公开(公告)号：US20090230537A1

公开(公告)日：2009-09-17

申请号：US12047028

申请日：2008-03-12

申请人： Yong Liu ,  Jeff Ju ,  Zhongfa Yuan ,  Roger Luo

发明人： Yong Liu ,  Jeff Ju ,  Zhongfa Yuan ,  Roger Luo

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/49 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48671 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48871 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85471 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.

摘要翻译： 半导体管芯封装。 半导体管芯封装包括引线框结构，第一半导体管芯，其包括附接到引线框架结构的第一侧的第一表面和附接到引线框架结构的第二侧的第二半导体管芯。 第二半导体管芯包括集成电路管芯。 壳体材料形成在引线框架结构，第一半导体管芯和第二半导体管芯的至少一部分上。 模制材料的外表面与半导体管芯的第一表面基本共面。

公开(公告)号：US07768108B2

公开(公告)日：2010-08-03

申请号：US12047028

申请日：2008-03-12

申请人： Yong Liu ,  Jeff Ju ,  Zhongfa Yuan ,  Roger Luo

发明人： Yong Liu ,  Jeff Ju ,  Zhongfa Yuan ,  Roger Luo

IPC分类号： H01L23/02

CPC分类号： H01L24/49 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48671 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48871 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85471 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.

摘要翻译： 半导体管芯封装。 半导体管芯封装包括引线框结构，第一半导体管芯，其包括附接到引线框架结构的第一侧的第一表面和附接到引线框架结构的第二侧的第二半导体管芯。 第二半导体管芯包括集成电路管芯。 壳体材料形成在引线框架结构，第一半导体管芯和第二半导体管芯的至少一部分上。 模制材料的外表面与半导体管芯的第一表面基本共面。

公开(公告)号：US07745244B2

公开(公告)日：2010-06-29

申请号：US12144289

申请日：2008-06-23

申请人： Zhongfa Yuan ,  Yong Liu ,  Yumin Liu ,  Qiuxiao Qian

发明人： Zhongfa Yuan ,  Yong Liu ,  Yumin Liu ,  Qiuxiao Qian

IPC分类号： H01L21/00

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K3/3436 ,  H05K3/4038 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2203/0235 ,  Y10T29/49158 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

摘要翻译： 半导体管芯封装。 封装的实施例可以包括具有整个布置的固体导电针的衬底。 半导体管芯可以附接到衬底的表面。 可以通过固体导电针提供与半导体管芯的电连接。

公开(公告)号：US20090256245A1

公开(公告)日：2009-10-15

申请号：US12102799

申请日：2008-04-14

申请人： Yong Liu ,  Qiuxiao Qian ,  Yumin Liu ,  Zhongfa Yuan

发明人： Yong Liu ,  Qiuxiao Qian ,  Yumin Liu ,  Zhongfa Yuan

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H02M3/155 ,  H01L2224/05599

摘要： Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprising at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe.

摘要翻译： 公开了半导体管芯封装，制造所述封装的方法和使用所述封装的系统。 包括至少一个半导体管芯的示例性封装，该半导体管芯设置在引线框架的一个表面上并电耦合到引线框架的至少一个导电区域，以及至少一个无源电气部件，其布置在引线框架的另一个表面上并至少电耦合 引线框架的一个导电区域。

公开(公告)号：US08120169B2

公开(公告)日：2012-02-21

申请号：US12037428

申请日：2008-02-26

申请人： Yong Liu ,  Zhongfa Yuan

发明人： Yong Liu ,  Zhongfa Yuan

IPC分类号： H01L23/34

CPC分类号： H01L23/49861 ,  H01L21/561 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling.

摘要翻译： 模制无引线封装（MLP）半导体器件包括散热器，其具有从散热器的盖的边缘延伸到引线框架的单个连接突出部。 散热器可以在其边缘上包括作为集热器的附加突出部，并有助于将散热器固定在MLP中。 连接突起附接到引线框的引线，使得由盖聚集的热量可以通过连接突起传递到引线和连接到引线的印刷电路板。 在实施例中，散热器包括从盖朝向模具的中心集热器突出部，优选地以实心圆柱体的形式，其增强热量收集并传递到盖子。 盖可以包括从其顶部表面突出的翅片，以促进辐射和对流冷却。

公开(公告)号：US20120012993A1

公开(公告)日：2012-01-19

申请号：US13246682

申请日：2011-09-27

申请人： Yong Liu ,  Zhongfa Yuan

发明人： Yong Liu ,  Zhongfa Yuan

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49861 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/01108 ,  H01L2924/00 ,  H01L2924/00012

摘要： A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.

摘要翻译： 公开了一个包装。 该封装包括具有引线框结构的预成型基板，附接到引线框架结构的第一器件和覆盖引线框结构和第一器件的至少一部分的成型材料。 它还包括连接到预成型基板的第二装置。

公开(公告)号：US08525192B2

公开(公告)日：2013-09-03

申请号：US13246682

申请日：2011-09-27

申请人： Yong Liu ,  Zhongfa Yuan

发明人： Yong Liu ,  Zhongfa Yuan

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L23/49861 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/01108 ,  H01L2924/00 ,  H01L2924/00012

摘要： A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.

摘要翻译： 公开了一个包装。 该封装包括具有引线框结构的预成型基板，附接到引线框架结构的第一器件和覆盖引线框结构和第一器件的至少一部分的成型材料。 它还包括连接到预成型基板的第二装置。

公开(公告)号：US20090212405A1

公开(公告)日：2009-08-27

申请号：US12037471

申请日：2008-02-26

申请人： Yong Liu ,  Zhongfa Yuan ,  Erwin lan Almagro

发明人： Yong Liu ,  Zhongfa Yuan ,  Erwin lan Almagro

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49562 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/0781 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00

摘要： A stacked die molded leadless package (MLP) stacks two dice and uses leads formed integrally with top and central clips and a leadframe to avoid wire bonding. The central clip leads are source and gate leads leading to source and gate portions of the central clip common to source and gate regions of both dice. The top clip and leadframe are thus connected to the drain regions of the upper and lower dice, the leads of the top clip being drain leads connected to the leadframe leads. The central clip and leadframe leads provide source, gate, and drain terminals in the finished MLP. A method of making the MLP includes flip-chip assembly of the clips, dice, and leadframes in pairs or greater simultaneous quantities. Spacers can be employed between connected components to ensure proper alignment and distribution of bonding material.

摘要翻译： 堆叠的模制无引线封装（MLP）堆叠两个骰子，并使用与顶部和中心夹子以及引线框架一体形成的导线，以避免引线接合。 中心夹子引线是源极和栅极引线，通向中心夹的源极和栅极部分，这两个管芯的源极和栅极区域共同。 因此，顶部夹子和引线框架连接到上部和下部骰子的漏极区域，顶部夹子的引线是连接到引线框引线的漏极引线。 中心夹子和引线框架引线在成品MLP中提供源极，栅极和漏极端子。 制造MLP的方法包括成对地或更大同时量的夹子，裸片和引线框架的倒装芯片组装。 可以在连接部件之间使用间隔物，以确保粘结材料的正确对准和分布。

公开(公告)号：US20090140179A1

公开(公告)日：2009-06-04

申请号：US11948170

申请日：2007-11-30

申请人： Yong Liu ,  Zhengyu Zhu ,  Zhongfa Yuan

发明人： Yong Liu ,  Zhengyu Zhu ,  Zhongfa Yuan

IPC分类号： G02B27/00 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48465 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optocoupler package is disclosed. The package includes a substrate comprising a substrate surface, a first device, and a clip structure attached to the first device. The clip structure and the first device are mounted on the substrate, and the first device is oriented at an angle with respect to the substrate surface. A second device is mounted on the substrate, where the first device is capable of communicating with the second device.

摘要翻译： 公开了一种光耦合器封装。 所述包装包括包括衬底表面，第一装置和附接到所述第一装置的夹子结构的衬底。 夹子结构和第一装置安装在基板上，并且第一装置相对于基板表面成一定角度定向。 第二装置安装在基板上，其中第一装置能够与第二装置通信。

公开(公告)号：US20090212403A1

公开(公告)日：2009-08-27

申请号：US12037428

申请日：2008-02-26

申请人： Yong Liu ,  Zhongfa Yuan

发明人： Yong Liu ,  Zhongfa Yuan

IPC分类号： H01L23/12 ,  H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49861 ,  H01L21/561 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling.

摘要翻译： 模制无引线封装（MLP）半导体器件包括散热器，其具有从散热器的盖的边缘延伸到引线框架的单个连接突出部。 散热器可以在其边缘上包括作为集热器的附加突出部，并有助于将散热器固定在MLP中。 连接突起附接到引线框的引线，使得由盖聚集的热量可以通过连接突起传递到引线和连接到引线的印刷电路板。 在实施例中，散热器包括从盖朝向模具的中心集热器突出部，优选地以实心圆柱体的形式，其增强热量收集并传递到盖子。 盖可以包括从其顶部表面突出的翅片，以促进辐射和对流冷却。