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    Method of producing semiconductor crystal
    2.
    发明授权
    Method of producing semiconductor crystal 失效
    半导体晶体的制造方法

    公开(公告)号：US06987072B2

    公开(公告)日：2006-01-17

    申请号：US11009020

    申请日：2004-12-13

    申请人： Yoshihiko Kanzawa ,  Teruhito Ohnishi ,  Ken Idota ,  Tohru Saitoh ,  Akira Asai

    发明人： Yoshihiko Kanzawa ,  Teruhito Ohnishi ,  Ken Idota ,  Tohru Saitoh ,  Akira Asai

    IPC分类号： H01L21/31

    CPC分类号： H01L21/324 ,  C30B23/02 ,  C30B25/02 ,  C30B29/52 ,  H01L21/02381 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02661 ,  H01L21/02664 ,  H01L21/322 ,  Y10S438/933

    摘要： A method for fabricating a semiconductor crystal that has a first step for forming a semiconductor crystal layer (202) that contains carbon atoms and at least one kind of Group IV element other than carbon on a substrate (201), a second step for adding an impurity that is capable of reacting with oxygen to the semiconductor crystal layer (202), and a third step for removing the carbon atoms contained in the semiconductor crystal layer (202) by reacting the carbon with the impurity. This method makes it possible to fabricate a semiconductor crystal substrate in which the concentration of interstitial carbon atoms is satisfactorily reduced, thus resulting in excellent electrical properties when the substrate is applied to a semiconductor device.

    摘要翻译： 一种制造半导体晶体的方法，其具有在基板（201）上形成含有碳原子的半导体晶体层（202）和除了碳以外的至少一种第IV族元素的第一工序，第二工序用于添加 能够与氧反应的半导体晶体层（202）的杂质，以及通过使碳与杂质反应来除去半导体结晶层（202）中所含的碳原子的第三工序。 该方法可以制造其中间隙碳原子的浓度令人满意地降低的半导体晶体衬底，从而当将衬底应用于半导体器件时获得优异的电性能。

    Heterojunction bipolar transistor and method for manufacturing same
    4.
    发明申请
    Heterojunction bipolar transistor and method for manufacturing same 失效
    异质结双极晶体管及其制造方法

    公开(公告)号：US20070085167A1

    公开(公告)日：2007-04-19

    申请号：US10564085

    申请日：2004-07-06

    申请人： Tohru Saitoh ,  Takahiro Kawashima ,  Ken Idota ,  Yoshihiko Kanzawa ,  Teruhito Ohnishi

    发明人： Tohru Saitoh ,  Takahiro Kawashima ,  Ken Idota ,  Yoshihiko Kanzawa ,  Teruhito Ohnishi

    IPC分类号： H01L27/082

    CPC分类号： H01L29/66242 ,  H01L29/7378

    摘要： A bipolar transistor 120 comprises a substrate 1, a intrinsic base region 11 and an extrinsic base region 12. The intrinsic base region 11 comprises a silicon buffer layer 109 comprised of silicon which is formed on the substrate 1, and a composition-ratio graded base layer 111 which is formed on the silicon buffer layer and comprises silicon and at least germanium and where a composition ratio of the germanium to the silicon varies in a thickness direction of the composition-ratio graded base layer 111. The extrinsic base region 12 comprises an extrinsic base formation layer 113 comprised of silicon which is formed on the substrate and adjacent to the silicon buffer layer. And the thickness of the extrinsic base formation layer 113 is not less than 40 nm.

    摘要翻译： 双极晶体管120包括衬底1，本征基极区域11和外部基极区域12。 本征基极区域11包括由衬底1上形成的硅构成的硅缓冲层109和形成在硅缓冲层上并包含硅和至少锗的组成比梯度的基底层111，其中组成 锗与硅的比例在组成比梯度的基底层111的厚度方向上变化。 外部基极区域12包括由硅构成的非本征基底形成层113，其形成在衬底上并与硅缓冲层相邻。 外部基底形成层113的厚度不小于40nm。

    Heterojunction biploar transistor and method for manufacturing same
    5.
    发明授权
    Heterojunction biploar transistor and method for manufacturing same 失效
    异质结双极晶体管及其制造方法

    公开(公告)号：US07719031B2

    公开(公告)日：2010-05-18

    申请号：US10564085

    申请日：2004-07-06

    申请人： Tohru Saitoh ,  Takahiro Kawashima ,  Ken Idota ,  Yoshihiko Kanzawa ,  Teruhito Ohnishi

    发明人： Tohru Saitoh ,  Takahiro Kawashima ,  Ken Idota ,  Yoshihiko Kanzawa ,  Teruhito Ohnishi

    IPC分类号： H01L29/74

    CPC分类号： H01L29/66242 ,  H01L29/7378

    摘要： A bipolar transistor 120 comprises a substrate 1, a intrinsic base region 11 and an extrinsic base region 12. The intrinsic base region 11 comprises a silicon buffer layer 109 comprised of silicon which is formed on the substrate 1, and a composition-ratio graded base layer 111 which is formed on the silicon buffer layer and comprises silicon and at least germanium and where a composition ratio of the germanium to the silicon varies in a thickness direction of the composition-ratio graded base layer 111. The extrinsic base region 12 comprises an extrinsic base formation layer 113 comprised of silicon which is formed on the substrate and adjacent to the silicon buffer layer. And the thickness of the extrinsic base formation layer 113 is not less than 40 nm.

    摘要翻译： 双极晶体管120包括衬底1，本征基极区域11和非本征基极区域12.本征基极区域11包括由衬底1上形成的硅构成的硅缓冲层109和组成比分级基底 层111，其形成在硅缓冲层上并且包含硅并且至少为锗，并且其中锗与硅的组成比在组成比梯度基底层111的厚度方向上变化。外部基极区12包括 外部基底形成层113由硅构成，其形成在衬底上并与硅缓冲层相邻。 外部基底形成层113的厚度不小于40nm。

    Semiconductor device and method for fabricating the same
    6.
    发明授权
    Semiconductor device and method for fabricating the same 失效
    半导体装置及其制造方法

    公开(公告)号：US06399993B1

    公开(公告)日：2002-06-04

    申请号：US09786551

    申请日：2001-03-07

    申请人： Teruhito Ohnishi ,  Akira Asai ,  Takeshi Takagi ,  Tohru Saitoh ,  Yo Ichikawa ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Koji Katayama ,  Yoshihiko Kanzawa

    发明人： Teruhito Ohnishi ,  Akira Asai ,  Takeshi Takagi ,  Tohru Saitoh ,  Yo Ichikawa ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Koji Katayama ,  Yoshihiko Kanzawa

    IPC分类号： H01L2972

    CPC分类号： H01L21/76237 ,  H01L21/8249

    摘要： In a bipolar transistor block, a base layer (20a) of SiGe single crystals and an emitter layer (26) of almost 100% of Si single crystals are stacked in this order over a collector diffused layer (9). Over both edges of the base layer (20a), a base undercoat insulating film (5a) and base extended electrodes (22) made of polysilicon are provided. The base layer (20a) has a peripheral portion with a thickness equal to that of the base undercoat insulating film (5a) and a center portion thicker than the peripheral portion. The base undercoat insulating film (5a) and gate insulating films (5b and 5c) for a CMOS block are made of the same oxide film. A stress resulting from a difference in thermal expansion coefficient between the SiGe layer as the base layer and the base undercoat insulating film 5a can be reduced, and a highly reliable BiCMOS device is realized.

    摘要翻译： 在双极晶体管块中，SiGe单晶的基极层（20a）和几乎100％的Si单晶的发射极层（26）依次层叠在集电极扩散层（9）上。 在基底层（20a）的两个边缘上设置有由多晶硅制成的基底底涂层绝缘膜（5a）和基底延伸电极（22）。 基底层（20a）具有与基底底涂层绝缘膜（5a）的厚度相等的周边部分和比周边部分厚的中心部分。 用于CMOS块的基底涂层绝缘膜（5a）和栅极绝缘膜（5b和5c）由相同的氧化物膜制成。 由于作为基底层的SiGe层与基底底涂层绝缘膜5a之间的热膨胀系数的差异导致的应力可以降低，并且实现了高可靠性的BiCMOS器件。

    Semiconductor device and method for fabricating the same
    8.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US06455364B1

    公开(公告)日：2002-09-24

    申请号：US09526686

    申请日：2000-03-15

    申请人： Akira Asai ,  Teruhito Oonishi ,  Takeshi Takagi ,  Tohru Saitoh ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Yoshihiko Kanzawa ,  Koji Katayama ,  Yo Ichikawa

    发明人： Akira Asai ,  Teruhito Oonishi ,  Takeshi Takagi ,  Tohru Saitoh ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Yoshihiko Kanzawa ,  Koji Katayama ,  Yo Ichikawa

    IPC分类号： H01L218249

    CPC分类号： H01L29/66242 ,  H01L21/763 ,  H01L21/8249 ,  H01L27/0623 ,  H01L29/7378

    摘要： In the method for fabricating a semiconductor device of the present invention, a collector layer of a first conductivity type is formed in a region of a semiconductor substrate sandwiched by device isolation. A collector opening is formed through a first insulating layer deposited on the semiconductor substrate so that the range of the collector opening covers the collector layer and part of the device isolation. A semiconductor layer of a second conductivity type as an external base is formed on a portion of the semiconductor substrate located inside the collector opening, while junction leak prevention layers of the same conductivity type as the external base are formed in the semiconductor substrate. Thus, the active region is narrower than the collector opening reducing the transistor area, while minimizing junction leak.

    摘要翻译： 在本发明的半导体装置的制造方法中，在被器件分离夹持的半导体基板的区域中形成有第一导电型的集电极层。 通过沉积在半导体衬底上的第一绝缘层形成集电极开口，使得集电极开口的范围覆盖集电极层和器件隔离的一部分。 在位于集电体开口内部的半导体基板的一部分上形成作为外部基底的第二导电类型的半导体层，同时在半导体衬底中形成与外部基底相同的导电类型的防漏层。 因此，有源区域比集电极开口窄，减小晶体管面积，同时最小化结漏电。

    Semiconductor device and method for fabricating the same
    9.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号：US06713790B2

    公开(公告)日：2004-03-30

    申请号：US10212799

    申请日：2002-08-07

    申请人： Akira Asai ,  Teruhito Oonishi ,  Takeshi Takagi ,  Tohru Saitoh ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Yoshihiko Kanzawa ,  Koji Katayama ,  Yo Ichikawa

    发明人： Akira Asai ,  Teruhito Oonishi ,  Takeshi Takagi ,  Tohru Saitoh ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Yoshihiko Kanzawa ,  Koji Katayama ,  Yo Ichikawa

    IPC分类号： H01L31072

    CPC分类号： H01L29/66242 ,  H01L21/763 ,  H01L21/8249 ,  H01L27/0623 ,  H01L29/7378

    摘要： In the method for fabricating a semiconductor device of the present invention, a collector layer of a first conductivity type is formed in a region of a semiconductor substrate sandwiched by device isolation. A collector opening is formed through a first insulating layer deposited on the semiconductor substrate so that the range of the collector opening covers the collector layer and part of the device isolation. A semiconductor layer of a second conductivity type as an external base is formed on a portion of the semiconductor substrate located inside the collector opening, while junction leak prevention layers of the same conductivity type as the external base are formed in the semiconductor substrate. Thus, the active region is narrower than the collector opening reducing the transistor area, while minimizing junction leak.

    摘要翻译： 在本发明的半导体装置的制造方法中，在被器件分离夹持的半导体基板的区域中形成有第一导电型的集电极层。 通过沉积在半导体衬底上的第一绝缘层形成集电极开口，使得集电极开口的范围覆盖集电极层和器件隔离的一部分。 在位于集电体开口内部的半导体基板的一部分上形成作为外部基底的第二导电类型的半导体层，同时在半导体衬底中形成与外部基底相同的导电类型的防漏层。 因此，有源区域比集电极开口窄，减小晶体管面积，同时最小化结漏电。