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公开(公告)号：US20110175549A1
公开(公告)日：2011-07-21
申请号：US13119391
申请日：2009-09-01
CPC分类号： G09F13/18 , G02B6/0003 , G02B6/001
摘要： A linear light source (20), which emits light by causing light to propagate in a linear material (11) in which incoming light can be propagated, includes: a light emitting device (12), provided on a side of one end of the linear material (11), which emits light so that the light enters the one end of the linear material (11); and a light receiving device (21), provided on a side of the other end of the linear material (11), which detects the light which has propagated in the linear material (11). With the configuration, it is possible to provide: a linear light source in which an abnormal condition, such as breaking of a linear material, can be detected; and an electronic apparatus including the linear light source.
摘要翻译： 一种线性光源（20），其通过使光在能够传播入射光的线性材料（11）中传播而发光，包括：发光器件（12），其设置在所述发光器件的一端的一侧 线性材料（11），其发光，使得光进入线材（11）的一端; 以及设置在所述线状材料（11）的另一端的一侧的光接收装置（21），其检测在所述线状材料（11）中传播的光。 利用该结构，可以提供：能够检测出线状材料断裂等异常情况的线状光源; 以及包括线性光源的电子设备。
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公开(公告)号：US08496348B2
公开(公告)日：2013-07-30
申请号：US13119391
申请日：2009-09-01
CPC分类号： G09F13/18 , G02B6/0003 , G02B6/001
摘要： A linear light source (20), which emits light by causing light to propagate in a linear material (11) in which incoming light can be propagated, includes: a light emitting device (12), provided on a side of one end of the linear material (11), which emits light so that the light enters the one end of the linear material (11); and a light receiving device (21), provided on a side of the other end of the linear material (11), which detects the light which has propagated in the linear material (11). With the configuration, it is possible to provide: a linear light source in which an abnormal condition, such as breaking of a linear material, can be detected; and an electronic apparatus including the linear light source.
摘要翻译： 一种线性光源（20），其通过使光在能够传播入射光的线性材料（11）中传播而发光，包括：发光器件（12），其设置在所述发光器件的一端的一侧 线性材料（11），其发光，使得光进入线材（11）的一端; 以及设置在所述线状材料（11）的另一端的一侧的光接收装置（21），其检测在所述线状材料（11）中传播的光。 利用该结构，可以提供：能够检测出线状材料断裂等异常情况的线状光源; 以及包括线性光源的电子设备。
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公开(公告)号：US07308009B2
公开(公告)日：2007-12-11
申请号：US11063600
申请日：2005-02-24
申请人： Hideshi Koizumi , Takuya Shigenobu
发明人： Hideshi Koizumi , Takuya Shigenobu
CPC分类号： H01S5/02268 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01S5/024 , H01S5/4025 , H01L2924/00014 , H01L2924/00
摘要： In a semiconductor laser apparatus, semiconductor laser devices are mounted on a loading face of a radiation base portion produced from a radiation material in a mount board, and the radiation base portion and a cap portion constitute an envelope surrounding the semiconductor laser devices. Further, the radiation base portion and interconnections formed on and an extending face of the radiation base portion constitute an external connection terminal. Therefore, heat generated by the semiconductor laser devices is efficiently transferred to the radiation base portion produced from a radiation material. Further, constituting the external connection terminal allows a leadless configuration to be implemented. Thus, a semiconductor laser apparatus which is sufficient in radiation characteristics and is capable of supporting a low-profile specification is provided.
摘要翻译： 在半导体激光装置中，半导体激光装置安装在由安装基板上的辐射材料制成的辐射基部的装载面上，并且辐射基部和盖部构成围绕半导体激光装置的封套。 此外，辐射基部和形成在辐射基部的延伸面上的互连构成外部连接端。 因此，由半导体激光装置产生的热被有效地传递到由辐射材料制成的辐射基部。 此外，构成外部连接端子允许实现无引线配置。 因此，提供了具有足够的辐射特性并且能够支持低调规格的半导体激光设备。
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公开(公告)号：US20050195877A1
公开(公告)日：2005-09-08
申请号：US11063600
申请日：2005-02-24
申请人： Hideshi Koizumi , Takuya Shigenobu
发明人： Hideshi Koizumi , Takuya Shigenobu
CPC分类号： H01S5/02268 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01S5/024 , H01S5/4025 , H01L2924/00014 , H01L2924/00
摘要： In a semiconductor laser apparatus, semiconductor laser devices are mounted on a loading face of a radiation base portion produced from a radiation material in a mount board, and the radiation base portion and a cap portion constitute an envelope surrounding the semiconductor laser devices. Further, the radiation base portion and interconnections formed on and an extending face of the radiation base portion constitute an external connection terminal. Therefore, heat generated by the semiconductor laser devices is efficiently transferred to the radiation base portion produced from a radiation material. Further, constituting the external connection terminal allows a leadless configuration to be implemented. Thus, a semiconductor laser apparatus which is sufficient in radiation characteristics and is capable of supporting a low-profile specification is provided.
摘要翻译： 在半导体激光装置中，半导体激光装置安装在由安装基板上的辐射材料制成的辐射基部的装载面上，并且辐射基部和盖部构成围绕半导体激光装置的封套。 此外，辐射基部和形成在辐射基部的延伸面上的互连构成外部连接端子。 因此，由半导体激光装置产生的热被有效地传递到由辐射材料制成的辐射基部。 此外，构成外部连接端子允许实现无引线配置。 因此，提供了具有足够的辐射特性并且能够支持低调规格的半导体激光设备。
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