公开(公告)号：US08133957B2

公开(公告)日：2012-03-13

申请号：US12510491

申请日：2009-07-28

申请人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

发明人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

IPC分类号： C08G77/14

CPC分类号： C08G59/306 ,  C08G59/3254 ,  C08L83/06

摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).

摘要翻译： 一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2） 两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基 基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

公开(公告)号：US20100029887A1

公开(公告)日：2010-02-04

申请号：US12510491

申请日：2009-07-28

申请人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

发明人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

IPC分类号： C09D183/04 ,  C08G77/04

CPC分类号： C08G59/306 ,  C08G59/3254 ,  C08L83/06

摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).

摘要翻译： 一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2） 两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基 基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

公开(公告)号：US07985806B2

公开(公告)日：2011-07-26

申请号：US12360652

申请日：2009-01-27

申请人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Miyuki Wakao ,  Manabu Ueno

发明人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Miyuki Wakao ,  Manabu Ueno

IPC分类号： C08G77/14 ,  C08L83/06

CPC分类号： C08G77/388 ,  C08L83/08

摘要： An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1≦a+b, and c represents an integer of 0 to 10 wherein, R3 represents an alkylene group of 2 to 12 carbon atoms wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.

摘要翻译： 由式（1）表示的由下述式（1）表示的有机聚硅氧烷和至少在主链的两个末端具有由式（2）表示的（3,5-二缩水甘油基异氰脲基）烷基：其中，每个R 1独立地表示取代或未取代的一价 1〜20个碳原子的烃基，R2为下述式（2）所示的基团，X为下述式（3）表示的基团，a表示0〜100的整数，b表示0以下的整数 至30，条件是1＆nlE; a + b和c表示0至10的整数，其中R 3表示2至12个碳原子的亚烷基，其中R 1和R 2如上所定义，d表示0至 30，e表示0〜30的整数。

公开(公告)号：US06709756B2

公开(公告)日：2004-03-23

申请号：US10151099

申请日：2002-05-21

申请人： Haruyoshi Kuwabara ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Haruyoshi Kuwabara ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： B32B2738

CPC分类号： H01B3/40 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31663

摘要： An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 &mgr;m to 20 &mgr;m and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 &mgr;m and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.

摘要翻译： 液体环氧树脂组合物形式的粘合剂，其包含（A）液体环氧树脂，（B）基于平均粒度大于1μm至20μm的无机填料的整个组成为20至90重量％ 并且含有至多1重量％的粒径为至少45μm的颗粒的一部分，并且任选地，（C）硅氧烷改性树脂适合于将光学元件粘合在光学器件中。

公开(公告)号：US06383659B1

公开(公告)日：2002-05-07

申请号：US09548614

申请日：2000-04-13

申请人： Tsuyoshi Honda ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Tsuyoshi Honda ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： C08G59/3218 ,  C08G59/3254 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/1532 ,  H01L2924/181 ,  Y10T428/12528 ,  Y10T428/31515 ,  C08L2666/14 ,  C08L2666/02 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.

摘要翻译： 一种环氧树脂组合物，其包含含有0-10重量％的2-核化合物和50-100重量％组合并具有高达1.7分散度（Mw / Mn）的3至5个核化合物的环氧树脂， 无机填料，固化催化剂，热塑性树脂和任选的酚醛树脂，并且在未固化状态下具有低于15℃的Tg，有效地形成易于在室温下加工的柔性膜。 由于添加了热塑性树脂，所以组合物避免了当半导体芯片被组合物的未固化膜密封时，膜将失去其原始形状，或者在芯片附近形成夹带的空隙。

公开(公告)号：US06225704B1

公开(公告)日：2001-05-01

申请号：US09499022

申请日：2000-02-07

申请人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： H01L2329

CPC分类号： H01L21/563 ,  H01L23/3185 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512

摘要： A flip-chip type semiconductor device has a semiconductor chip mounted on a substrate via a plurality of bumps. The gap between the substrate and the chip is filled with an underfill material and sealed along sides thereof with a fillet material. The underfill material is a cured epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, having a coefficient of expansion of 20-40 ppm/° C. below its Tg. The fillet material is a similar cured epoxy resin composition having a coefficient of expansion of less than 20 ppm/° C. below its Tg. The device is highly reliable.

摘要翻译： 倒装芯片型半导体器件具有通过多个凸块安装在基板上的半导体芯片。 衬底和芯片之间的间隙填充有底部填充材料，并用圆角材料沿侧面密封。 底部填充材料是包含液体环氧树脂和无机填料的固化环氧树脂组合物，其膨胀系数在其Tg以下为20-40ppm /℃。 圆角材料是类似的固化环氧树脂组合物，其膨胀系数低于Tg的20ppm /℃。 该设备高度可靠。

公开(公告)号：US06512031B1

公开(公告)日：2003-01-28

申请号：US09550287

申请日：2000-04-14

申请人： Tsuyoshi Honda ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Tsuyoshi Honda ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： C08K549

CPC分类号： H01L23/293 ,  C08G59/18 ,  C08G59/56 ,  C08K5/50 ,  C08K9/02 ,  C08L63/00 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/10253 ,  Y10T428/12528 ,  C08L61/04 ,  H01L2924/00

摘要： An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

摘要翻译： 环氧树脂组合物，其包含环氧树脂，用于将环氧树脂聚合成线性聚合物的第一固化剂和用于将线性聚合物交联成三维聚合物的第二固化剂。 使用对应于环氧树脂的直链生长反应和交联反应的两种固化剂将反应条件优化为B阶段，得到具有最小变化的半固化膜。 层压体包括环氧树脂组合物层和保护层。 通过用膜密封半导体芯片，获得了具有改善的耐热性，改进的耐湿性，低应力性能的半导体封装。

公开(公告)号：US06294271B1

公开(公告)日：2001-09-25

申请号：US09499382

申请日：2000-02-07

申请人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/10253 ,  Y10T428/12528 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

摘要翻译： 在包含液体环氧树脂和无机填料的液体环氧树脂组合物中，在环氧树脂中溶解度高达1重量％的特定咪唑化合物，熔点至少为170℃，平均粒径 为1〜5μm，最大粒径为20μm以下的固化促进剂。 所得到的组合物适合作为倒装芯片型半导体器件的密封材料，因为其具有改善的薄膜浸润和储存稳定性。

公开(公告)号：US06506822B2

公开(公告)日：2003-01-14

申请号：US09898026

申请日：2001-07-05

申请人： Nobuhiro Ichiroku ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Nobuhiro Ichiroku ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： C08L6300

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  C08L83/00 ,  H01L2924/00

摘要： An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.

公开(公告)号：US06429238B1

公开(公告)日：2002-08-06

申请号：US09590081

申请日：2000-06-09

申请人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： C08K53445

CPC分类号： H01L24/31 ,  C08G59/686 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  C08L83/00 ,  H01L2924/3512 ,  H01L2924/00

摘要： Blended in a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler are a specific imidazole compound as a curing accelerator and an amino group-containing, polyether-modified polysiloxane. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.

摘要翻译： 包含液体环氧树脂和无机填料的液体环氧树脂组合物是作为固化促进剂和含氨基的聚醚改性聚硅氧烷的特定的咪唑化合物。 所得到的组合物适合作为倒装芯片型半导体器件的密封材料，因为其具有改善的薄膜浸润和储存稳定性。