TRANSPARENT ELECTRODE INTEGRATED ENCAPSULATION MODULE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    TRANSPARENT ELECTRODE INTEGRATED ENCAPSULATION MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
    透明电极整体封装模块及其制造方法

    公开(公告)号:US20130115446A1

    公开(公告)日:2013-05-09

    申请号:US13721709

    申请日:2012-12-20

    Abstract: The present invention provides configuration of a flat display panel with a touch screen panel loaded thereon and a manufacturing method thereof. According to the present invention, a configuration of a flat display panel with a touch screen panel loaded thereon in which reduced number of sheets of glass substrate or resin film substrate is provided. The configuration includes a transparent electrode integrated encapsulation module in which the transparent electrode is formed on one surface of an encapsulation glass substrate without a separate glass substrate for electrode formation of a touch screen circuit. A method for manufacturing a transparent electrode integrated encapsulation module is provided.

    Abstract translation: 本发明提供一种其上装有触摸屏面板的平板显示面板及其制造方法。 根据本发明,提供了一种其上装有触摸屏面板的平板显示面板的结构,其中设置了玻璃基板或树脂薄膜基板的数量减少。 该配置包括透明电极集成封装模块,其中透明电极形成在封装玻璃衬底的一个表面上,而没有用于触摸屏电路的电极形成的单独的玻璃衬底。 提供一种制造透明电极集成封装模块的方法。

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