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    Photoresist polymeric compound and photoresist resin composition
    1.
    发明授权
    Photoresist polymeric compound and photoresist resin composition 有权
    光阻聚合物和光致抗蚀剂树脂组合物

    公开(公告)号：US06692889B1

    公开(公告)日：2004-02-17

    申请号：US09806857

    申请日：2001-04-05

    申请人： Yoshinori Funaki ,  Kiyoharu Tsutsumi ,  Akira Takaragi ,  Keizo Inoue

    发明人： Yoshinori Funaki ,  Kiyoharu Tsutsumi ,  Akira Takaragi ,  Keizo Inoue

    IPC分类号： G03F7004

    CPC分类号： G03F7/0392 ,  G03F7/0045 ,  G03F7/021 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/039 ,  G03F7/0397 ,  G03F7/164 ,  Y10S430/106

    摘要： A polymeric compound of the invention includes at least one monomer unit selected from the following formulae (I), (II), (III) and (IV): (wherein R1 is a hydrogen atom or a methyl group, R2 and R3 are each a hydrogen atom, a hydroxyl group or a —COOR4 group, where R4 is, e.g., a t-butyl group or a 2-tetrahydropyranyl group; R5 and R6 are each a hydrogen atom, a hydroxyl group or an oxo group; R7, R8 and R9 are each a hydrogen atom or a methyl group; R10 and R11 are each a hydrocarbon group having 1 to 8 carbon atoms; R12, R13 and R14 are each a hydrogen atom, a hydroxyl group or a methyl group, where if all of R12 to R14 are each a hydrogen atom or a hydroxyl group, R10 and R11 are not coincidentally methyl groups) [wherein, when the compound includes, for example, a monomer unit of Formula (III), the compound further includes at least one monomer unit selected from among, for example, a monomer unit represented by the following Formula (V): (wherein R15 and R16 are each a hydrogen atom, a hydroxyl group or a carboxyl group; R17 is a hydroxyl group, an oxo group or a carboxyl group; and R1 has the same meaning as defined above)]. This polymeric compound has high etching resistance, as well as satisfactory transparency, alkali-solubility and adhesion, and is therefore useful as a photoresist resin.

    摘要翻译： 本发明的高分子化合物包括至少一种选自下式（I），（II），（III）和（IV）的单体单元:(其中R 1是氢原子或甲基， 2>和R 3各自为氢原子，羟基或-COOR 4基团，其中R 4为例如叔丁基或2-四氢吡喃基; R 5为氢原子， R 6和R 6各自为氢原子，羟基或氧代基; R 7，R 8和R 9各自为氢原子或甲基; R 10和R 8为氢原子， 11>各自为具有1至8个碳原子的烃基; R 12，R 13和R 14各自为氢原子，羟基或甲基，其中如果全部R 12， 至R 14各自为氢原子或羟基，R 10和R 11不是甲基），其中，当该化合物包括例如式（III）的单体单元时， 该化合物还包括至少一种单体单元，其选自例如由下式（V）表示的单体单元:(其中 R 15和R 16各自为氢原子，羟基或羧基; R 17是羟基，氧代基或羧基; 和R 1具有与上述相同的含义]]。 该高分子化合物具有高耐蚀刻性，以及令人满意的透明度，碱溶性和粘附性，因此可用作光致抗蚀剂树脂。

    Polymeric compound and resin composition for photoresist
    2.
    发明授权
    Polymeric compound and resin composition for photoresist 有权
    用于光致抗蚀剂的聚合物和树脂组合物

    公开(公告)号：US06440636B1

    公开(公告)日：2002-08-27

    申请号：US09703677

    申请日：2000-11-02

    申请人： Toru Ushirogouchi ,  Takeshi Okino ,  Koji Asakawa ,  Naomi Shida ,  Yoshinori Funaki ,  Kiyoharu Tsutsumi ,  Akira Takaragi ,  Keizo Inoue

    发明人： Toru Ushirogouchi ,  Takeshi Okino ,  Koji Asakawa ,  Naomi Shida ,  Yoshinori Funaki ,  Kiyoharu Tsutsumi ,  Akira Takaragi ,  Keizo Inoue

    IPC分类号： G03F7004

    CPC分类号： G03F7/0397 ,  C08F20/18 ,  C08F20/30

    摘要： A polymeric compound includes at least one monomeric unit of the following formula (I): wherein R1 is a hydrogen atom or a methyl group; and each of R2 and R3 is independently a hydrogen atom or a hydroxyl group. The polymeric compound may include the monomeric unit and at least one monomeric unit selected from monomeric units represented by the following formulae (IIa) and (IIb): wherein R1 is a hydrogen atom or a methyl group; each of R4 and R5 is, for example, a hydrogen atom, a hydroxyl group, an oxo group, or a carboxyl group, wherein R4 and R5 are not concurrently hydrogen atoms; and each of R7 and R8 is independently a hydrogen atom, a hydroxyl group, or an oxo group. The polymeric compound have a high etching resistance in addition to satisfactory transparency, alkali-solubility, and adhesion.

    摘要翻译： 聚合化合物包括至少一种下式（I）的单体单元：其中R1是氢原子或甲基; R2和R3各自独立地为氢原子或羟基。 聚合化合物可以包括单体单元和选自下式（IIa）和（IIb）表示的单体单元的至少一种单体单元：其中R 1是氢原子或甲基; R4和R5各自为例如氢原子，羟基，氧代基或羧基，其中R4和R5不同时为氢原子; R 7和R 8各自独立地为氢原子，羟基或氧代基。 除了令人满意的透明性，碱溶性和粘合性之外，高分子化合物具有高的耐蚀刻性。

    Thin-film materials, thin films and producing method thereof
    5.
    发明申请
    Thin-film materials, thin films and producing method thereof 审中-公开
    薄膜材料，薄膜及其制造方法

    公开(公告)号：US20090004508A1

    公开(公告)日：2009-01-01

    申请号：US12155750

    申请日：2008-06-09

    申请人： Yoshinori Funaki ,  Ryo Itaya ,  Akira Takaragi ,  Kazuki Okamoto ,  Mayumi Torieda

    发明人： Yoshinori Funaki ,  Ryo Itaya ,  Akira Takaragi ,  Kazuki Okamoto ,  Mayumi Torieda

    IPC分类号： B32B9/00 ,  C08G73/06 ,  C07D235/04 ,  C07D498/04 ,  B05D3/02 ,  C07D497/00 ,  C08L39/00

    CPC分类号： H01L21/02118 ,  C07D235/18 ,  C07D235/20 ,  C08G61/123 ,  C08G73/18 ,  C08J5/18 ,  C08J2365/00 ,  C08J2379/04 ,  C09D165/00 ,  C09D179/04 ,  H01B3/303 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： An N-substituted benzimidazole-containing bridged alicyclic compound is provided. The compound is represented by following Formula (1-1): In the formula, Z3 represents a bridged alicyclic skeleton; Y11 represents a single bond or a divalent organic group; Y2 represents a single bond or a di- or tri-valent organic group; X3 represents a hydrogen atom or a reactive functional group; Ra represents a hydrogen atom or a hydrocarbon group; A3 represents a group represented by one of following Formulae (a) and (b): wherein R10 represents a monovalent organic group, wherein, in each of Formulae (a) and (b), the left side is to be bonded to Y11, and the right side is to be bonded to Y2; “n4” denotes an integer of 2 to 7; “m3” denotes an integer of 0 to 5; and “k2” denotes an integer of 0 to 2, wherein the total of “n4” and “m3” equals 2 to 7, and wherein two or more Y11s, Y2s, X3s, A3s, and R10s per molecule, and two or more X3s and Ras, if present per molecule, may be the same as or different from one another, respectively.

    摘要翻译： 提供含N-取代苯并咪唑的桥联脂环族化合物。 该化合物由下式（1-1）表示：式中Z 3表示桥连的脂环骨架; Y 11表示单键或二价有机基团; Y2表示单键或二价或三价有机基团; X3表示氢原子或反应性官能团; Ra表示氢原子或烃基; A3表示由以下式（a）和（b）中的一个表示的基团：其中R 10表示一价有机基团，其中在式（a）和（b）中的每一个中，左侧将与Y 11键合， 右侧要连接到Y2; “n4”表示2〜7的整数， “m3”表示0〜5的整数， 和“k2”表示0〜2的整数，其中“n4”和“m3”的总和等于2〜7，并且其中每个分子中的两个或更多个Y 11，Y 1，X 3，A 3和R 10，以及两个或更多个 如果每个分子存在，则X3和Ras可以分别彼此相同或不同。

    Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films
    6.
    发明申请
    Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films 审中-公开
    预聚物，预聚物组合物，具有孔结构的高分子量聚合物和介电膜

    公开(公告)号：US20070078256A1

    公开(公告)日：2007-04-05

    申请号：US10577311

    申请日：2004-10-20

    申请人： Akira Takaragi ,  Yoshinori Funaki ,  Jiichiro Hashimoto

    发明人： Akira Takaragi ,  Yoshinori Funaki ,  Jiichiro Hashimoto

    IPC分类号： C08G63/02 ,  C08G69/08

    CPC分类号： C08G73/22 ,  C07C251/08 ,  C07C251/18 ,  C07C251/20 ,  C07C2601/14 ,  C08G69/00 ,  C08G73/10 ,  C08G73/18 ,  C08G85/00

    摘要： A prepolymer is a reaction product of a compound A and a compound B, in which the compounds A and B each have two or more functional groups or sets of functional groups in one molecule and are capable of undergoing polymerization as a result of binding of the functional groups or sets of functional groups of one compound with the functional groups or sets of functional groups of the other compound to thereby form a high-molecular-weight polymer with a porous structure. The prepolymer has a weight-average molecular weight of about 200 to about 100000. The functional groups or sets of functional groups of the compound A are preferably each a carboxyl group or an amino group, and the functional groups or sets of functional groups of the compound B are preferably two amino groups, an amino group and a hydroxyl group, an amino group and a mercapto group, or two carboxyl groups.

    摘要翻译： 预聚物是化合物A和化合物B的反应产物，其中化合物A和B各自在一个分子中具有两个或更多个官能团或一组官能团，并且由于 一个化合物的官能团或一组官能团与其它化合物的官能团或一组官能团组成，从而形成具有多孔结构的高分子量聚合物。 预聚物的重均分子量为约200〜约100000.化合物A的官能团或官能团的官能团优选为羧基或氨基， 化合物B优选为两个氨基，氨基和羟基，氨基和巯基，或两个羧基。

    PHOTOSEMICONDUCTOR PROTECTIVE MATERIAL AND PRECURSOR THEREOF, AND PROCESS FOR PRODUCING PHOTOSEMICONDUCTOR PROTECTIVE MATERIAL
    7.
    发明申请
    PHOTOSEMICONDUCTOR PROTECTIVE MATERIAL AND PRECURSOR THEREOF, AND PROCESS FOR PRODUCING PHOTOSEMICONDUCTOR PROTECTIVE MATERIAL 审中-公开
    光致抗蚀剂保护材料及其前体及其制备光致抗蚀剂保护材料的方法

    公开(公告)号：US20130102734A1

    公开(公告)日：2013-04-25

    申请号：US13640967

    申请日：2011-04-13

    申请人： Akira Takaragi ,  Takahiro Iwahama ,  Takahiro Tei ,  Ryuta Tomoyose

    发明人： Akira Takaragi ,  Takahiro Iwahama ,  Takahiro Tei ,  Ryuta Tomoyose

    IPC分类号： H01L31/0203

    CPC分类号： H01L31/0203 ,  B32B2457/12 ,  C08F4/65908 ,  C08F4/65912 ,  C08F4/65925 ,  C08F210/02 ,  C08F230/08 ,  C08F232/08 ,  H01L31/0481 ,  H01L33/56 ,  H01L2933/005 ,  Y02E10/50 ,  C08F4/645

    摘要： A photosemiconductor protective material comprising a chain olefin-cyclic olefin copolymer elastomer composed of a chain olefin and a cyclic olefin as polymerizable components is prepared. The elastomer may comprise an α-chain C2-4olefin and a polycyclic olefin as polymerizable components, and the molar ratio of the α-chain C2-4olefin relative to the polycyclic olefin may be 80/20 to 99/1 in a ratio of the α-chain C2-4olefin/the polycyclic olefin. The photosemiconductor protective material may further contain an organic silicon compound having a hydrolytically condensable group. The organic silicon compound may be a silane coupling agent having a (meth)acryloyl group. A photosemiconductor protective material 1 as the protective material is suitable as a solar cell encapsulant or filler 3 for encapsulating a solar cell 4. The photosemiconductor protective material has a high transparency and a high weather resistance and a proper elasticity and effectively protects a photosemiconductor.

    摘要翻译： 制备包含由链烯烃和环状烯烃组成的链烯烃 - 环烯烃共聚物弹性体作为可聚合组分的光半导体保护材料。 弹性体可以包含α-链C2-4烯烃和多环烯烃作为可聚合组分，并且α-链C2-4烯烃相对于多环烯烃的摩尔比可以为80/20至99/1，比例为 α-链C2-4烯烃/多环烯烃。 光半导体保护材料还可以含有具有水解缩合基团的有机硅化合物。 有机硅化合物可以是具有（甲基）丙烯酰基的硅烷偶联剂。 作为保护材料的光半导体保护材料1适合作为用于封装太阳能电池4的太阳能电池密封剂或填料3.光半导体保护材料具有高透明度，高耐候性和适当的弹性，并有效地保护光半导体。