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公开(公告)号:US5976703A
公开(公告)日:1999-11-02
申请号:US662233
申请日:1996-06-14
申请人: Yoshihiro Nakata , Shyun-ichi Fukuyama , Michiko Katayama , Joe Yamaguchi , Hideki Harada , Yoshiyuki Ohkura
发明人: Yoshihiro Nakata , Shyun-ichi Fukuyama , Michiko Katayama , Joe Yamaguchi , Hideki Harada , Yoshiyuki Ohkura
IPC分类号: C08G77/52 , C08G77/48 , C08L83/14 , H01L21/3205 , H01L21/48 , H01L21/768 , H01L23/498 , H05K1/00 , H05K3/46 , B32B9/04
CPC分类号: H01L21/481 , C08L83/14 , H01L23/49894 , H01L2924/0002 , H05K3/4676 , Y10S428/901 , Y10T428/31663
摘要: A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.
摘要翻译: 提供了用于平面化基板的不平坦表面的材料和方法,例如用于制造布线板和电子设备并且在其表面上具有宽图案的那些的不平坦表面的方法。 该材料是聚苯基苯基硅氧烷或聚苯基苯基硅氧烷与有机硅氧烷的共聚物,并施加到基板的不平坦表面上,然后加热回流以形成平坦化的膜或层。 该材料允许将宽度高达几百微米的布线的基板平坦化。
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公开(公告)号:US5746927A
公开(公告)日:1998-05-05
申请号:US762882
申请日:1996-12-12
申请人: Kaoru Hashimoto , Tatuo Chiyonobu , Kyoichiro Kawano , Koji Watanabe , Masato Wakamura , Joe Yamaguchi
发明人: Kaoru Hashimoto , Tatuo Chiyonobu , Kyoichiro Kawano , Koji Watanabe , Masato Wakamura , Joe Yamaguchi
IPC分类号: H01L23/498 , H05K3/34 , B44C1/22
CPC分类号: H05K3/3452 , H01L23/49811 , H01L23/49866 , H05K3/3463 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3025 , H05K2201/0373 , H05K2201/09863 , H05K2201/10984 , H05K2203/0594 , H05K2203/1105
摘要: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
摘要翻译: 一种电连接装置,包括在其上设置有输入/输出端子的第一电路板,每个端子具有涂覆有镓的尖端表面和在其上设置有接触端子的第二电路板,每个端子具有涂覆有铟的尖端表面 或锡。 当第一电路板的输入/输出端子与第二电路板的各个端子接触时,通过镓和铟或锡之间的相互作用形成低熔点合金层,并且端子电连接到 彼此。 第二金属层包括大致垂直于端子表面延伸的多个线状金属支撑体和由线状金属支撑体保持的低熔点金属。
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公开(公告)号:US5610371A
公开(公告)日:1997-03-11
申请号:US403678
申请日:1995-03-14
申请人: Kaoru Hashimoto , Tatuo Chiyonobu , Kyoichiro Kawano , Koji Watanabe , Masato Wakamura , Joe Yamaguchi
发明人: Kaoru Hashimoto , Tatuo Chiyonobu , Kyoichiro Kawano , Koji Watanabe , Masato Wakamura , Joe Yamaguchi
IPC分类号: H01L23/498 , H05K3/34 , H05K1/18
CPC分类号: H05K3/3452 , H01L23/49811 , H01L23/49866 , H05K3/3463 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3025 , H05K2201/0373 , H05K2201/09863 , H05K2201/10984 , H05K2203/0594 , H05K2203/1105
摘要: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
摘要翻译: 一种电连接装置,包括在其上设置有输入/输出端子的第一电路板,每个端子具有涂覆有镓的尖端表面和在其上设置有接触端子的第二电路板,每个端子具有涂覆有铟的尖端表面 或锡。 当第一电路板的输入/输出端子与第二电路板的各个端子接触时,通过镓和铟或锡之间的相互作用形成低熔点合金层,并且端子电连接到 彼此。 第二金属层包括大致垂直于端子表面延伸的多个线状金属支撑体和由线状金属支撑体保持的低熔点金属。
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