公开(公告)号：US20050087803A1

公开(公告)日：2005-04-28

申请号：US10997127

申请日：2004-11-24

申请人： Yoshihiro Hara ,  Akira Asai ,  Gaku Sugahara ,  Haruyuki Sorada ,  Teruhito Ohnishi

发明人： Yoshihiro Hara ,  Akira Asai ,  Gaku Sugahara ,  Haruyuki Sorada ,  Teruhito Ohnishi

IPC分类号： H01L21/762 ,  H01L21/8234 ,  H01L29/10 ,  H01L27/01 ,  H01L27/12 ,  H01L29/06 ,  H01L29/76 ,  H01L31/062

CPC分类号： H01L29/1054 ,  H01L21/76224 ,  H01L21/823481 ,  Y10S438/933

摘要： On an Si substrate 1, a buffer layer 2, a SiGe layer 3, and an Si cap layer 4 are formed. A mask is formed on the substrate, and then the substrate is patterned. In this manner, a trench 7a is formed so as to reach the Si substrate 1 and have the side faces of the SiGe layer 3 exposed. Then, the surface of the trench 7a is subjected to heat treatment for one hour at 750° C. so that Ge contained in a surface portion of the SiGe layer 3 is evaporated. Thus, a Ge evaporated portion 8 having a lower Ge content than that of other part of the SiGe layer 3 is formed in part of the SiGe layer 3 exposed at part of the trench 7a. Thereafter, the walls of the trench 7a are oxidized.

摘要翻译： 在Si衬底1上形成缓冲层2，SiGe层3和Si覆盖层4。 在基板上形成掩模，然后对基板进行图案化。 以这种方式，形成沟槽7a以到达Si衬底1并且暴露SiGe层3的侧面。 然后，将沟槽7a的表面在750℃下进行1小时的热处理，使得包含在SiGe层3的表面部分中的Ge蒸发。 因此，在沟槽7a的一部分暴露的SiGe层3的一部分，形成Ge含量低于SiGe层3的Ge含量低的Ge蒸发部分8。 此后，沟槽7a的壁被氧化。

公开(公告)号：US06861316B2

公开(公告)日：2005-03-01

申请号：US10637212

申请日：2003-08-08

申请人： Yoshihiro Hara ,  Akira Asai ,  Gaku Sugahara ,  Haruyuki Sorada ,  Teruhito Ohnishi

发明人： Yoshihiro Hara ,  Akira Asai ,  Gaku Sugahara ,  Haruyuki Sorada ,  Teruhito Ohnishi

IPC分类号： H01L21/762 ,  H01L21/8234 ,  H01L29/10 ,  H01L21/336

CPC分类号： H01L29/1054 ,  H01L21/76224 ,  H01L21/823481 ,  Y10S438/933

摘要： On an Si substrate 1, a buffer layer 2, a SiGe layer 3, and an Si cap layer 4 are formed. A mask is formed on the substrate, and then the substrate is patterned. In this manner, a trench 7a is formed so as to reach the Si substrate 1 and have the side faces of the SiGe layer 3 exposed. Then, the surface of the trench 7a is subjected to heat treatment for one hour at 750° C. so that Ge contained in a surface portion of the SiGe layer 3 is evaporated. Thus, a Ge evaporated portion 8 having a lower Ge content than that of other part of the SiGe layer 3 is formed in part of the SiGe layer 3 exposed at part of the trench 7a. Thereafter, the walls of the trench 7a are oxidized.

摘要翻译： 在Si衬底1上形成缓冲层2，SiGe层3和Si覆盖层4。 在基板上形成掩模，然后对基板进行图案化。 以这种方式，形成沟槽7a以到达Si衬底1并且暴露SiGe层3的侧面。 然后，将沟槽7a的表面在750℃下进行1小时的热处理，使得包含在SiGe层3的表面部分中的Ge蒸发。 因此，在沟槽7a的一部分暴露的SiGe层3的一部分，形成Ge含量低于SiGe层3的Ge含量低的Ge蒸镀部8。 此后，沟槽7a的壁被氧化。

公开(公告)号：US07145168B2

公开(公告)日：2006-12-05

申请号：US10997127

申请日：2004-11-24

申请人： Yoshihiro Hara ,  Akira Asai ,  Gaku Sugahara ,  Haruyuki Sorada ,  Teruhito Ohnishi

发明人： Yoshihiro Hara ,  Akira Asai ,  Gaku Sugahara ,  Haruyuki Sorada ,  Teruhito Ohnishi

IPC分类号： H01L29/06 ,  H01L31/0328 ,  H01L31/0336 ,  H01L31/072 ,  H01L31/109

CPC分类号： H01L29/1054 ,  H01L21/76224 ,  H01L21/823481 ,  Y10S438/933

摘要： On an Si substrate 1, a buffer layer 2, a SiGe layer 3, and an Si cap layer 4 are formed. A mask is formed on the substrate, and then the substrate is patterned. In this manner, a trench 7a is formed so as to reach the Si substrate 1 and have the side faces of the SiGe layer 3 exposed. Then, the surface of the trench 7a is subjected to heat treatment for one hour at 750° C. so that Ge contained in a surface portion of the SiGe layer 3 is evaporated. Thus, a Ge evaporated portion 8 having a lower Ge content than that of other part of the SiGe layer 3 is formed in part of the SiGe layer 3 exposed at part of the trench 7a. Thereafter, the walls of the trench 7a are oxidized.

摘要翻译： 在Si衬底1上形成缓冲层2，SiGe层3和Si覆盖层4。 在基板上形成掩模，然后对基板进行图案化。 以这种方式，形成沟槽7a以到达Si衬底1并且暴露SiGe层3的侧面。 然后，将沟槽7a的表面在750℃下进行1小时的热处理，使得包含在SiGe层3的表面部分中的Ge蒸发。 因此，在沟槽7a的一部分暴露的SiGe层3的一部分，形成Ge含量低于SiGe层3的Ge含量低的Ge蒸发部分8。 此后，沟槽7a的壁被氧化。

公开(公告)号：US06917075B2

公开(公告)日：2005-07-12

申请号：US10752409

申请日：2004-01-07

申请人： Akira Inoue ,  Akira Asai ,  Teruhito Ohnishi ,  Haruyuki Sorada ,  Yoshihiro Hara ,  Takeshi Takagi

发明人： Akira Inoue ,  Akira Asai ,  Teruhito Ohnishi ,  Haruyuki Sorada ,  Yoshihiro Hara ,  Takeshi Takagi

IPC分类号： H01L21/336 ,  H01L21/768 ,  H01L29/78 ,  H01L29/786 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/66772 ,  H01L21/76895 ,  H01L29/783 ,  H01L29/78615 ,  H01L29/78621

摘要： A semiconductor device and a method of fabricating the same according to this invention are such that: a gate insulator is formed over a predetermined region of a semiconductor substrate; a gate electrode is formed on the gate insulator; source and drain regions respectively formed in portions of the predetermined region that are situated on both sides of the gate electrode in plan view; a body region formed by a region of the predetermined region exclusive of the source and drain regions; and a contact electrically interconnecting the gate electrode and the body region, wherein a portion of the contact which is connected to the gate electrode is formed to intersect the gate electrode in plan view.

摘要翻译： 根据本发明的半导体器件及其制造方法是：在半导体衬底的预定区域上形成栅极绝缘体; 栅电极形成在栅极绝缘体上; 源极和漏极区域分别形成在预定区域的位于栅极电极的两侧的部分中; 由不同于所述源极和漏极区域的所述预定区域的区域形成的体区; 以及使所述栅电极和所述体区域电连接的触点，其中，与所述栅电极连接的所述触点的一部分在平面图中形成为与所述栅电极相交。

公开(公告)号：US06399993B1

公开(公告)日：2002-06-04

申请号：US09786551

申请日：2001-03-07

申请人： Teruhito Ohnishi ,  Akira Asai ,  Takeshi Takagi ,  Tohru Saitoh ,  Yo Ichikawa ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Koji Katayama ,  Yoshihiko Kanzawa

发明人： Teruhito Ohnishi ,  Akira Asai ,  Takeshi Takagi ,  Tohru Saitoh ,  Yo Ichikawa ,  Yoshihiro Hara ,  Koichiro Yuki ,  Katsuya Nozawa ,  Koji Katayama ,  Yoshihiko Kanzawa

IPC分类号： H01L2972

CPC分类号： H01L21/76237 ,  H01L21/8249

摘要： In a bipolar transistor block, a base layer (20a) of SiGe single crystals and an emitter layer (26) of almost 100% of Si single crystals are stacked in this order over a collector diffused layer (9). Over both edges of the base layer (20a), a base undercoat insulating film (5a) and base extended electrodes (22) made of polysilicon are provided. The base layer (20a) has a peripheral portion with a thickness equal to that of the base undercoat insulating film (5a) and a center portion thicker than the peripheral portion. The base undercoat insulating film (5a) and gate insulating films (5b and 5c) for a CMOS block are made of the same oxide film. A stress resulting from a difference in thermal expansion coefficient between the SiGe layer as the base layer and the base undercoat insulating film 5a can be reduced, and a highly reliable BiCMOS device is realized.

摘要翻译： 在双极晶体管块中，SiGe单晶的基极层（20a）和几乎100％的Si单晶的发射极层（26）依次层叠在集电极扩散层（9）上。 在基底层（20a）的两个边缘上设置有由多晶硅制成的基底底涂层绝缘膜（5a）和基底延伸电极（22）。 基底层（20a）具有与基底底涂层绝缘膜（5a）的厚度相等的周边部分和比周边部分厚的中心部分。 用于CMOS块的基底涂层绝缘膜（5a）和栅极绝缘膜（5b和5c）由相同的氧化物膜制成。 由于作为基底层的SiGe层与基底底涂层绝缘膜5a之间的热膨胀系数的差异导致的应力可以降低，并且实现了高可靠性的BiCMOS器件。

公开(公告)号：US07235830B2

公开(公告)日：2007-06-26

申请号：US11260197

申请日：2005-10-28

申请人： Haruyuki Sorada ,  Takeshi Takagi ,  Akira Asai ,  Akira Inoue

发明人： Haruyuki Sorada ,  Takeshi Takagi ,  Akira Asai ,  Akira Inoue

IPC分类号： H01L29/76

CPC分类号： H01L29/78696 ,  H01L21/76264 ,  H01L21/76281 ,  H01L29/1054 ,  H01L29/66742 ,  H01L29/78687 ,  Y10S438/933 ,  Y10S438/938

摘要： The present invention provides a semiconductor device comprising: a semiconductor layer (3); a gate electrode (11) formed on the semiconductor layer (3) via a gate insulation film (10); and a first insulation film (13) formed at one or more of sidewalls of the semiconductor layer (3), the gate insulation film (10) and the gate electrode (11); wherein the first insulation film (13) overlies a part of the gate insulation film (10) surface. According to the semiconductor device, leakage current at the isolation edge can be suppressed and thus reliability can be improved.

摘要翻译： 本发明提供一种半导体器件，包括：半导体层（3）; 经由栅极绝缘膜（10）形成在所述半导体层（3）上的栅电极（11）; 以及形成在所述半导体层（3），所述栅极绝缘膜（10）和所述栅电极（11）的侧壁的一个或多个的第一绝缘膜（13）。 其中所述第一绝缘膜（13）覆盖所述栅极绝缘膜（10）表面的一部分。 根据半导体装置，可以抑制隔离边缘处的漏电流，从而可以提高可靠性。

公开(公告)号：US20050040436A1

公开(公告)日：2005-02-24

申请号：US10866093

申请日：2004-06-14

申请人： Haruyuki Sorada ,  Akira Asai ,  Takeshi Takagi ,  Akira Inoue ,  Yoshio Kawashima

发明人： Haruyuki Sorada ,  Akira Asai ,  Takeshi Takagi ,  Akira Inoue ,  Yoshio Kawashima

IPC分类号： H01L21/8238 ,  H01L27/10

CPC分类号： H01L21/823807

摘要： A semiconductor integrated circuit fabrication method according to this invention includes: a step of forming a pair of first device forming regions and a pair of second device forming regions in a surface layer portion of a semiconductor substrate by surrounding each of the regions by device isolation; a step of forming a first oxide film covering the surface of the semiconductor substrate after the preceding step; a step of removing an intended portion of the first oxide film to expose the pair of second device forming regions; a step of forming a pair of heterojunction structures, by selective epitaxial growth, on the pair of second device forming regions thus exposed; a step of forming a second oxide film covering the surface of the substrate after the preceding step; and a step of forming a pair of gate electrodes above each of the pair of first device forming regions and the pair of second device forming regions, whereby a normal complementary MOS transistor and a heterojunction complementary MOS transistor are eventually formed in the pair of first device forming regions and the pair of second device forming regions, respectively.

摘要翻译： 根据本发明的半导体集成电路制造方法包括：通过器件隔离来围绕每个区域来在半导体衬底的表面层部分中形成一对第一器件形成区域和一对第二器件形成区域的步骤; 在前述步骤之后形成覆盖半导体衬底的表面的第一氧化物膜的步骤; 去除所述第一氧化物膜的预期部分以暴露所述一对第二器件形成区域的步骤; 通过选择性外延生长形成一对异质结结构在由此露出的一对第二器件形成区上的步骤; 在上述步骤之后形成覆盖基板表面的第二氧化膜的步骤; 以及在所述一对第一器件形成区域和所述一对第二器件形成区域中的每一个上形成一对栅电极的步骤，由此在所述一对第一器件形成区域中最终形成正常互补MOS晶体管和异质结互补MOS晶体管 形成区域和一对第二装置形成区域。

公开(公告)号：US07564073B2

公开(公告)日：2009-07-21

申请号：US11294566

申请日：2005-12-06

申请人： Haruyuki Sorada ,  Akira Asai ,  Takeshi Takagi ,  Akira Inoue ,  Yoshio Kawashima

发明人： Haruyuki Sorada ,  Akira Asai ,  Takeshi Takagi ,  Akira Inoue ,  Yoshio Kawashima

IPC分类号： H01L27/04

CPC分类号： H01L21/823807

摘要： A semiconductor integrated circuit fabrication method according to this invention includes: a step of forming a pair of first device forming regions and a pair of second device forming regions in a surface layer portion of a semiconductor substrate by surrounding each of the regions by device isolation; a step of forming a first oxide film covering the surface of the semiconductor substrate after the preceding step; a step of removing an intended portion of the first oxide film to expose the pair of second device forming regions; a step of forming a pair of heterojunction structures, by selective epitaxial growth, on the pair of second device forming regions thus exposed; a step of forming a second oxide film covering the surface of the substrate after the preceding step; and a step of forming a pair of gate electrodes above each of the pair of first device forming regions and the pair of second device forming regions, whereby a normal complementary MOS transistor and a heterojunction complementary MOS transistor are eventually formed in the pair of first device forming regions and the pair of second device forming regions, respectively.

摘要翻译： 根据本发明的半导体集成电路制造方法包括：通过器件隔离来围绕每个区域来在半导体衬底的表面层部分中形成一对第一器件形成区域和一对第二器件形成区域的步骤; 在前述步骤之后形成覆盖半导体衬底的表面的第一氧化物膜的步骤; 去除所述第一氧化物膜的预期部分以暴露所述一对第二器件形成区域的步骤; 通过选择性外延生长形成一对异质结结构在由此露出的一对第二器件形成区上的步骤; 在上述步骤之后形成覆盖基板表面的第二氧化膜的步骤; 以及在所述一对第一器件形成区域和所述一对第二器件形成区域中的每一个上形成一对栅电极的步骤，由此在所述一对第一器件形成区域中最终形成正常互补MOS晶体管和异质结互补MOS晶体管 形成区域和一对第二装置形成区域。

公开(公告)号：US20070052041A1

公开(公告)日：2007-03-08

申请号：US10558671

申请日：2004-05-31

申请人： Haruyuki Sorada ,  Takeshi Takagi ,  Akira Asai ,  Yoshihiko Kanzawa ,  Kouji Katayama ,  Junko Iwanaga

发明人： Haruyuki Sorada ,  Takeshi Takagi ,  Akira Asai ,  Yoshihiko Kanzawa ,  Kouji Katayama ,  Junko Iwanaga

IPC分类号： H01L29/94

CPC分类号： H01L29/785 ,  H01L29/66795 ,  H01L29/78687

摘要： A semiconductor device according to this invention includes: a first insulating layer (11); a first body section (13) including an island-shaped semiconductor formed on the first insulating layer; a second body section (14) including an island-shaped semiconductor formed on the first insulating layer; a ridge-shaped connecting section (15) formed on the first insulating layer to interconnect the first body section and the second body section; a channel region (15a) formed by at least a part of the connecting section in lengthwise direction of the connecting section; a gate electrode (18) formed to cover a periphery of the channel region, with a second insulating layer intervening therebetween; a source region formed to extend over the first body section and a portion of the connecting section between the first body section and the channel region; and a drain region formed to extend over the second body section and a portion of the connecting section between the second body section and the channel region, wherein a semiconductor forming the channel region has a lattice strain.

摘要翻译： 根据本发明的半导体器件包括：第一绝缘层（11）; 第一主体部分（13），其包括形成在所述第一绝缘层上的岛状半导体; 包括形成在所述第一绝缘层上的岛状半导体的第二主体部分（14） 形成在第一绝缘层上以互连第一主体部分和第二主体部分的脊形连接部分（15）; 由所述连接部的至少一部分在所述连接部的长度方向上形成的通路区域（15a） 形成为覆盖沟道区域的周边的栅极电极（18），其间插入有第二绝缘层; 形成为在第一主体部分上延伸的源极区域和在第一主体部分和沟道区域之间的连接部分的一部分; 以及形成为在第二主体部分上延伸的漏极区域和在第二主体部分和沟道区域之间的连接部分的一部分，其中形成沟道区域的半导体具有晶格应变。

公开(公告)号：US20060054944A1

公开(公告)日：2006-03-16

申请号：US11260197

申请日：2005-10-28

申请人： Haruyuki Sorada ,  Takeshi Takagi ,  Akira Asai ,  Akira Inoue

发明人： Haruyuki Sorada ,  Takeshi Takagi ,  Akira Asai ,  Akira Inoue

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/78696 ,  H01L21/76264 ,  H01L21/76281 ,  H01L29/1054 ,  H01L29/66742 ,  H01L29/78687 ,  Y10S438/933 ,  Y10S438/938

摘要： The present invention provides a semiconductor device comprising: a semiconductor layer (3); a gate electrode (11) formed on the semiconductor layer (3) via a gate insulation film (10); and a first insulation film (13) formed at one or more of sidewalls of the semiconductor layer (3), the gate insulation film (10) and the gate electrode (11); wherein the first insulation film (13) overlies a part of the gate insulation film (10) surface. According to the semiconductor device, leakage current at the isolation edge can be suppressed and thus reliability can be improved.

摘要翻译： 本发明提供一种半导体器件，包括：半导体层（3）; 经由栅极绝缘膜（10）形成在所述半导体层（3）上的栅电极（11）; 以及形成在所述半导体层（3），所述栅极绝缘膜（10）和所述栅电极（11）的侧壁的一个或多个的第一绝缘膜（13）。 其中所述第一绝缘膜（13）覆盖所述栅极绝缘膜（10）表面的一部分。 根据半导体装置，可以抑制隔离边缘处的漏电流，从而可以提高可靠性。