase. The third output end connects the second input end. The third input end connects the first input end to form a signal input end.
摘要:
A hydrogen ion-sensitive field effect transistor and a manufacturing method thereof are provided. The hydrogen ion-sensitive field effect transistor includes a semiconductor substrate, an insulating layer, a transistor gate, and a sensing film. A gate area is defined on the semiconductor substrate having a source area and a drain area. The insulating layer is formed within the gate area on the semiconductor substrate. The transistor gate is deposited within the gate area and includes a first gate layer. Further, the first gate layer is an aluminum layer, and a sensing window is defined thereon. The sensing film is an alumina film formed within the sensing window by oxidizing the first gate layer. Thus, the sensing film is formed without any film deposition process, and consequently the manufacturing method is simplified.
摘要:
A hydrogen ion-sensitive field effect transistor and a manufacturing method thereof are provided. The hydrogen ion-sensitive field effect transistor includes a semiconductor substrate, an insulating layer, a transistor gate, and a sensing film. A gate area is defined on the semiconductor substrate having a source area and a drain area. The insulating layer is formed within the gate area on the semiconductor substrate. The transistor gate is deposited within the gate area and includes a first gate layer. Further, the first gate layer is an aluminum layer, and a sensing window is defined thereon. The sensing film is an alumina film formed within the sensing window by oxidizing the first gate layer. Thus, the sensing film is formed without any film deposition process, and consequently the manufacturing method is simplified.
摘要:
A structure for a metal-oxide-semiconductor field-effect transistor (MOSFET) sensor is provided. The structure includes a MOSFET, a sensing membrane, and a reference electrode. The reference electrode and the sensing membrane are formed on the first surface of the MOSFET and are arranged in such a way that the reference electrode and the sensing membrane are uniformly and electrically coupled to each other. Thus, the electric field between the sensing membrane and the reference electrode is uniformly distributed therebetween to stabilize the working signal of the MOSFET sensor.
摘要:
A biosensor package structure with a micro-fluidic channel is provided. The biosensor package structure includes a substrate, a biochip, and a cover. The substrate has a first surface, a second surface, and an opening. The biochip is attached on the first surface. A bio-sensing area of the biochip is exposed to the opening of the substrate. The cover is attached on the second surface to cover the opening so as to form a micro-fluidic channel. By implementing the invention, the manufacturing process of the biosensor is simplified and the productivity is increased.
摘要:
A structure for a metal-oxide-semiconductor field-effect transistor (MOSFET) sensor is provided. The structure includes a MOSFET, a sensing membrane, and a reference electrode. The reference electrode and the sensing membrane are formed on the first surface of the MOSFET and are arranged in such a way that the reference electrode and the sensing membrane are uniformly and electrically coupled to each other. Thus, the electric field between the sensing membrane and the reference electrode is uniformly distributed therebetween to stabilize the working signal of the MOSFET sensor.
摘要:
A biosensor package structure with a micro-fluidic channel is provided. The biosensor package structure includes a substrate, a biochip, and a cover. The substrate has a first surface, a second surface, and an opening. The biochip is attached on the first surface. A bio-sensing area of the biochip is exposed to the opening of the substrate. The cover is attached on the second surface to cover the opening so as to form a micro-fluidic channel. By implementing the invention, the manufacturing process of the biosensor is simplified and the productivity is increased.
摘要:
A manufacture method for CMOS sensor, which comprise of steps such as: forming protection layer on a substrate having multiple device structural layers, then using first photo-resist layer as mask for etching to form patterned molecular sensing layer, then forming third photo resist layer and etching protection layer and substrate so as to remove partial substrate underneath the sensor structure.