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公开(公告)号:US20050122463A1
公开(公告)日:2005-06-09
申请号:US11002888
申请日:2004-12-03
申请人: Yong Byun , Moo Park , Sung Jung , Sung Kang , Jong Kim , Young Jeung , Sang Lee , Sang Park , Hun Choo , Hyug Kweon , Kyung Chae , Hae Son , Sang Shin , Jong Lim , Wan Kim , Young Jeung , Joung Ryu , Ji Uh , Im Lee
发明人: Yong Byun , Moo Park , Sung Jung , Sung Kang , Jong Kim , Young Jeung , Sang Lee , Sang Park , Hun Choo , Hyug Kweon , Kyung Chae , Hae Son , Sang Shin , Jong Lim , Wan Kim , Young Jeung , Joung Ryu , Ji Uh , Im Lee
IPC分类号: G02F1/13 , G02F1/1333 , G02F1/1339 , G02F1/1341
CPC分类号: G02F1/1339 , G02F1/1309 , G02F1/1333 , G02F1/133351 , G02F1/13394 , G02F1/1341 , G02F2001/133354 , G02F2001/133388 , G02F2001/13415
摘要: Disclosed is a system for fabricating a liquid crystal display using liquid crystal dropping and a method of fabricating a liquid crystal display using the same. The present invention includes a liquid crystal forming line dropping liquid crystals on the first substrate, a sealant forming line forming the sealant on the second substrate, and a bonding and hardening line bonding the two substrates to each other and hardening the sealant, printing a sealant, bonding the substrates each other, and hardening the sealant and an inspection process line of cutting the bonded substrates into panel units and grinding and inspecting the unit panels. And, the GAP process line includes And, the present invention includes the processes of dropping LC on a first substrate using a dispenser, forming a main UV hardening sealant on a second substrate, bonding the first and second substrates to each other in a vacuum state, UV hardening the main UV hardening sealant, cutting the bonded substrates into cell units, grinding the cut substrates, and inspecting the grinded substrates finally.
摘要翻译: 公开了一种使用液晶滴下制造液晶显示器的系统和使用其制造液晶显示器的方法。 本发明包括在第一基板上滴下液晶的液晶形成线,在第二基板上形成密封剂的密封剂形成线,以及将两个基板彼此接合并使密封剂硬化的接合和硬化线,印刷密封剂 ,将基板粘合,使密封剂硬化,将粘接后的基板切割成面板单元的检查处理线,研磨和检查单元面板。 而且,GAP工艺线包括:本发明包括使用分配器在第一衬底上滴加LC的过程,在第二衬底上形成主UV硬化密封剂,在真空状态下将第一和第二衬底彼此接合 UV固化主UV固化密封剂,将粘合的基材切割成单元,研磨切割的基材,最后检查研磨的基材。