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1.发明授权Adhesive film composition, associated dicing die bonding film, die package, and associated methods 有权粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法公开(公告)号：US08211540B2
公开(公告)日：2012-07-03
申请号：US12285568
申请日：2008-10-08
申请人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
CPC分类号： H01L24/29 , C08L21/00 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/06 , C08L2666/22 , C09J7/38 , C09J161/06 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/45124 , H01L2224/45144 , H01L2224/83191 , H01L2224/8385 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T156/10 , Y10T428/2848 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2224/48
摘要： An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.
摘要翻译： 粘合膜组合物包括具有羟基，羧基或环氧基中的一个或多个的弹性体树脂，成膜树脂，甲硅烷基化的酚固化树脂，环氧树脂，固化促进剂和填料。
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2.发明申请Adhesive film composition, associated dicing die bonding film, die package, and associated methods 有权粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法公开(公告)号：US20090110940A1
公开(公告)日：2009-04-30
申请号：US12285568
申请日：2008-10-08
申请人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
CPC分类号： H01L24/29 , C08L21/00 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/06 , C08L2666/22 , C09J7/38 , C09J161/06 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/45124 , H01L2224/45144 , H01L2224/83191 , H01L2224/8385 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T156/10 , Y10T428/2848 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2224/48
摘要： An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler
摘要翻译： 粘合膜组合物包括具有羟基，羧基或环氧基中的一个或多个的弹性体树脂，成膜树脂，甲硅烷基化的酚固化树脂，环氧树脂，固化促进剂和填料
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3.发明申请Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods 审中-公开用于半导体组装的粘合膜组合物，粘合剂膜，切割芯片接合膜，器件封装以及相关方法公开(公告)号：US20090162650A1
公开(公告)日：2009-06-25
申请号：US12314973
申请日：2008-12-19
申请人： Yong Woo Hong , Wan Jung Kim , Su Mi Im , Ah Ram Pyun , Chul Jeong , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Wan Jung Kim , Su Mi Im , Ah Ram Pyun , Chul Jeong , Sang Jin Kim , Chang Beom Chung
CPC分类号： H01L21/6836 , C08K5/50 , C08K5/5419 , C09D163/00 , C09J7/38 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2463/00 , H01L21/6835 , H01L24/28 , H01L24/45 , H01L2221/68327 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , Y10T428/2848 , Y10T428/31515 , Y10T428/31522 , C08L2666/28 , H01L2924/3512 , H01L2924/00 , H01L2224/48
摘要： An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
摘要翻译： 用于半导体组件的粘合膜组合物包括弹性体树脂，环氧树脂，酚类固化树脂和倍半硅氧烷低聚物。 倍半硅氧烷低聚物可以以约0.01至约3重量％的量存在。 ％，基于组合物的总固体含量。
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4.发明申请Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same 有权用于半导体组装的粘合膜组合物，与其结合的膜以及包含该膜的组合物公开(公告)号：US20080102284A1
公开(公告)日：2008-05-01
申请号：US11826908
申请日：2007-07-19
申请人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
发明人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
CPC分类号： B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
摘要： A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
摘要翻译： 用于半导体组装的芯片接合膜组合物可以包括含有羟基，羧基或环氧基的弹性体树脂。 芯片接合膜组合物还可以包括玻璃化转变温度（Tg）在约0至200℃范围内的成膜树脂，环氧树脂，酚醛树脂，固化剂，硅烷偶联剂和 填料。
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5.发明授权Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same 有权用于半导体组装的粘合膜组合物，与其结合的膜以及包含该膜的组合物公开(公告)号：US08394493B2
公开(公告)日：2013-03-12
申请号：US11826908
申请日：2007-07-19
申请人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
发明人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
CPC分类号： B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
摘要： A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
摘要翻译： 用于半导体组装的芯片接合膜组合物可以包括含有羟基，羧基或环氧基的弹性体树脂。 芯片接合膜组合物还可以包括玻璃化转变温度（Tg）在约0至200℃范围内的成膜树脂，环氧树脂，酚醛树脂，固化剂，硅烷偶联剂和 填料。
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6.发明申请Adhesive film composition, associated dicing die bonding film, and die package 有权粘合膜组成，相关切割模片接合薄膜和模具包装公开(公告)号：US20080145668A1
公开(公告)日：2008-06-19
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译： 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。
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7.发明授权Adhesive film composition, associated dicing die bonding film, and die package 有权粘合膜组成，相关切割模片接合薄膜和模具包装公开(公告)号：US07863758B2
公开(公告)日：2011-01-04
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
IPC分类号： H01L23/488 , B32B27/36 , B32B27/38 , C08L63/00 , C08L67/02
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译： 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。
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8.发明授权Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film 有权用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜公开(公告)号：US08557896B2
公开(公告)日：2013-10-15
申请号：US12979008
申请日：2010-12-27
申请人： Chul Jeong , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
发明人： Chul Jeong , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
IPC分类号： C08K9/06
CPC分类号： H01L24/29 , C08G59/621 , C08L21/00 , C09J163/00 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/09701 , H01L2924/12044 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05432 , H01L2924/0532 , H01L2924/05032 , H01L2924/05442 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
摘要翻译： 用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜，所述粘合剂组合物包括弹性体树脂，环氧树脂，可固化酚醛树脂，固化促进剂，硅烷偶联剂和填料，其中 硅烷偶联剂包括含环氧基的硅烷偶联剂和含过渡金属清除官能团的硅烷偶联剂。
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9.发明申请ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND DICING DIE-BONDING FILM 有权半导体器件粘合组合物，粘合膜和定影胶带公开(公告)号：US20110160339A1
公开(公告)日：2011-06-30
申请号：US12979008
申请日：2010-12-27
申请人： Chul JEONG , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
发明人： Chul JEONG , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
CPC分类号： H01L24/29 , C08G59/621 , C08L21/00 , C09J163/00 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/09701 , H01L2924/12044 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05432 , H01L2924/0532 , H01L2924/05032 , H01L2924/05442 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
摘要翻译： 用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜，所述粘合剂组合物包括弹性体树脂，环氧树脂，可固化酚醛树脂，固化促进剂，硅烷偶联剂和填料，其中 硅烷偶联剂包括含环氧基的硅烷偶联剂和含过渡金属清除官能团的硅烷偶联剂。
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10.发明申请ATTACH FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY AND ATTACH FILM USING THE SAME 审中-公开用于半导体组件的连接薄膜组合物及其连接膜公开(公告)号：US20110159294A1
公开(公告)日：2011-06-30
申请号：US12981110
申请日：2010-12-29
申请人： Gyu Seok Song , Jong Pil Ho , Jae Won Choi , Su Mi Im , Ki Tae Song
发明人： Gyu Seok Song , Jong Pil Ho , Jae Won Choi , Su Mi Im , Ki Tae Song
CPC分类号： C09J163/00 , C08L33/04 , C08L61/06 , C08L2205/03 , Y10T428/31515
摘要： An attach film composition for semiconductor assembly includes a polymer binder, an epoxy resin, a phenolic epoxy curing agent, a curing accelerator, a silane coupling agent, and an inorganic filler. The attach film composition may have an exothermic peak start temperature of about 300° C. or more in curing, and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 150° C. for 1 hour and a melt viscosity of about 1.0×105 to about 5.0×106 Poise at 175° C. after curing at 175° C. for 2 hours.
摘要翻译： 用于半导体组件的附着膜组合物包括聚合物粘合剂，环氧树脂，酚醛环氧固化剂，固化促进剂，硅烷偶联剂和无机填料。 附着膜组合物在固化时可以具有约300℃以上的放热峰开始温度，并且在150℃下固化后在175℃下的熔体粘度为约1.0×10 5至约5.0×10 6泊。对于 1小时，熔体粘度为约1.0×10 5至约5.0×10 6泊，175℃固化2小时。
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