-
公开(公告)号:US08967452B2
公开(公告)日:2015-03-03
申请号:US13448866
申请日:2012-04-17
申请人: Yiu Ming Cheung , Tsan Yin Peter Lo , Ming Li , Yick Hong Mak , Ka San Lam
发明人: Yiu Ming Cheung , Tsan Yin Peter Lo , Ming Li , Yick Hong Mak , Ka San Lam
CPC分类号: H01L24/81 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/75251 , H01L2224/75263 , H01L2224/75744 , H01L2224/75753 , H01L2224/78252 , H01L2224/78253 , H01L2224/81048 , H01L2224/81121 , H01L2224/81191 , H01L2224/81203 , H01L2224/81224 , H01L2224/81907 , H01L2224/81986 , H01L2224/9205 , H01L2924/07802 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.
摘要翻译: 通过首先将芯片上的电触点对准到将要安装裸片的基板上的接合焊盘,准备用于热压接的裸片。 这些电触头用接合工具保持在基板上的接合焊盘上。 通过向模具的一部分提供热量将模具部分地粘合到基板上,以将其温度升高到电触点中焊料的熔点以使熔化至少一些焊料。 然后热压整个模头并将其加热到电触头的焊料的熔点以上,使得电接触部分外部的电触点的焊料也被熔化,以将模具结合到衬底。