公开(公告)号：US07127229B2

公开(公告)日：2006-10-24

申请号：US10233666

申请日：2002-09-04

申请人： Yoshihiko Baba ,  Teruhide Kunimitsu ,  Kenji Sekine ,  Mikio Iwakuni ,  Katsuhiro Miyamoto ,  Toshiaki Yuasa ,  Toshihiro Takahashi ,  Norio Abe ,  Shuji Konishi ,  Tadashi Kogure ,  Jun Yoshida ,  Katsuya Kaneda ,  Isao Ohki ,  Masaru Akiyama ,  Masato Suzuki

发明人： Yoshihiko Baba ,  Teruhide Kunimitsu ,  Kenji Sekine ,  Mikio Iwakuni ,  Katsuhiro Miyamoto ,  Toshiaki Yuasa ,  Toshihiro Takahashi ,  Norio Abe ,  Shuji Konishi ,  Tadashi Kogure ,  Jun Yoshida ,  Katsuya Kaneda ,  Isao Ohki ,  Masaru Akiyama ,  Masato Suzuki

IPC分类号： H04M11/04

CPC分类号： H04M1/72541 ,  G01S2205/006 ,  H04M1/72538 ,  H04W4/90 ,  H04W64/00 ,  H04W76/50 ,  H04W84/042 ,  H04W88/02

摘要： The object of the present invention is to provide a cellular phone to be used for emergency reports that performs GPS positioning by means of remote control from an emergency report center, and transmits positional information to the emergency report center. The emergency report cellular phone according to the present invention is constituted such that when an emergency report switch thereof is depressed, a call request is made to the emergency report center. The emergency report center transmits a response signal with the result that a call link is formed between the emergency report cellular phone and the emergency report center. Following completion of the telephone call, the emergency report center transmits a position recalculation command message, by means of a DTMF signal. The emergency report cellular phone, which has received this command message, performs GPS positioning and then converts latitudinal and longitudinal information to a DTMF signal before transmitting same to the emergency report center. As a result, even in a case where, in a time of emergency, a reporting party is unable to perform GPS positioning manually as a result of a poor physical condition, for example, since GPS positioning is possible by means of remote control, it is possible to rescue the reporting party in a rapid and reliable manner.

公开(公告)号：US20110167233A1

公开(公告)日：2011-07-07

申请号：US12596242

申请日：2009-04-23

申请人： Kenji Sekine ,  Tomoyuki Kato ,  Kazuhide Sano

发明人： Kenji Sekine ,  Tomoyuki Kato ,  Kazuhide Sano

IPC分类号： G06F12/16

CPC分类号： G06F3/065 ,  G06F3/0611 ,  G06F3/0653 ,  G06F3/067 ,  G06F11/2058 ,  G06F11/2074 ,  G06F11/2076

摘要： This invention proposes a computing system and a backup method capable of improving the backup efficiency. In accordance with copy requests from the host, the data written to the first logical volume in the first storage system is copied to the second logical volume in the relevant first storage system, the data copied to the second logical volume is transferred to the second storage system asynchronously from writing of data from the host to the first logical volume and, in the second storage system, the data transferred from the first storage system is written to the third logical volume in the relevant second storage system.

摘要翻译： 本发明提出了一种能够提高备份效率的计算系统和备份方法。 根据来自主机的复制请求，将写入第一存储系统中的第一逻辑卷的数据复制到相关第一存储系统中的第二逻辑卷，将复制到第二逻辑卷的数据传送到第二存储器 从主机写入数据到第一逻辑卷，并且在第二存储系统中从第一存储系统传送的数据被写入相关第二存储系统中的第三逻辑卷。

公开(公告)号：US07817437B2

公开(公告)日：2010-10-19

申请号：US12394421

申请日：2009-02-27

申请人： Iwamichi Kohjiro ,  Yasuhiro Nunogawa ,  Sakae Kikuchi ,  Shizuo Kondo ,  Tetsuaki Adachi ,  Osamu Kagaya ,  Kenji Sekine ,  Eiichi Hase ,  Kiichi Yamashita

发明人： Iwamichi Kohjiro ,  Yasuhiro Nunogawa ,  Sakae Kikuchi ,  Shizuo Kondo ,  Tetsuaki Adachi ,  Osamu Kagaya ,  Kenji Sekine ,  Eiichi Hase ,  Kiichi Yamashita

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H01L25/16 ,  H01L23/49844 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48799 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H03F1/56 ,  H03F3/195 ,  H03F3/213 ,  H03F3/604 ,  H03F2200/12 ,  H03F2200/168 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/387 ,  H03F2200/408 ,  H03F2200/451 ,  H03H7/383 ,  H01L2924/00 ,  H01L2224/45099

摘要： In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

摘要翻译： 在诸如高频功率放大器模块的半导体器件中，在安装在布线基板的主表面上的半导体芯片上形成多个放大装置，并且半导体芯片的电极通过导线电连接到电极 的布线基板。 为了使高频功率放大器模块尺寸变小，将电连接到固定基准电位的导线的基板侧接合电极位于距离半导体芯片的一侧更靠近基板侧接合电极的位置， 电连接到输出线。 电连接到输入线的基板侧输入电极位于与半导体芯片的侧面相距一定距离处，等于从半导体芯片侧到基板侧输出电极的距离，或者距离半导体芯片 半导体芯片的侧面比基板侧接合电极为止。

公开(公告)号：US20050110573A1

公开(公告)日：2005-05-26

申请号：US11023414

申请日：2004-12-29

申请人： Masami Ohnishi ,  Hidetoshi Matsumoto ,  Tomonori Tanoue ,  Osamu Kagaya ,  Kenji Sekine

发明人： Masami Ohnishi ,  Hidetoshi Matsumoto ,  Tomonori Tanoue ,  Osamu Kagaya ,  Kenji Sekine

IPC分类号： H03F3/60 ,  H03F1/02 ,  H03F1/56 ,  H03F3/189 ,  H03F3/24 ,  H03F3/68

CPC分类号： H03F1/56 ,  H03F1/0277 ,  H03F1/565 ,  H03F3/602 ,  H03F3/72 ,  H03F2203/7209

摘要： The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation. The present invention allows switching from one power amplifier unit to the other without the need of a radio frequency switch.

摘要翻译： 本发明提供一种射频功率放大器，其可以在高输出功率级和低输出功率级之间的开关功率放大器单元期间不会引入射频损耗。 通过将第一级匹配网络M12和第一级匹配网络M13连接到通过切换操作的功率放大器单元A11和功率放大器单元A12的各个输出节点，连接第一级匹配网络M12的输出节点 M13并联连接M12和M13的连接点与输出端子OUT之间的最后一级匹配网络M11，形成第一级匹配网络M12，M13和最后级匹配网络M11，用于功率放大器 单元A11和A12，使得当一个单元在操作中另一个处于停止操作时，在操作中在输出端子OUT和功率放大器单元之间建立阻抗匹配。 本发明允许从一个功率放大器单元切换到另一个，而不需要射频切换。

公开(公告)号：US06862001B2

公开(公告)日：2005-03-01

申请号：US10035147

申请日：2002-01-04

申请人： Hiroshi Kondoh ,  Hiroshi Shinoda ,  Kenji Sekine

发明人： Hiroshi Kondoh ,  Hiroshi Shinoda ,  Kenji Sekine

IPC分类号： H05K9/00 ,  H01L23/552 ,  H01P1/16 ,  H01P1/20 ,  H01P1/211 ,  H01P1/212 ,  H01P3/08 ,  H01P7/00 ,  H01Q13/08 ,  H04B1/38 ,  H04B1/3822

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01P1/16 ,  H01P1/211 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A high frequency communication device which can reduce undesired electromagnetic coupling inside and outside a box thereof in which circuit parts constituting a transmitter-receiver circuit are contained.Periodic structures (6) are provided on at least a part of a wall constituting a box (1, 4, 5) so that the periodic structures (6) serve as a filter which has a non-propagating frequency band corresponding a frequency band covering an undesired electromagnetic emission inside the box. Thus, undesired electromagnetic emission energy from any electromagnetic emission source can be confined locally to prevent a possible problem of electromagnetic interference.

摘要翻译： 一种高频通信装置，其能够减少包含构成发送器 - 接收器电路的电路部件的盒子内部和外部的不期望的电磁耦合。周期性结构（6）设置在构成盒（1）的壁的至少一部分上 ，4,5），使得周期性结构（6）用作滤波器，其具有对应于覆盖盒内不期望的电磁发射的频带的非传播频带。 因此，来自任何电磁发射源的不期望的电磁发射能量可以局部限制，以防止电磁干扰的可能问题。

公开(公告)号：US5274341A

公开(公告)日：1993-12-28

申请号：US914408

申请日：1992-07-17

申请人： Kenji Sekine ,  Masami Ohnishi ,  Haruhiko Funaki ,  Nobuo Masuda ,  Akio Iso

发明人： Kenji Sekine ,  Masami Ohnishi ,  Haruhiko Funaki ,  Nobuo Masuda ,  Akio Iso

IPC分类号： H03F1/02 ,  H03F3/26 ,  H03F3/60

CPC分类号： H03F3/604

摘要： A high-frequency power amplifier comprises a pair of FETs, a divider which supplies opposite-phase versions of a signal to be amplified to the FETs, distributed-parameter transmission lines connected respectively at one ends thereof to output electrodes of the FETs, and a combiner which combines signals appearing at another ends of the transmission lines into a signal of a common phase. Stubs which short-circuit for even harmonics included in output signals of the FETs are connected respectively to the transmission lines at positions distant from the output electrodes of the FETs by a multiple of a quarter wavelength of the fundamental wave included in the output signals of the FETs. A first capacitor is connected between the transmission lines at positions distant from the output electrodes of the FETs by the 1/12 wavelength of the fundamental wave included in the output signals of the FETs so that the output electrodes of the FETs are open for the third harmonic, and a second capacitor is connected between the transmission lines at positions between the connecting positions of the first capacitor and the connecting positions of the stubs so as to perform impedance matching for the fundamental wave included in the output signals of the FETs.

摘要翻译： 一个高频功率放大器包括一对FET，一个分频器，提供反向相位版本的要放大的信号到FET，一端分别连接到FET的输出电极的分布参数传输线，以及一个 组合器，其将出现在传输线的另一端的信号组合成公共相位的信号。 将包含在FET的输出信号中的偶次谐波短路的短截线分别连接到远离FET的输出电极的位置处的传输线，该基波包括在基本波的输出信号中的基波的四分之一波长的倍数 FET。 第一电容器连接在远离FET的输出电极的位置处的传输线之间，包括在FET的输出信号中的基波的1/12波长，使得FET的输出电极为第三个 谐波和第二电容器连接在第一电容器的连接位置和短截线的连接位置之间的位置处的传输线之间，以便对包括在FET的输出信号中的基波进行阻抗匹配。

公开(公告)号：US4356489A

公开(公告)日：1982-10-26

申请号：US142816

申请日：1980-04-22

申请人： Yukitsugu Hirota ,  Akira Endo ,  Kenji Sekine

发明人： Yukitsugu Hirota ,  Akira Endo ,  Kenji Sekine

IPC分类号： G01S7/36 ,  G01S13/60 ,  G01S13/93

CPC分类号： G01S13/60

摘要： A vehicle speed sensing device comprises a Doppler radar unit for producing a Doppler signal related to the vehicle speed and producing a speed signal from the Doppler signal, a first section for extracting noise components in the Doppler signal and producing a noise detection signal, and a second section for producing an output signal of the vehicle sensing device. The device output is the speed signal from the Doppler radar unit when the noise detection signal is absent while the device output is null or a speed signal having an amplitude identical with that of the speed signal just before the appearance of the noise detection signal when the noise detection signal is present.

摘要翻译： 车速检测装置包括：多普勒雷达单元，用于产生与车速相关的多普勒信号并从多普勒信号产生速度信号;第一部分，用于提取多普勒信号中的噪声成分并产生噪声检测信号;以及 用于产生车辆感测装置的输出信号的第二部分。 当设备输出为零时，当噪声检测信号不存在时，设备输出是来自多普勒雷达单元的速度信号，或者当噪声检测信号出现之前具有与速度信号的振幅相同的振幅信号的速度信号时 存在噪声检测信号。

公开(公告)号：US4255730A

公开(公告)日：1981-03-10

申请号：US954118

申请日：1978-10-24

申请人： Kenji Sekine ,  Yoichi Kaneko

发明人： Kenji Sekine ,  Yoichi Kaneko

IPC分类号： G01S7/03 ,  H03B9/14 ,  H03D7/02 ,  H03D9/06 ,  H01P5/00 ,  G01S13/00 ,  H03D9/02 ,  H04B1/40

CPC分类号： H03D9/0641 ,  G01S7/032 ,  H03B9/147 ,  H03B2009/126 ,  H03B9/14 ,  H03D7/02 ,  H03D9/0616 ,  H03D9/0633

摘要： A microwave integrated circuit device for reception wherein a microwave integrated circuit substrate is mounted on a short-circuited plane of an inner surface of a waveguide, a rectangular groove is provided in the short-circuited plane, and a mixer diode is arranged astride the groove.

摘要翻译： 一种用于接收的微波集成电路装置，其中微波集成电路基板安装在波导管的内表面的短路平面上，矩形槽设置在短路平面中，并且混合二极管跨越槽 。

公开(公告)号：US4251817A

公开(公告)日：1981-02-17

申请号：US85952

申请日：1979-10-18

申请人： Katsuhiro Kimura ,  Akira Endo ,  Kenji Sekine ,  Takahiko Tanigami ,  Yoichi Kaneko

发明人： Katsuhiro Kimura ,  Akira Endo ,  Kenji Sekine ,  Takahiko Tanigami ,  Yoichi Kaneko

IPC分类号： H01P5/04 ,  G01S7/03 ,  H01P1/00 ,  H01P5/08 ,  H01P5/107 ,  H01Q1/24 ,  H01Q13/08 ,  H03D9/00 ,  G01S13/00 ,  H04B1/44

CPC分类号： H01P1/005 ,  G01S7/032 ,  H01P5/08 ,  H01Q1/247 ,  H01Q13/08 ,  H03D9/00

摘要： There is disclosed a microwave integrated circuit device which comprises a waveguide circuit, a short-circuiting member serving as a short-circuiting plane and having a groove in the short-circuiting plane, means for varying the effective dimensions of the groove which have effect on microwave circuit components, a microwave integrated circuit formed on an insulating substrate so disposed as to cover the groove, and a semiconductor element disposed on the microwave integrated circuit to convert the microwave signal in the waveguide circuit into a selected one of a d.c. and a low-frequency, whereby the conversion efficiency may be increased by setting the peak position of the output level characteristic of the device at a desired frequency within a certain frequency band.

摘要翻译： 公开了一种微波集成电路器件，其包括波导电路，用作短路平面并在短路平面中具有沟槽的短路部件，用于改变有效尺寸的槽的装置 微波电路部件，形成在绝缘基板上的微波集成电路，被设置为覆盖该沟槽;以及半导体元件，设置在微波集成电路上，以将波导电路中的微波信号转换为直流 和低频，从而通过将设备的输出电平特性的峰值位置设置在特定频带内的期望频率，可以提高转换效率。

公开(公告)号：US20090161329A1

公开(公告)日：2009-06-25

申请号：US12394421

申请日：2009-02-27

申请人： Iwamichi Kohjiro ,  Yasuhiro Nunogawa ,  Sakae Kikuchi ,  Shizuo Kondo ,  Tetsuaki Adachi ,  Osamu Kagaya ,  Kenji Sekine ,  Eiichi Hase ,  Kiichi Yamashita

发明人： Iwamichi Kohjiro ,  Yasuhiro Nunogawa ,  Sakae Kikuchi ,  Shizuo Kondo ,  Tetsuaki Adachi ,  Osamu Kagaya ,  Kenji Sekine ,  Eiichi Hase ,  Kiichi Yamashita

IPC分类号： H01L23/66

CPC分类号： H01L25/16 ,  H01L23/49844 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48799 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H03F1/56 ,  H03F3/195 ,  H03F3/213 ,  H03F3/604 ,  H03F2200/12 ,  H03F2200/168 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/387 ,  H03F2200/408 ,  H03F2200/451 ,  H03H7/383 ,  H01L2924/00 ,  H01L2224/45099

摘要： In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

摘要翻译： 在诸如高频功率放大器模块的半导体器件中，在安装在布线基板的主表面上的半导体芯片上形成多个放大装置，并且半导体芯片的电极通过导线电连接到电极 的布线基板。 为了使高频功率放大器模块尺寸变小，将电连接到固定基准电位的导线的基板侧接合电极位于距离半导体芯片的一侧更靠近基板侧接合电极的位置， 电连接到输出线。 电连接到输入线的基板侧输入电极位于距离半导体芯片侧的距离大约等于从半导体芯片的侧面到基板侧输出电极的距离处，或者位于距离半导体芯片 半导体芯片的侧面比基板侧接合电极为止。